Darrell G. Hill

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Transistor with dielectric spacers and field plate and method of fa...
- Patent number 12,369,380
- Issue date Jul 22, 2025
- NXP USA, INC.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via (TSV) validation structure for an integrated...
- Patent number 12,334,416
- Issue date Jun 17, 2025
- NXP USA, INC.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with dielectric spacers and method of fabrication therefor
- Patent number 12,266,713
- Issue date Apr 1, 2025
- NXP USA, INC.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit die with isolation test structure
- Patent number 12,211,759
- Issue date Jan 28, 2025
- NXP USA, INC.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with odd-mode oscillation stabilization circuit
- Patent number 11,842,996
- Issue date Dec 12, 2023
- NXP USA, INC.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via (TSV) validation structure for an integrated...
- Patent number 11,823,978
- Issue date Nov 21, 2023
- NXP USA, INC.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using a backside mask layer for forming a unique die mark identifie...
- Patent number 11,450,616
- Issue date Sep 20, 2022
- NXP USA, INC.
- David Robert Currier
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Transistor die with output bondpad at the input side of the die, an...
- Patent number 11,444,044
- Issue date Sep 13, 2022
- NXP USA, INC.
- Ibrahim Khalil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier devices containing inverted power transistor dies a...
- Patent number 11,088,661
- Issue date Aug 10, 2021
- NXP USA, INC.
- Darrell Glenn Hill
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device with selectively etched surface passivation
- Patent number 10,957,790
- Issue date Mar 23, 2021
- NXP USA, INC.
- Bruce McRae Green
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with non-circular via connections in two orientations
- Patent number 10,879,168
- Issue date Dec 29, 2020
- NXP USA, INC.
- Darrell Glenn Hill
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device with selectively etched surface passivation
- Patent number 10,825,924
- Issue date Nov 3, 2020
- NXP USA, INC.
- Bruce M. Green
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with a protection layer and methods of fabric...
- Patent number 10,741,496
- Issue date Aug 11, 2020
- NXP USA, INC.
- Jenn Hwa Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with non-circular via connections in two orientations
- Patent number 10,629,526
- Issue date Apr 21, 2020
- NXP USA, INC.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-path amplifier circuit or system and methods of implementatio...
- Patent number 10,594,276
- Issue date Mar 17, 2020
- NXP USA, INC.
- Jeffrey Kevin Jones
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device with a recessed ohmic contact and methods of f...
- Patent number 10,541,324
- Issue date Jan 21, 2020
- NXP USA, INC.
- Bruce M. Green
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with selectively etched surface passivation
- Patent number 10,522,670
- Issue date Dec 31, 2019
- NXP USA, INC.
- Bruce M. Green
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection for depletion-mode devices
- Patent number 10,438,940
- Issue date Oct 8, 2019
- NXP USA, INC.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with an enhanced resistivity region and metho...
- Patent number 10,128,364
- Issue date Nov 13, 2018
- NXP USA, INC.
- Darrell Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with a thermally conductive layer and methods...
- Patent number 10,074,588
- Issue date Sep 11, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistors with field plates resistant to field plate material mig...
- Patent number 9,905,658
- Issue date Feb 27, 2018
- NXP USA, INC.
- Darrell G. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with selectively etched surface passivation
- Patent number 9,799,760
- Issue date Oct 24, 2017
- NXP USA, INC.
- Bruce M. Green
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with inner via
- Patent number 9,779,988
- Issue date Oct 3, 2017
- NXP USA, INC.
- Darrell G. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with integrated Schottky diodes and methods o...
- Patent number 9,685,345
- Issue date Jun 20, 2017
- NXP USA, INC.
- Bruce M. Green
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with a thermally conductive layer
- Patent number 9,614,046
- Issue date Apr 4, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with a thermally conductive layer and methods...
- Patent number 9,362,198
- Issue date Jun 7, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with selectively etched surface passivation
- Patent number 9,153,448
- Issue date Oct 6, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Bruce M. Green
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with selectively etched surface passivation
- Patent number 9,111,868
- Issue date Aug 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Bruce M. Green
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with selectively etched surface passivation
- Patent number 8,946,776
- Issue date Feb 3, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Bruce M. Green
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods relating to the fabrication of devices having conductive su...
- Patent number 8,609,538
- Issue date Dec 17, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Darrell G. Hill
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRANSISTOR CIRCUITS WITH INDEPENDENTLY BIASED FIELD PLATES
- Publication number 20250211172
- Publication date Jun 26, 2025
- NXP USA, Inc.
- Darrell Glenn Hill
