DAVID F. ABDO

Person

SCOTTSDALE, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged dies with metal outer layers extending from die back sides...
- Patent number 11,437,276
- Issue date Sep 6, 2022
- NXP USA, INC.
- Jaynal A Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic components having integrated heat dissipation posts...
- Patent number 10,861,764
- Issue date Dec 8, 2020
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of wafer dicing for wafers with backside metallization and p...
- Patent number 10,741,446
- Issue date Aug 11, 2020
- NXP USA, INC.
- Jaynal A Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF amplifier with conductor-less region underlying filter circuit i...
- Patent number 10,637,400
- Issue date Apr 28, 2020
- NXP USA, INC.
- Jeffrey K. Jones
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Methods of manufacturing encapsulated semiconductor device package...
- Patent number 10,630,246
- Issue date Apr 21, 2020
- NXP USA, INC.
- David F. Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic components having integrated heat dissipation posts...
- Patent number 10,269,678
- Issue date Apr 23, 2019
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with an isolation structure coupled to a cover...
- Patent number 10,109,594
- Issue date Oct 23, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF amplifier with conductor-less region underlying filter circuit i...
- Patent number 10,075,132
- Issue date Sep 11, 2018
- NXP USA, INC.
- Jeffrey K. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air cavity packages and methods for the production thereof
- Patent number 9,922,894
- Issue date Mar 20, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pre-plated substrate for die attachment
- Patent number 9,893,027
- Issue date Feb 13, 2018
- NXP USA, INC.
- David F. Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor device package with heatsink opening, an...
- Patent number 9,787,254
- Issue date Oct 10, 2017
- NXP USA, INC.
- David F. Abdo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device with mechanical lock features between a semico...
- Patent number 9,425,161
- Issue date Aug 23, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with an isolation structure coupled to a cover...
- Patent number 9,349,693
- Issue date May 24, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Viswanathan Lakshminarayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods of operation for separating semiconductor die f...
- Patent number 9,111,984
- Issue date Aug 18, 2015
- Freescale Semiconductor Inc.
- Audel A. Sanchez
- B32 - LAYERED PRODUCTS
Information Patent Grant
Packaged semiconductor devices and methods of their fabrication
- Patent number 9,099,567
- Issue date Aug 4, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Providing an automatic optical inspection feature for solder joints...
- Patent number 8,535,982
- Issue date Sep 17, 2013
- FREESCALE SEMICONDUCTOR, INC.
- David F. Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a mounted gallium nitride device
- Patent number 8,318,545
- Issue date Nov 27, 2012
- FREESCALE SEMICONDUCTOR, INC.
- David F. Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging a semiconductor die and package thereof
- Patent number 7,445,967
- Issue date Nov 4, 2008
- FREESCALE SEMICONDUCTOR, INC.
- David F. Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component
- Patent number 6,072,238
- Issue date Jun 6, 2000
- Motorola, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED DIES WITH METAL OUTER LAYERS EXTENDING FROM DIE BACK SIDES...
- Publication number 20200335398
- Publication date Oct 22, 2020
- NXP USA, Inc.
- Jaynal A. Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENTS HAVING INTEGRATED HEAT DISSIPATION POSTS...
- Publication number 20190206759
- Publication date Jul 4, 2019
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF AMPLIFIER WITH CONDUCTOR-LESS REGION UNDERLYING FILTER CIRCUIT I...
- Publication number 20190020314
- Publication date Jan 17, 2019
- NXP USA, Inc.
- JEFFREY K. JONES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF WAFER DICING FOR WAFERS WITH BACKSIDE METALLIZATION AND P...
- Publication number 20190013242
- Publication date Jan 10, 2019
- NXP USA, Inc.
- Jaynal A. Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
- Publication number 20180082915
- Publication date Mar 22, 2018
- Freescale Semiconductor Inc.
- LAKSHMINARAYAN VISWANATHAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENCAPSULATED SEMICONDUCTOR DEVICE PACKAGE WITH HEATSINK OPENING
- Publication number 20180034421
- Publication date Feb 1, 2018
- NXP USA, Inc.
- David F. ABDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-PLATED SUBSTRATE FOR DIE ATTACHMENT
- Publication number 20180012855
- Publication date Jan 11, 2018
- NXP USA, Inc.
- David F. Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-PLATED SUBSTRATE FOR DIE ATTACHMENT
- Publication number 20170294393
- Publication date Oct 12, 2017
- FREESCALE SEMICONDUCTOR, INC.
- David F. Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED SEMICONDUCTOR DEVICE PACKAGE WITH HEATSINK OPENING, AN...
- Publication number 20170085228
- Publication date Mar 23, 2017
- FREESCALE SEMICONDUCTOR, INC.
- DAVID F. ABDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF AMPLIFIER WITH CONDUCTOR-LESS REGION UNDERLYING FILTER CIRCUIT I...
- Publication number 20160285418
- Publication date Sep 29, 2016
- FREESCALE SEMICONDUCTOR, INC.
- JEFFREY K. JONES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AN ISOLATION STRUCTURE COUPLED TO A COVER...
- Publication number 20160240488
- Publication date Aug 18, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayn Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AN ISOLATION STRUCTURE COUPLED TO A COVER...
- Publication number 20160043039
- Publication date Feb 11, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Viswanathan Lakshminarayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MECHANICAL LOCK FEATURES BETWEEN A SEMICO...
- Publication number 20150333031
- Publication date Nov 19, 2015
- FREESCALE SEMICONDUCTOR, INC.
- LAKSHMINARAYAN VISWANATHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF THEIR FABRICATION
- Publication number 20150146399
- Publication date May 28, 2015
- LAKSHMINARAYAN VISWANATHAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES AND METHODS OF OPERATION FOR SEPARATING SEMICONDUCTOR DIE F...
- Publication number 20150114572
- Publication date Apr 30, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Audel A. SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A MOUNTED GALLIUM NITRIDE DEVICE
- Publication number 20110180808
- Publication date Jul 28, 2011
- David F. Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING A SEMICONDUCTOR DIE
- Publication number 20090023248
- Publication date Jan 22, 2009
- Freescale Semiconductor, Inc.
- David F. Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of packaging a semiconductor die and package thereof
- Publication number 20070172990
- Publication date Jul 26, 2007
- Freescale Semiconductor, Inc.
- David F. Abdo
- H01 - BASIC ELECTRIC ELEMENTS

