David A. Horine

Person

Los Alto, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Priming mechanisms for drop ejection devices
- Patent number 6,861,034
- Issue date Mar 1, 2005
- Xerox Corporation
- Scott A. Elrod
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Testing method and configurations for multi-ejector system
- Patent number 6,740,530
- Issue date May 25, 2004
- Xerox Corporation
- Richard H. Bruce
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Devices for biofluid drop ejection
- Patent number 6,713,022
- Issue date Mar 30, 2004
- Xerox Corporation
- Jaan Noolandi
- G01 - MEASURING TESTING
Information Patent Grant
Level sense and control system for biofluid drop ejection devices
- Patent number 6,623,700
- Issue date Sep 23, 2003
- Xerox Corporation
- David A. Horine
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Quality control mechanism and process for a biofluid multi-ejector...
- Patent number 6,514,704
- Issue date Feb 4, 2003
- Xerox Corporation
- Richard H. Bruce
- G01 - MEASURING TESTING
Information Patent Grant
Multi-ejector system for ejecting biofluids
- Patent number 6,503,454
- Issue date Jan 7, 2003
- Xerox Corporation
- Babur B. Hadimioglu
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for manufacturing three dimensional parts using an inert gas
- Patent number 6,350,405
- Issue date Feb 26, 2002
- Xerox Corporation
- David A. Horine
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing three dimensional parts using an inert gas
- Patent number 6,248,151
- Issue date Jun 19, 2001
- Xerox Corporation
- David A. Horine
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of assembling thin film jumper connectors to a substrate
- Patent number 6,168,971
- Issue date Jan 2, 2001
- Fujitsu Limited
- David G. Love
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supply distribution structure for integrated circuit chip mod...
- Patent number 6,034,332
- Issue date Mar 7, 2000
- Fujitsu Limited
- Larry Louis Moresco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing 3D parts using a sacrificial material
- Patent number 6,019,814
- Issue date Feb 1, 2000
- Xerox Corporation
- David A. Horine
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Acoustic metal jet fabrication using an inert gas
- Patent number 6,007,183
- Issue date Dec 28, 1999
- Xerox Corporation
- David A. Horine
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Structure and fabrication procedure for a stable post
- Patent number 5,930,890
- Issue date Aug 3, 1999
- Fujitsu Limited
- William T. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire interconnect structures for connecting an integrated circuit t...
- Patent number 5,773,889
- Issue date Jun 30, 1998
- Fujitsu Limited
- David George Love
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing power supply distribution structures for m...
- Patent number 5,765,279
- Issue date Jun 16, 1998
- Fujitsu Limited
- Larry Louis Moresco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication procedure for a stable post
- Patent number 5,722,162
- Issue date Mar 3, 1998
- Fujitsu Limited
- William T. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a three-dimensional multichip module
- Patent number 5,655,290
- Issue date Aug 12, 1997
- Fujitsu Limited
- Larry L. Moresco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for maintaining a controlled atmosphere in an electronic cir...
- Patent number 5,603,892
- Issue date Feb 18, 1997
- Fujitsu Limited
- Carlo Grilletto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire interconnect structures for connecting an integrated circuit t...
- Patent number 5,536,362
- Issue date Jul 16, 1996
- Fujitsu Limited
- David G. Love
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making high-density/long-via laminated connectors
- Patent number 5,515,604
- Issue date May 14, 1996
- Fujitsu Limited
- David A. Horine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for cooling semiconductor chips in multichip modules
- Patent number 5,514,906
- Issue date May 7, 1996
- Fujitsu Limited
- David G. Love
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional multichip module
- Patent number 5,426,563
- Issue date Jun 20, 1995
- Fujitsu Limited
- Larry L. Moresco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density/long-via laminated connector
- Patent number 5,374,196
- Issue date Dec 20, 1994
- Fujitsu Limited
- David A. Horine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire interconnect structures for connecting an integrated circuit t...
- Patent number 5,334,804
- Issue date Aug 2, 1994
- Fujitsu Limited
- David G. Love
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Quality control mechanism and process for a biofluid multi-ejector...
- Publication number 20020102555
- Publication date Aug 1, 2002
- Xerox Corporation.
- Richard H. Bruce
- G01 - MEASURING TESTING
Information Patent Application
Method of manufacturing three dimensional parts using an inert gas
- Publication number 20010018851
- Publication date Sep 6, 2001
- Xerox Corporation.
- David A. Horine
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

David A. Horine

Person

Patents Grantslast 30 patents

Priming mechanisms for drop ejection devices

Testing method and configurations for multi-ejector system

Devices for biofluid drop ejection

Level sense and control system for biofluid drop ejection devices

Quality control mechanism and process for a biofluid multi-ejector...

Multi-ejector system for ejecting biofluids

Apparatus for manufacturing three dimensional parts using an inert gas

Method of manufacturing three dimensional parts using an inert gas

Method of assembling thin film jumper connectors to a substrate

Power supply distribution structure for integrated circuit chip mod...

Method of manufacturing 3D parts using a sacrificial material

Acoustic metal jet fabrication using an inert gas

Structure and fabrication procedure for a stable post

Wire interconnect structures for connecting an integrated circuit t...

Methods of manufacturing power supply distribution structures for m...

Fabrication procedure for a stable post

Method for making a three-dimensional multichip module

System for maintaining a controlled atmosphere in an electronic cir...

Wire interconnect structures for connecting an integrated circuit t...

Methods for making high-density/long-via laminated connectors

Apparatus for cooling semiconductor chips in multichip modules

Three-dimensional multichip module

High-density/long-via laminated connector

Wire interconnect structures for connecting an integrated circuit t...

Patents Applicationslast 30 patents

Quality control mechanism and process for a biofluid multi-ejector...

Method of manufacturing three dimensional parts using an inert gas