David Benjaminson

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for generating etchants for remote plasma processes
- Patent number 12,002,659
- Issue date Jun 4, 2024
- Applied Materials, Inc.
- Tae Seung Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet cleaning of electrostatic chuck
- Patent number 11,776,822
- Issue date Oct 3, 2023
- Applied Materials, Inc.
- Tuochuan Huang
- B08 - CLEANING
Information Patent Grant
Bolted wafer chuck thermal management systems and methods for wafer...
- Patent number 11,217,462
- Issue date Jan 4, 2022
- Applied Materials, Inc.
- David Benjaminson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management systems and methods for wafer processing systems
- Patent number 11,158,527
- Issue date Oct 26, 2021
- Applied Materials, Inc.
- David Benjaminson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High temperature RF heater pedestals
- Patent number 11,062,887
- Issue date Jul 13, 2021
- Applied Materials, Inc.
- Soonam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate supports with embedded RF shield
- Patent number 11,049,755
- Issue date Jun 29, 2021
- Applied Materials, Inc.
- David Benjaminson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bolted wafer chuck thermal management systems and methods for wafer...
- Patent number 10,607,867
- Issue date Mar 31, 2020
- Applied Materials, Inc.
- David Benjaminson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management systems and methods for wafer processing systems
- Patent number 10,468,276
- Issue date Nov 5, 2019
- Applied Materials, Inc.
- David Benjaminson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of etching films with reduced surface roughness
- Patent number 10,233,547
- Issue date Mar 19, 2019
- Applied Materials, Inc.
- Benjamin Schmiege
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bolted wafer chuck thermal management systems and methods for wafer...
- Patent number 10,147,620
- Issue date Dec 4, 2018
- Applied Materials, Inc.
- David Benjaminson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of etching films with reduced surface roughness
- Patent number 9,896,770
- Issue date Feb 20, 2018
- Applied Materials, Inc.
- Benjamin Schmiege
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermal management systems and methods for wafer processing systems
- Patent number 9,741,593
- Issue date Aug 22, 2017
- Applied Materials, Inc.
- David Benjaminson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bolted wafer chuck thermal management systems and methods for wafer...
- Patent number 9,691,645
- Issue date Jun 27, 2017
- Applied Materials, Inc.
- David Benjaminson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of etching films with reduced surface roughness
- Patent number 9,540,736
- Issue date Jan 10, 2017
- Applied Materials, Inc.
- Benjamin Schmiege
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR GENERATING ETCHANTS FOR REMOTE PLASMA PROCESSES
- Publication number 20230402262
- Publication date Dec 14, 2023
- Tae Seung CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET CLEANING OF ELECTROSTATIC CHUCK
- Publication number 20210249280
- Publication date Aug 12, 2021
- Applied Materials, Inc.
- Tuochuan HUANG
- B08 - CLEANING
Information Patent Application
BOLTED WAFER CHUCK THERMAL MANAGEMENT SYSTEMS AND METHODS FOR WAFER...
- Publication number 20200273728
- Publication date Aug 27, 2020
- Applied Materials, Inc.
- David Benjaminson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE SUPPORTS WITH EMBEDDED RF SHIELD
- Publication number 20200090972
- Publication date Mar 19, 2020
- Applied Materials, Inc.
- David Benjaminson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH TEMPERATURE RF HEATER PEDESTALS
- Publication number 20200090912
- Publication date Mar 19, 2020
- Applied Materials, Inc.
- Soonam Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMAL MANAGEMENT SYSTEMS AND METHODS FOR WAFER PROCESSING SYSTEMS
- Publication number 20200066556
- Publication date Feb 27, 2020
- Applied Materials, Inc.
- David Benjaminson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTREME UNIFORMITY HEATED SUBSTRATE SUPPORT ASSEMBLY
- Publication number 20190371577
- Publication date Dec 5, 2019
- Applied Materials, Inc.
- David BENJAMINSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOLTED WAFER CHUCK THERMAL MANAGEMENT SYSTEMS AND METHODS FOR WAFER...
- Publication number 20190109025
- Publication date Apr 11, 2019
- Applied Materials, Inc.
- David Benjaminson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK WITH RADIO FREQUENCY ISOLATED HEATERS
- Publication number 20180213608
- Publication date Jul 26, 2018
- Applied Materials, Inc.
- David Benjaminson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Etching Films with Reduced Surface Roughness
- Publication number 20180195179
- Publication date Jul 12, 2018
- Applied Materials, Inc.
- Benjamin Schmiege
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BOLTED WAFER CHUCK THERMAL MANAGEMENT SYSTEMS AND METHODS FOR WAFER...
- Publication number 20170229328
- Publication date Aug 10, 2017
- Applied Materials, Inc.
- David Benjaminson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SYSTEMS AND METHODS FOR WAFER PROCESSING SYSTEMS
- Publication number 20170229329
- Publication date Aug 10, 2017
- Applied Materials, Inc.
- David Benjaminson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Etching Films With Reduced Surface Roughness
- Publication number 20170096740
- Publication date Apr 6, 2017
- Applied Materials, Inc.
- Benjamin Schmiege
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BOLTED WAFER CHUCK THERMAL MANAGEMENT SYSTEMS AND METHODS FOR WAFER...
- Publication number 20170040191
- Publication date Feb 9, 2017
- Applied Materials, Inc.
- David Benjaminson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SYSTEMS AND METHODS FOR WAFER PROCESSING SYSTEMS
- Publication number 20170040190
- Publication date Feb 9, 2017
- Applied Materials, Inc.
- David Benjaminson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Etching Films With Reduced Surface Roughness
- Publication number 20160032460
- Publication date Feb 4, 2016
- Applied Materials, Inc.
- Benjamin Schmiege
- C30 - CRYSTAL GROWTH

