Date-Gun Lee

Person

Icheon-city, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming an interconnection line in a semiconductor device
- Patent number 7,307,015
- Issue date Dec 11, 2007
- Dongbu Electronics Co., Ltd.
- Date-Gun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming metal pattern to reduce contact resistivity with...
- Patent number 7,271,091
- Issue date Sep 18, 2007
- Dongbu Electronics Co., Ltd.
- Date-Gun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for preventing copper oxidation in a dual damascene process
- Patent number 7,186,644
- Issue date Mar 6, 2007
- Dongbu Electronics, Co., Ltd
- Date Gun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating a semiconductor device with etch end point...
- Patent number 7,183,218
- Issue date Feb 27, 2007
- Dongbu Electronics Co., Ltd.
- Date-Gun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad of a semiconductor device and formation method thereof
- Patent number 6,995,082
- Issue date Feb 7, 2006
- DongbuAnam Semiconductor, Inc.
- Date-Gun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to fabricate semiconductor devices
- Patent number 6,972,242
- Issue date Dec 6, 2005
- DongbuAnam Semiconductor, Inc.
- Date-Gun Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for forming an interconnection line in a semiconductor device
- Publication number 20060014382
- Publication date Jan 19, 2006
- DongbuAnam Semiconductor Inc.
- Date-Gun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a contact in semiconductor device
- Publication number 20050142886
- Publication date Jun 30, 2005
- DongbuAnam Semiconductor Inc.
- Kang Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming metal pattern to reduce contact resistivity with...
- Publication number 20050142841
- Publication date Jun 30, 2005
- DongbuAnam Semiconductor Inc.
- Date-Gun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for preventing copper oxidation in a dual damascene process
- Publication number 20050142854
- Publication date Jun 30, 2005
- Date Gun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods to fabricate semiconductor devices
- Publication number 20040132307
- Publication date Jul 8, 2004
- Date-Gun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods to fabricate a semiconductor device
- Publication number 20040127055
- Publication date Jul 1, 2004
- Date-Gun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding pad of a semiconductor device and formation method thereof
- Publication number 20040115942
- Publication date Jun 17, 2004
- Date-Gun Lee
- H01 - BASIC ELECTRIC ELEMENTS

Date-Gun Lee

Person

Patents Grantslast 30 patents

Method for forming an interconnection line in a semiconductor device

Method for forming metal pattern to reduce contact resistivity with...

Methods for preventing copper oxidation in a dual damascene process

Methods for fabricating a semiconductor device with etch end point...

Bonding pad of a semiconductor device and formation method thereof

Methods to fabricate semiconductor devices

Patents Applicationslast 30 patents

Method for forming an interconnection line in a semiconductor device

Method for forming a contact in semiconductor device

Method for forming metal pattern to reduce contact resistivity with...

Methods for preventing copper oxidation in a dual damascene process

Methods to fabricate semiconductor devices

Methods to fabricate a semiconductor device

Bonding pad of a semiconductor device and formation method thereof