David Chai Yih Ming

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic component assemblies employing lead frames having r...
- Patent number 7,425,470
- Issue date Sep 16, 2008
- Micron Technology, Inc.
- Neo Chee Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic component assemblies employing lead frames having r...
- Patent number 7,057,281
- Issue date Jun 6, 2006
- Micron Technology Inc.
- Neo Chee Peng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC COMPONENT ASSEMBLIES EMPLOYING LEAD FRAMES HAVING R...
- Publication number 20080233684
- Publication date Sep 25, 2008
- Micron Technology, Inc.
- Neo Chee Peng
- H01 - BASIC ELECTRIC ELEMENTS