David J. West

Person

Essex Junction, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chip-on-chip structure and methods of manufacture
- Patent number 10,340,241
- Issue date Jul 2, 2019
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor TSV device package to which other semiconductor devic...
- Patent number 9,818,653
- Issue date Nov 14, 2017
- International Business Machines Corporation
- Richard Stephen Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC structure with angled interconnect elements
- Patent number 9,754,911
- Issue date Sep 5, 2017
- GLOBALFOUNDRIES Inc.
- David J. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor TSV device package to which other semiconductor devic...
- Patent number 9,721,852
- Issue date Aug 1, 2017
- International Business Machines Corporation
- Richard Stephen Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor TSV device package for circuit board connection
- Patent number 9,570,422
- Issue date Feb 14, 2017
- International Business Machines Corporation
- David J. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor TSV device package for circuit board connection
- Patent number 9,508,690
- Issue date Nov 29, 2016
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial carrier dicing of semiconductor wafers
- Patent number 9,484,239
- Issue date Nov 1, 2016
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial carrier dicing of semiconductor wafers
- Patent number 9,478,453
- Issue date Oct 25, 2016
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating printed circuit boards
- Patent number 9,433,105
- Issue date Aug 30, 2016
- International Business Machines Corporation
- Richard Stephen Graf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded heat spreader with electrical properties
- Patent number 9,368,425
- Issue date Jun 14, 2016
- GLOBALFOUNDRIES Inc.
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical contact alignment posts
- Patent number 8,530,345
- Issue date Sep 10, 2013
- International Business Machines Corporation
- David Justin West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical contact alignment posts
- Patent number 8,415,792
- Issue date Apr 9, 2013
- International Business Machines Corporation
- David Justin West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overcoming laminate warpage and misalignment in flip-chip packages
- Patent number 8,304,290
- Issue date Nov 6, 2012
- International Business Machines Corporation
- Richard S. Graf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE
- Publication number 20190244926
- Publication date Aug 8, 2019
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE
- Publication number 20190148328
- Publication date May 16, 2019
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC STRUCTURE WITH ANGLED INTERCONNECT ELEMENTS
- Publication number 20170098623
- Publication date Apr 6, 2017
- GLOBALFOUNDRIES INC.
- David J. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE
- Publication number 20160365328
- Publication date Dec 15, 2016
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE
- Publication number 20160365329
- Publication date Dec 15, 2016
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sacrificial Carrier Dicing of Semiconductor Wafers
- Publication number 20160079117
- Publication date Mar 17, 2016
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sacrificial Carrier Dicing of Semiconductor Wafers
- Publication number 20160079111
- Publication date Mar 17, 2016
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TSV DEVICE PACKAGE FOR CIRCUIT BOARD CONNECTION
- Publication number 20160035693
- Publication date Feb 4, 2016
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TSV DEVICE PACKAGE FOR CIRCUIT BOARD CONNECTION
- Publication number 20160035701
- Publication date Feb 4, 2016
- International Business Machines Corporation
- David J. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TSV DEVICE PACKAGE TO WHICH OTHER SEMICONDUCTOR DEVIC...
- Publication number 20160035632
- Publication date Feb 4, 2016
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor TSV device package to which other semiconductor devic...
- Publication number 20150206863
- Publication date Jul 23, 2015
- International Business Machines Corporation
- Richard Stephen Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED HEAT SPREADER WITH ELECTRICAL PROPERTIES
- Publication number 20150179542
- Publication date Jun 25, 2015
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Contact Alignment Posts
- Publication number 20130157455
- Publication date Jun 20, 2013
- International Buiness Machines Corporation
- David Justin West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Contact Alignment Posts
- Publication number 20120032321
- Publication date Feb 9, 2012
- International Business Machines Corporation
- David J. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERCOMING LAMINATE WARPAGE AND MISALIGNMENT IN FLIP-CHIP PACKAGES
- Publication number 20110151627
- Publication date Jun 23, 2011
- International Business Machines Corporation
- Richard S. Graf
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CHIP CARRIERS WITH SIDE TERMINALS
- Publication number 20110048790
- Publication date Mar 3, 2011
- International Business Machines Corporation
- Richard Stephen Graf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

David J. West

Person

Patents Grantslast 30 patents

Chip-on-chip structure and methods of manufacture

Semiconductor TSV device package to which other semiconductor devic...

IC structure with angled interconnect elements

Semiconductor TSV device package to which other semiconductor devic...

Semiconductor TSV device package for circuit board connection

Semiconductor TSV device package for circuit board connection

Sacrificial carrier dicing of semiconductor wafers

Sacrificial carrier dicing of semiconductor wafers

Method of fabricating printed circuit boards

Embedded heat spreader with electrical properties

Electrical contact alignment posts

Electrical contact alignment posts

Overcoming laminate warpage and misalignment in flip-chip packages

Patents Applicationslast 30 patents

CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE

CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE

IC STRUCTURE WITH ANGLED INTERCONNECT ELEMENTS

CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE

CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE

Sacrificial Carrier Dicing of Semiconductor Wafers

Sacrificial Carrier Dicing of Semiconductor Wafers

SEMICONDUCTOR TSV DEVICE PACKAGE FOR CIRCUIT BOARD CONNECTION

SEMICONDUCTOR TSV DEVICE PACKAGE FOR CIRCUIT BOARD CONNECTION

SEMICONDUCTOR TSV DEVICE PACKAGE TO WHICH OTHER SEMICONDUCTOR DEVIC...

Semiconductor TSV device package to which other semiconductor devic...

EMBEDDED HEAT SPREADER WITH ELECTRICAL PROPERTIES

Electrical Contact Alignment Posts

Electrical Contact Alignment Posts

OVERCOMING LAMINATE WARPAGE AND MISALIGNMENT IN FLIP-CHIP PACKAGES

CHIP CARRIERS WITH SIDE TERMINALS