Claims
- 1. A method of making a flip-chip solder bonding device, comprising the steps of:
- providing a semiconductor substrate;
- forming on said substrate a metallization layer of a metal selected from the group consisting of gold, silver and copper;
- forming on said metallization layer a barrier layer of a solder non-wettable metal selected from the group consisting of chromium, titanium, tungsten and titanium-tungsten;
- forming solder wettable pads on the barrier layer; and
- thereafter forming solder bumps of a solder material on said solder wettable pads.
- 2. The method of claim 1, further comprising the step of providing a separate barrier metallization portion of said solder non-wettable metal for each solder wettable pad of an array of solder wettable pads formed on the substrate, each barrier metallization portion being dimensioned so as to receive the solder wettable pad and a solder bump formed thereon, which may have greater lateral dimensions than the respective solder wettable pad.
Priority Claims (1)
Number |
Date |
Country |
Kind |
8911147 |
May 1989 |
GBX |
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Parent Case Info
This is a continuation of application Ser. No. 07/520,826, filed May 9, 1990, now abandoned.
US Referenced Citations (6)
Foreign Referenced Citations (5)
Number |
Date |
Country |
38096 |
Nov 1973 |
JPX |
48670 |
May 1978 |
JPX |
68654 |
May 1980 |
JPX |
71023 |
May 1980 |
JPX |
253940 |
Oct 1989 |
JPX |
Non-Patent Literature Citations (1)
Entry |
IBM Technical Disclosure Bulletin, "Stable Junctions . . . Diffusion Barriers", vol. 21, No. 4, p. 1753, Sep. 1978. |
Continuations (1)
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Number |
Date |
Country |
Parent |
520826 |
May 1990 |
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