David Benjaminson

Person

Patents Grantslast 30 patents

Apparatus for generating etchants for remote plasma processes

Wet cleaning of electrostatic chuck

Bolted wafer chuck thermal management systems and methods for wafer...

Thermal management systems and methods for wafer processing systems

High temperature RF heater pedestals

Semiconductor substrate supports with embedded RF shield

Bolted wafer chuck thermal management systems and methods for wafer...

Thermal management systems and methods for wafer processing systems

Methods of etching films with reduced surface roughness

Bolted wafer chuck thermal management systems and methods for wafer...

Methods of etching films with reduced surface roughness

Thermal management systems and methods for wafer processing systems

Bolted wafer chuck thermal management systems and methods for wafer...

Methods of etching films with reduced surface roughness

Patents Applicationslast 30 patents

APPARATUS FOR GENERATING ETCHANTS FOR REMOTE PLASMA PROCESSES

WET CLEANING OF ELECTROSTATIC CHUCK

BOLTED WAFER CHUCK THERMAL MANAGEMENT SYSTEMS AND METHODS FOR WAFER...

SEMICONDUCTOR SUBSTRATE SUPPORTS WITH EMBEDDED RF SHIELD

HIGH TEMPERATURE RF HEATER PEDESTALS

THERMAL MANAGEMENT SYSTEMS AND METHODS FOR WAFER PROCESSING SYSTEMS

EXTREME UNIFORMITY HEATED SUBSTRATE SUPPORT ASSEMBLY

BOLTED WAFER CHUCK THERMAL MANAGEMENT SYSTEMS AND METHODS FOR WAFER...

ELECTROSTATIC CHUCK WITH RADIO FREQUENCY ISOLATED HEATERS

Methods of Etching Films with Reduced Surface Roughness

BOLTED WAFER CHUCK THERMAL MANAGEMENT SYSTEMS AND METHODS FOR WAFER...

THERMAL MANAGEMENT SYSTEMS AND METHODS FOR WAFER PROCESSING SYSTEMS

Methods Of Etching Films With Reduced Surface Roughness

BOLTED WAFER CHUCK THERMAL MANAGEMENT SYSTEMS AND METHODS FOR WAFER...

THERMAL MANAGEMENT SYSTEMS AND METHODS FOR WAFER PROCESSING SYSTEMS

Methods Of Etching Films With Reduced Surface Roughness