David G. Figueroa

Person

Avondale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method to control delay between lanes
- Patent number 8,166,215
- Issue date Apr 24, 2012
- Intel Corporation
- Srikrishnan Venkataraman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Noise reduction method by implementing certain port-to-port delay
- Patent number 7,975,158
- Issue date Jul 5, 2011
- Intel Corporation
- Muhammed Elgousi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic assemblies comprising ceramic/organic hybrid substrate w...
- Patent number 7,535,728
- Issue date May 19, 2009
- Intel Corporation
- Kishore K. Chakravorty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductive filters and methods of fabrication therefor
- Patent number 7,518,248
- Issue date Apr 14, 2009
- Intel Corporation
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power plane to reduce voltage difference between connector power pins
- Patent number 7,492,605
- Issue date Feb 17, 2009
- Intel Corporation
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with trace configuration for high-speed digital diffe...
- Patent number 7,417,872
- Issue date Aug 26, 2008
- Intel Corporation
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrates and systems to minimize signal path discontinuities
- Patent number 7,358,607
- Issue date Apr 15, 2008
- Intel Corporation
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System to control effective series resistance of decoupling capacitor
- Patent number 7,286,368
- Issue date Oct 23, 2007
- Intel Corporation
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System to control effective series resistance of power delivery cir...
- Patent number 7,221,046
- Issue date May 22, 2007
- Intel Corporation
- Dong Zhong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High ESR low ESL capacitor
- Patent number 7,215,530
- Issue date May 8, 2007
- Intel Corporation
- Yuan-Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor-related systems for addressing package/motherboard resonance
- Patent number 7,211,894
- Issue date May 1, 2007
- Intel Corporation
- Jennifer A. Hester
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor design for controlling equivalent series resistance
- Patent number 7,212,395
- Issue date May 1, 2007
- Intel Corporation
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon building blocks in integrated circuit packaging
- Patent number 7,205,638
- Issue date Apr 17, 2007
- Intel Corporation
- David Gregory Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitors having separate terminals on three or more sides
- Patent number 7,176,565
- Issue date Feb 13, 2007
- Intel Corporation
- Yuan-Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with trace configuration for high-speed digital diffe...
- Patent number 7,145,239
- Issue date Dec 5, 2006
- Intel Corporation
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit packages with sandwiched capacitors
- Patent number 7,133,294
- Issue date Nov 7, 2006
- Intel Corporation
- Priyavadan R. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data processing system comprising ceramic/organic hybrid substrate...
- Patent number 7,120,031
- Issue date Oct 10, 2006
- Intel Corporation
- Kishore K. Chakravorty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductive filters and methods of fabrication thereof
- Patent number 7,111,271
- Issue date Sep 19, 2006
- Intel Corporation
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coaxial dual pin sockets for high speed I/O applications
- Patent number 7,063,569
- Issue date Jun 20, 2006
- Intel Corporation
- David G. Figueroa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor-related systems for addressing package/motherboard resonance
- Patent number 6,992,387
- Issue date Jan 31, 2006
- Intel Corporation
- Jennifer A. Hester
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low impedance, high-power socket and method of using
- Patent number 6,964,584
- Issue date Nov 15, 2005
- Intel Corporation
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid capacitor, circuit, and system
- Patent number 6,920,051
- Issue date Jul 19, 2005
- Intel Corporation
- David G. Figueroa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with trace configuration for high-speed digital diffe...
- Patent number 6,914,334
- Issue date Jul 5, 2005
- Intel Corporation
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly with sandwiched capacitors and methods of manuf...
- Patent number 6,900,991
- Issue date May 31, 2005
- Intel Corporation
- Priyavadan R. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabrication for a socket with embedded conductive structure
- Patent number 6,877,223
- Issue date Apr 12, 2005
- Intel Corporation
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon building blocks in integrated circuit packaging
- Patent number 6,815,256
- Issue date Nov 9, 2004
- Intel Corporation
- David Gregory Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit socket with capacitors and shunts
- Patent number 6,811,410
- Issue date Nov 2, 2004
- Intel Corporation
- David G. Figueroa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power/ground configuration for low impedance integrated circuit
- Patent number 6,784,532
- Issue date Aug 31, 2004
- Intel Corporation
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial dual pin sockets for high speed I/O applications
- Patent number 6,780,057
- Issue date Aug 24, 2004
- Intel Corporation
- David G. Figueroa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly comprising ceramic/organic hybrid substrate wit...
- Patent number 6,775,150
- Issue date Aug 10, 2004
- Intel Corporation
- Kishore K. Chakravorty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
NOISE REDUCTION METHOD BY IMPLEMENTING CERTAIN PORT-TO-PORT DELAY