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CIRCUIT DIE WITH CHAMFERED PASSIVATION LAYER
- Publication number 20250183108
- Publication date Jun 5, 2025
- NXP USA, Inc.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTORS WITH DIELECTRIC SPACERS AND METHODS OF FABRICATION THEREOF
- Publication number 20250006818
- Publication date Jan 2, 2025
- NXP USA, Inc.
- Congyong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTORS WITH RECESSED FIELD PLATES AND METHODS OF FABRICATION T...
- Publication number 20250006802
- Publication date Jan 2, 2025
- NXP USA, Inc.
- Congyong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR SUPPRESSING ODD-MODE INSTABILITIES
- Publication number 20240429185
- Publication date Dec 26, 2024
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR WITH DEFECT MITIGATION STRUCTURES
- Publication number 20240266406
- Publication date Aug 8, 2024
- NXP USA, Inc.
- Congyong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR WITH CLADDED STRUCTURE AND METHOD OF FABRICATION THEREFOR
- Publication number 20240105808
- Publication date Mar 28, 2024
- NXP USA, Inc.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR HEAT DISSIPATION STRUCTURE
- Publication number 20240055314
- Publication date Feb 15, 2024
- NXP B.V.
- Ljubo Radic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA (TSV) VALIDATION STRUCTURE FOR AN INTEGRATED...
- Publication number 20240047309
- Publication date Feb 8, 2024
- NXP USA, Inc.
- Darrell Glenn Hill
- G01 - MEASURING TESTING
Information Patent Application
TRANSISTOR WITH DIELECTRIC SPACERS AND METHOD OF FABRICATION THEREFOR
- Publication number 20230361198
- Publication date Nov 9, 2023
- NXP USA, Inc.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR WITH DIELECTRIC SPACERS AND FIELD PLATE AND METHOD OF FA...
- Publication number 20230361183
- Publication date Nov 9, 2023
- NXP USA, Inc.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT DIE WITH ISOLATION TEST STRUCTURE
- Publication number 20230268237
- Publication date Aug 24, 2023
- NXP USA, Inc.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR GATE STRUCTURE WITH INSULATING LAYER AND METHOD OF FABRI...
- Publication number 20230207640
- Publication date Jun 29, 2023
- NXP USA, Inc.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR WITH ALIGNED FIELD PLATE AND METHOD OF FABRICATION THEREFOR
- Publication number 20230207641
- Publication date Jun 29, 2023
- NXP USA, Inc.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR WITH ODD-MODE OSCILLATION STABILIZATION CIRCUIT
- Publication number 20230163121
- Publication date May 25, 2023
- NXP USA, Inc.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA (TSV) VALIDATION STRUCTURE FOR AN INTEGRATED...
- Publication number 20220406687
- Publication date Dec 22, 2022
- NXP USA, Inc.
- Darrell Glenn Hill
- G01 - MEASURING TESTING
Information Patent Application
Die Traceability Using Backside Mask Layers
- Publication number 20220037264
- Publication date Feb 3, 2022
- NXP USA, Inc.
- David Robert Currier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DIE WITH OUTPUT BONDPAD AT THE INPUT SIDE OF THE DIE, AN...
- Publication number 20210202408
- Publication date Jul 1, 2021
- NXP USA, Inc.
- Ibrahim Khalil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER DEVICES CONTAINING INVERTED POWER TRANSISTOR DIES A...
- Publication number 20210021237
- Publication date Jan 21, 2021
- NXP USA, Inc.
- Darrell Glenn Hill
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TRANSISTOR WITH NON-CIRCULAR VIA CONNECTIONS IN TWO ORIENTATIONS
- Publication number 20200194368
- Publication date Jun 18, 2020
- NXP USA, Inc.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH A PROTECTION LAYER AND METHODS OF FABRIC...
- Publication number 20200176389
- Publication date Jun 4, 2020
- NXP USA, Inc.
- Jenn Hwa Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR WITH NON-CIRCULAR VIA CONNECTIONS IN TWO ORIENTATIONS
- Publication number 20200118922
- Publication date Apr 16, 2020
- NXP USA, Inc.
- Darrell Glenn Hill
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MULTI-PATH AMPLIFIER CIRCUIT OR SYSTEM AND METHODS OF IMPLEMENTATIO...
- Publication number 20200014342
- Publication date Jan 9, 2020
- NXP USA, Inc.
- Jeffrey Kevin Jones
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELECTIVELY ETCHED SURFACE PASSIVATION
- Publication number 20190157440
- Publication date May 23, 2019
- NXP USA, Inc.
- Bruce McRae Green
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESD PROTECTION FOR DEPLETION-MODE DEVICES
- Publication number 20180190639
- Publication date Jul 5, 2018
- NXP USA, Inc.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELECTIVELY ETCHED SURFACE PASSIVATION
- Publication number 20170317202
- Publication date Nov 2, 2017
- NXP USA, Inc.
- Bruce M. Green
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH INTEGRATED SCHOTKY DIODES AND METHODS OF...
- Publication number 20170294531
- Publication date Oct 12, 2017
- NXP USA, Inc.
- Bruce M. Green
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH AN ENHANCED RESISTIVITY REGION AND METHO...
- Publication number 20170278961
- Publication date Sep 28, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Darrell Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELECTIVELY ETCHED SURFACE PASSIVATION
- Publication number 20170236929
- Publication date Aug 17, 2017
- NXP USA, Inc.
- Bruce M. Green
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices with a Thermally Conductive Layer and Methods...
- Publication number 20170207142
- Publication date Jul 20, 2017
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS

Darrell G. Hill

Person

Patents Grantslast 30 patents

Transistor with dielectric spacers and field plate and method of fa...

