David Gillen

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Clontarf, IE

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Patents Grantslast 30 patents

Information Patent Grant
Die bonding
- Patent number 7,989,320
- Issue date Aug 2, 2011
- Electro Scientific Industries, Inc.
- Adrian Boyle
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Increasing Die Strength by Etching During or After Dicing
- Publication number 20090191690
- Publication date Jul 30, 2009
- XSIL TECHNOLOGY LIMITED
- Adrian Boyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonding
- Publication number 20070224733
- Publication date Sep 27, 2007
- Adrian Boyle
- H01 - BASIC ELECTRIC ELEMENTS