David J. Pedder

Person

Long Compton, GB

People

Patents Grantslast 30 patents

Information Patent Grant
Trimmable inductor structure
- Patent number 6,005,466
- Issue date Dec 21, 1999
- Mitel Semiconductor Limited
- David John Pedder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare die testing
- Patent number 5,786,701
- Issue date Jul 28, 1998
- Mitel Semiconductor Limited
- David John Pedder
- G01 - MEASURING TESTING
Information Patent Grant
Microchip module assemblies
- Patent number 5,784,261
- Issue date Jul 21, 1998
- Plessey SemiConductors Limited
- David Pedder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module inductor structure
- Patent number 5,747,870
- Issue date May 5, 1998
- Plessey SemiConductors Limited
- David John Pedder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array arrangement
- Patent number 5,717,245
- Issue date Feb 10, 1998
- Plessey SemiConductors Limited
- David John Pedder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trimmable capacitor
- Patent number 5,604,658
- Issue date Feb 18, 1997
- Plessey SemiConductors Limited
- David J. Pedder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for testing bare dies with low contact resista...
- Patent number 5,406,210
- Issue date Apr 11, 1995
- GEC-Marconi Limited
- David J. Pedder
- G01 - MEASURING TESTING
Information Patent Grant
Flip chip solder bond structure for devices with gold based metalli...
- Patent number 5,108,027
- Issue date Apr 28, 1992
- GEC-Marconi Limited
- David J. Warner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal surface cleaning processes
- Patent number 5,000,819
- Issue date Mar 19, 1991
- Plessey Overseas Limited
- David J. Pedder
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

David J. Pedder

Person

Patents Grantslast 30 patents

Trimmable inductor structure

Bare die testing

Microchip module assemblies

Multi-chip module inductor structure

Ball grid array arrangement

Trimmable capacitor

Apparatus and method for testing bare dies with low contact resista...

Flip chip solder bond structure for devices with gold based metalli...

Metal surface cleaning processes