DAVID F. ABDO

Person

Patents Grantslast 30 patents

Packaged dies with metal outer layers extending from die back sides...

Microelectronic components having integrated heat dissipation posts...

Method of wafer dicing for wafers with backside metallization and p...

RF amplifier with conductor-less region underlying filter circuit i...

Methods of manufacturing encapsulated semiconductor device package...

Microelectronic components having integrated heat dissipation posts...

Semiconductor device with an isolation structure coupled to a cover...

RF amplifier with conductor-less region underlying filter circuit i...

Air cavity packages and methods for the production thereof

Pre-plated substrate for die attachment

Encapsulated semiconductor device package with heatsink opening, an...

Semiconductor device with mechanical lock features between a semico...

Semiconductor device with an isolation structure coupled to a cover...

Devices and methods of operation for separating semiconductor die f...

Packaged semiconductor devices and methods of their fabrication

Providing an automatic optical inspection feature for solder joints...

Method of making a mounted gallium nitride device

Method of packaging a semiconductor die and package thereof

Semiconductor component

Patents Applicationslast 30 patents

PACKAGED DIES WITH METAL OUTER LAYERS EXTENDING FROM DIE BACK SIDES...

MICROELECTRONIC COMPONENTS HAVING INTEGRATED HEAT DISSIPATION POSTS...

RF AMPLIFIER WITH CONDUCTOR-LESS REGION UNDERLYING FILTER CIRCUIT I...

METHOD OF WAFER DICING FOR WAFERS WITH BACKSIDE METALLIZATION AND P...

AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF

ENCAPSULATED SEMICONDUCTOR DEVICE PACKAGE WITH HEATSINK OPENING

PRE-PLATED SUBSTRATE FOR DIE ATTACHMENT

PRE-PLATED SUBSTRATE FOR DIE ATTACHMENT

ENCAPSULATED SEMICONDUCTOR DEVICE PACKAGE WITH HEATSINK OPENING, AN...

RF AMPLIFIER WITH CONDUCTOR-LESS REGION UNDERLYING FILTER CIRCUIT I...

SEMICONDUCTOR DEVICE WITH AN ISOLATION STRUCTURE COUPLED TO A COVER...

SEMICONDUCTOR DEVICE WITH AN ISOLATION STRUCTURE COUPLED TO A COVER...

SEMICONDUCTOR DEVICE WITH MECHANICAL LOCK FEATURES BETWEEN A SEMICO...

PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF THEIR FABRICATION

DEVICES AND METHODS OF OPERATION FOR SEPARATING SEMICONDUCTOR DIE F...

METHOD OF MAKING A MOUNTED GALLIUM NITRIDE DEVICE

METHOD OF PACKAGING A SEMICONDUCTOR DIE

Method of packaging a semiconductor die and package thereof