Through substrate via (TSV) validation structure for an integrated...

Transistor with dielectric spacers and method of fabrication therefor

Circuit die with isolation test structure

Transistor with odd-mode oscillation stabilization circuit

Through substrate via (TSV) validation structure for an integrated...

Using a backside mask layer for forming a unique die mark identifie...

Transistor die with output bondpad at the input side of the die, an...

Power amplifier devices containing inverted power transistor dies a...

Semiconductor device with selectively etched surface passivation

Transistor with non-circular via connections in two orientations

Semiconductor device with selectively etched surface passivation

Semiconductor devices with a protection layer and methods of fabric...

Transistor with non-circular via connections in two orientations

Multi-path amplifier circuit or system and methods of implementatio...

Semiconductor device with a recessed ohmic contact and methods of f...

Semiconductor device with selectively etched surface passivation

ESD protection for depletion-mode devices

Semiconductor devices with an enhanced resistivity region and metho...

Semiconductor devices with a thermally conductive layer and methods...

Transistors with field plates resistant to field plate material mig...

Semiconductor device with selectively etched surface passivation

Semiconductor devices with inner via

Semiconductor devices with integrated Schottky diodes and methods o...

Semiconductor devices with a thermally conductive layer

Semiconductor devices with a thermally conductive layer and methods...

Semiconductor device with selectively etched surface passivation

Semiconductor device with selectively etched surface passivation

Semiconductor device with selectively etched surface passivation

Methods relating to the fabrication of devices having conductive su...

Patents Applicationslast 30 patents

TRANSISTOR CIRCUITS WITH INDEPENDENTLY BIASED FIELD PLATES

CIRCUIT DIE WITH CHAMFERED PASSIVATION LAYER

TRANSISTORS WITH DIELECTRIC SPACERS AND METHODS OF FABRICATION THEREOF

TRANSISTORS WITH RECESSED FIELD PLATES AND METHODS OF FABRICATION T...

STRUCTURES FOR SUPPRESSING ODD-MODE INSTABILITIES

TRANSISTOR WITH DEFECT MITIGATION STRUCTURES

TRANSISTOR WITH CLADDED STRUCTURE AND METHOD OF FABRICATION THEREFOR

TRANSISTOR HEAT DISSIPATION STRUCTURE

THROUGH SUBSTRATE VIA (TSV) VALIDATION STRUCTURE FOR AN INTEGRATED...

TRANSISTOR WITH DIELECTRIC SPACERS AND METHOD OF FABRICATION THEREFOR

TRANSISTOR WITH DIELECTRIC SPACERS AND FIELD PLATE AND METHOD OF FA...

CIRCUIT DIE WITH ISOLATION TEST STRUCTURE

TRANSISTOR GATE STRUCTURE WITH INSULATING LAYER AND METHOD OF FABRI...

TRANSISTOR WITH ALIGNED FIELD PLATE AND METHOD OF FABRICATION THEREFOR

TRANSISTOR WITH ODD-MODE OSCILLATION STABILIZATION CIRCUIT

THROUGH SUBSTRATE VIA (TSV) VALIDATION STRUCTURE FOR AN INTEGRATED...

Die Traceability Using Backside Mask Layers

TRANSISTOR DIE WITH OUTPUT BONDPAD AT THE INPUT SIDE OF THE DIE, AN...

POWER AMPLIFIER DEVICES CONTAINING INVERTED POWER TRANSISTOR DIES A...

TRANSISTOR WITH NON-CIRCULAR VIA CONNECTIONS IN TWO ORIENTATIONS

SEMICONDUCTOR DEVICES WITH A PROTECTION LAYER AND METHODS OF FABRIC...

TRANSISTOR WITH NON-CIRCULAR VIA CONNECTIONS IN TWO ORIENTATIONS

MULTI-PATH AMPLIFIER CIRCUIT OR SYSTEM AND METHODS OF IMPLEMENTATIO...

SEMICONDUCTOR DEVICE WITH SELECTIVELY ETCHED SURFACE PASSIVATION

ESD PROTECTION FOR DEPLETION-MODE DEVICES

SEMICONDUCTOR DEVICE WITH SELECTIVELY ETCHED SURFACE PASSIVATION

SEMICONDUCTOR DEVICES WITH INTEGRATED SCHOTKY DIODES AND METHODS OF...

SEMICONDUCTOR DEVICES WITH AN ENHANCED RESISTIVITY REGION AND METHO...

SEMICONDUCTOR DEVICE WITH SELECTIVELY ETCHED SURFACE PASSIVATION

Semiconductor Devices with a Thermally Conductive Layer and Methods...