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4604644 | Beckham et al. | Aug 1986 | |
5084961 | Yoshikawa | Feb 1992 | |
5089440 | Christie et al. | Feb 1992 | |
5121190 | Hsiao et al. | Jun 1992 | |
5194930 | Papathomas et al. | Mar 1993 | |
5274913 | Grebe et al. | Jan 1994 | |
5400950 | Myers et al. | Mar 1995 | |
5542601 | Fallon et al. | Aug 1996 | |
5578525 | Mizukoshi | Nov 1996 | |
5615477 | Sweitzer | Apr 1997 | |
5704116 | Gamota et al. | Jan 1998 | |
5710071 | Beddingfield et al. | Jan 1998 |
Entry |
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Research Disclosure, Jul. 1993 #35133 UV Light Erasable Flip Chip Packaging Technique. |
D.R. Gamota et al., Advanced Encapsulant Materials Systems for Flip-Chip-on-Board Assemblies: I. Encapsulant Materials with Improved Manufacturing Properties II. Materials to Integrate the Reflow and Underfilling Process, IEEE/CPMT Int'l Electronics Manufacturing Technology Symposium (1996), pp. 1-9. |