- Publication number 20090259787
- Publication date Oct 15, 2009
- Muhammed Elgousi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Power plane to reduce voltage difference between connector power pins
- Publication number 20070295818
- Publication date Dec 27, 2007
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method to control delay between lanes
- Publication number 20070150197
- Publication date Jun 28, 2007
- Srikrishnan Venkataraman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
High ESR low ESL capacitor
- Publication number 20070002519
- Publication date Jan 4, 2007
- Yuan-Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES COMPRISING CERAMIC/ORGANIC HYBRID SUBSTRATE W...
- Publication number 20060279940
- Publication date Dec 14, 2006
- Intel Corporation
- Kishore K. Chakravorty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDUCTIVE FILTERS AND METHODS OF FABRICATION THEREFOR
- Publication number 20060267216
- Publication date Nov 30, 2006
- Intel Corporation
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH TRACE CONFIGURATION FOR HIGH-SPEED DIGITAL DIFFE...
- Publication number 20060261465
- Publication date Nov 23, 2006
- Intel Corporation
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR HAVING SEPARATE TERMINALS ON THREE OR MORE SIDES AND METH...
- Publication number 20060256502
- Publication date Nov 16, 2006
- Intel Corporation
- Yuan-Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor pad network to manage equivalent series resistance
- Publication number 20060138639
- Publication date Jun 29, 2006
- David G. Figueroa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitor design for controlling equivalent series resistance
- Publication number 20060139847
- Publication date Jun 29, 2006
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System to control effective series resistance of decoupling capacitor
- Publication number 20060091564
- Publication date May 4, 2006
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor-related systems for addressing package/motherboard resonance
- Publication number 20050194675
- Publication date Sep 8, 2005
- Jennifer A. Hester
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated circuit packages with sandwiched capacitors
- Publication number 20050156280
- Publication date Jul 21, 2005
- Intel Corporation
- P. R. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board with trace configuration for high-speed digital diffe...
- Publication number 20050139391
- Publication date Jun 30, 2005
- Intel Corporation
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicon building blocks in integrated circuit packaging
- Publication number 20050029555
- Publication date Feb 10, 2005
- David Gregory Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor-related systems for addressing package/motherboard resonance
- Publication number 20040257780
- Publication date Dec 23, 2004
- Jennifer A. Hester
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic assembly comprising ceramic/organic hybrid substrate wit...
- Publication number 20040238942
- Publication date Dec 2, 2004
- Intel Corporation
- Kishore K. Chakravorty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Coaxial dual pin sockets for high speed I/O applications
- Publication number 20040185714
- Publication date Sep 23, 2004
- David G. Figueroa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicon building blocks in integrated circuit packaging
- Publication number 20040119144
- Publication date Jun 24, 2004
- Intel Corporation
- David Gregory Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via configuration for differential signaling through power or groun...
- Publication number 20040039859
- Publication date Feb 26, 2004
- Intel Corporation
- Jiangqi He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic package with back side, cavity mounted capacitors and me...
- Publication number 20040022038
- Publication date Feb 5, 2004
- Intel Corporation
- David G. Figueroa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power/ground configuration for low impedance integrated circuit
- Publication number 20040021215
- Publication date Feb 5, 2004
- Intel Corporation
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board with trace configuration for high-speed digital diffe...
- Publication number 20030230807
- Publication date Dec 18, 2003
- Intel Corporation
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit socket with capacitors and shunts
- Publication number 20030224629
- Publication date Dec 4, 2003
- David G. Figueroa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOCKET WITH LOW INDUCTANCE SIDE CONTACTS FOR A MICROELECTRONIC DEVI...
- Publication number 20030197259
- Publication date Oct 23, 2003
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangements for minimizing signal path discontinuities
- Publication number 20030168737
- Publication date Sep 11, 2003
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical assembly with vertical multiple layer structure
- Publication number 20030151147
- Publication date Aug 14, 2003
- Intel Corporation
- Chee-Yee Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vertical electronic circuit package and method of fabrication therefor
- Publication number 20030151146
- Publication date Aug 14, 2003
- Intel Corporation
- Chee-Yee Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Arrangements to improve noise immunity of differential signals
- Publication number 20030133276
- Publication date Jul 17, 2003
- Dong Zhong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Coaxial dual pin sockets for high speed I/O applications
- Publication number 20030119361
- Publication date Jun 26, 2003
- David G. Figueroa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

