David E. Eichstadt

Person

Des Plaines, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Forming robust solder interconnect structures by reducing effects o...
- Patent number 7,767,575
- Issue date Aug 3, 2010
- Tessera Intellectual Properties, Inc.
- Kamalesh K. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a bond pad on an I/C chip and resulting structure
- Patent number 7,572,726
- Issue date Aug 11, 2009
- International Business Machines Corporation
- Julie C. Biggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressible films surrounding solder connectors
- Patent number 7,566,649
- Issue date Jul 28, 2009
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming robust solder interconnect structures by reducin...
- Patent number 7,473,997
- Issue date Jan 6, 2009
- International Business Machines Corporation
- Kamalesh K. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressible films surrounding solder connectors
- Patent number 7,332,821
- Issue date Feb 19, 2008
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant electrical contacts
- Patent number 7,316,572
- Issue date Jan 8, 2008
- International Business Machines Corporation
- William E. Bernier
- G01 - MEASURING TESTING
Information Patent Grant
Method for selective electroplating of semiconductor device I/O pad...
- Patent number 7,144,490
- Issue date Dec 5, 2006
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming robust solder interconnect structures by reducin...
- Patent number 6,995,084
- Issue date Feb 7, 2006
- International Business Machines Corporation
- Kamalesh K. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
I/C chip suitable for wire bonding
- Patent number 6,995,475
- Issue date Feb 7, 2006
- International Business Machines Corporation
- Julie C. Biggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier for interconnect and method
- Patent number 6,992,389
- Issue date Jan 31, 2006
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inhibition of tin oxide formation in lead free interconnect formation
- Patent number 6,900,142
- Issue date May 31, 2005
- International Business Machines Corporation
- Emanual I. Cooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrochemical etch for high tin solder bumps
- Patent number 6,468,413
- Issue date Oct 22, 2002
- International Business Machines Corporation
- Lisa A. Fanti
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCING EFFECTS O...
- Publication number 20090163019
- Publication date Jun 25, 2009
- International Business Machines Corporation
- Kamalesh K. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSIBLE FILMS SURROUNDING SOLDER CONNECTORS
- Publication number 20080009101
- Publication date Jan 10, 2008
- William E. Bernier
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
COMPLIANT ELECTRICAL CONTACTS
- Publication number 20080000080
- Publication date Jan 3, 2008
- William E. Bernier
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Device with area array pads for test probing
- Publication number 20060249854
- Publication date Nov 9, 2006
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT ELECTRICAL CONTACTS
- Publication number 20060172565
- Publication date Aug 3, 2006
- International Business Machines Corporation
- William E. Bernier
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of forming a bond pad on an I/C chip and resulting structure
- Publication number 20060081981
- Publication date Apr 20, 2006
- International Business Machines Corporation
- Julie C. Biggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSIBLE FILMS SURROUNDING SOLDER CONNECTORS
- Publication number 20060040567
- Publication date Feb 23, 2006
- International Business Machines Corporation
- William E. Bernier
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCIN...
- Publication number 20060009022
- Publication date Jan 12, 2006
- International Business Machines Corporation
- Kamalesh K. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER FOR INTERCONNECT AND METHOD
- Publication number 20050245070
- Publication date Nov 3, 2005
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCIN...
- Publication number 20050208748
- Publication date Sep 22, 2005
- International Business Machines Corporation
- Kamalesh K. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH AREA ARRAY PADS FOR TEST PROBING
- Publication number 20050167837
- Publication date Aug 4, 2005
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SELECTIVE ELECTROPLATING OF SEMICONDUCTOR DEVICE I/O PAD...
- Publication number 20050103636
- Publication date May 19, 2005
- International Business Machines Corporation
- Tien-Jen Cheng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
STABILIZING COPPER OVERLAYER FOR ENHANCED C4 INTERCONNECT RELIABILITY
- Publication number 20050104208
- Publication date May 19, 2005
- International Business Machines Corporation
- James C. Bartelo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a bond pad on an I/C chip and resulting structure
- Publication number 20050062170
- Publication date Mar 24, 2005
- International Business Machines Corporation
- Julie C. Biggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INHIBITION OF TIN OXIDE FORMATION IN LEAD FREE INTERCONNECT FORMATION
- Publication number 20050026450
- Publication date Feb 3, 2005
- International Business Machines Corporation
- Emanuel I. Cooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED PIN STRUCTURE FOR IMPROVED RELIABILITY OF WAFER
- Publication number 20050026416
- Publication date Feb 3, 2005
- International Business Machines Corporation
- Tien-Jen Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

David E. Eichstadt

Person

Patents Grantslast 30 patents

Forming robust solder interconnect structures by reducing effects o...

Method of forming a bond pad on an I/C chip and resulting structure

Compressible films surrounding solder connectors

Method for forming robust solder interconnect structures by reducin...

Compressible films surrounding solder connectors

Compliant electrical contacts

Method for selective electroplating of semiconductor device I/O pad...

Method for forming robust solder interconnect structures by reducin...

I/C chip suitable for wire bonding

Barrier for interconnect and method

Inhibition of tin oxide formation in lead free interconnect formation

Electrochemical etch for high tin solder bumps

Patents Applicationslast 30 patents

FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCING EFFECTS O...

COMPRESSIBLE FILMS SURROUNDING SOLDER CONNECTORS

COMPLIANT ELECTRICAL CONTACTS

Device with area array pads for test probing

COMPLIANT ELECTRICAL CONTACTS

Method of forming a bond pad on an I/C chip and resulting structure

COMPRESSIBLE FILMS SURROUNDING SOLDER CONNECTORS

METHOD FOR FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCIN...

BARRIER FOR INTERCONNECT AND METHOD

METHOD FOR FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCIN...

DEVICE WITH AREA ARRAY PADS FOR TEST PROBING

METHOD FOR SELECTIVE ELECTROPLATING OF SEMICONDUCTOR DEVICE I/O PAD...

STABILIZING COPPER OVERLAYER FOR ENHANCED C4 INTERCONNECT RELIABILITY

Method of forming a bond pad on an I/C chip and resulting structure

INHIBITION OF TIN OXIDE FORMATION IN LEAD FREE INTERCONNECT FORMATION

ENCAPSULATED PIN STRUCTURE FOR IMPROVED RELIABILITY OF WAFER