David G. Figueroa

Person

Patents Grantslast 30 patents

Method to control delay between lanes

Noise reduction method by implementing certain port-to-port delay

Electronic assemblies comprising ceramic/organic hybrid substrate w...

Inductive filters and methods of fabrication therefor

Power plane to reduce voltage difference between connector power pins

Circuit board with trace configuration for high-speed digital diffe...

Substrates and systems to minimize signal path discontinuities

System to control effective series resistance of decoupling capacitor

System to control effective series resistance of power delivery cir...

High ESR low ESL capacitor

Capacitor-related systems for addressing package/motherboard resonance

Capacitor design for controlling equivalent series resistance

Silicon building blocks in integrated circuit packaging

Capacitors having separate terminals on three or more sides

Circuit board with trace configuration for high-speed digital diffe...

Integrated circuit packages with sandwiched capacitors

Data processing system comprising ceramic/organic hybrid substrate...

Inductive filters and methods of fabrication thereof

Coaxial dual pin sockets for high speed I/O applications

Capacitor-related systems for addressing package/motherboard resonance

Low impedance, high-power socket and method of using

Hybrid capacitor, circuit, and system

Circuit board with trace configuration for high-speed digital diffe...

Electronic assembly with sandwiched capacitors and methods of manuf...

Method of fabrication for a socket with embedded conductive structure

Silicon building blocks in integrated circuit packaging

Integrated circuit socket with capacitors and shunts

Power/ground configuration for low impedance integrated circuit

Coaxial dual pin sockets for high speed I/O applications

Electronic assembly comprising ceramic/organic hybrid substrate wit...

Patents Applicationslast 30 patents

NOISE REDUCTION METHOD BY IMPLEMENTING CERTAIN PORT-TO-PORT DELAY

Power plane to reduce voltage difference between connector power pins

Method to control delay between lanes

High ESR low ESL capacitor

ELECTRONIC ASSEMBLIES COMPRISING CERAMIC/ORGANIC HYBRID SUBSTRATE W...

INDUCTIVE FILTERS AND METHODS OF FABRICATION THEREFOR

CIRCUIT BOARD WITH TRACE CONFIGURATION FOR HIGH-SPEED DIGITAL DIFFE...

CAPACITOR HAVING SEPARATE TERMINALS ON THREE OR MORE SIDES AND METH...

Capacitor pad network to manage equivalent series resistance

Capacitor design for controlling equivalent series resistance

System to control effective series resistance of decoupling capacitor

Capacitor-related systems for addressing package/motherboard resonance

Integrated circuit packages with sandwiched capacitors

Circuit board with trace configuration for high-speed digital diffe...

Silicon building blocks in integrated circuit packaging

Capacitor-related systems for addressing package/motherboard resonance

Electronic assembly comprising ceramic/organic hybrid substrate wit...

Coaxial dual pin sockets for high speed I/O applications

Silicon building blocks in integrated circuit packaging

Via configuration for differential signaling through power or groun...

Electronic package with back side, cavity mounted capacitors and me...

Power/ground configuration for low impedance integrated circuit

Circuit board with trace configuration for high-speed digital diffe...

Integrated circuit socket with capacitors and shunts

SOCKET WITH LOW INDUCTANCE SIDE CONTACTS FOR A MICROELECTRONIC DEVI...

Arrangements for minimizing signal path discontinuities

Electrical assembly with vertical multiple layer structure

Vertical electronic circuit package and method of fabrication therefor

Arrangements to improve noise immunity of differential signals

Coaxial dual pin sockets for high speed I/O applications