David James Alcoe

Person

Vestal, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
High density connector for interconnecting fine pitch circuit packa...
- Patent number 7,972,178
- Issue date Jul 5, 2011
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit electronic package with standoffs
- Patent number 7,851,906
- Issue date Dec 14, 2010
- Endicott Interconnect Technologies, Inc.
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable thickness thermal interposer and electronic package util...
- Patent number 7,629,684
- Issue date Dec 8, 2009
- Endicott Interconnect Technologies, Inc.
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hyperbga buildup laminate
- Patent number 7,213,336
- Issue date May 8, 2007
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally enhanced lid for multichip modules
- Patent number 7,186,590
- Issue date Mar 6, 2007
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component test apparatus
- Patent number 7,109,732
- Issue date Sep 19, 2006
- Endicott Interconnect Technologies, Inc.
- David Alcoe
- G01 - MEASURING TESTING
Information Patent Grant
Electronic package with optimized circuitization pattern
- Patent number 7,088,008
- Issue date Aug 8, 2006
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pinned electronic package with strengthened conductive pad
- Patent number 7,087,846
- Issue date Aug 8, 2006
- Endicott Interconnect Technologies, Inc.
- David Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of reforming reformable members of an electronic package and...
- Patent number 7,014,094
- Issue date Mar 21, 2006
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device carrier adapted for transmitting high frequency s...
- Patent number 7,015,574
- Issue date Mar 21, 2006
- International Business Machines Corporation
- David Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package having a thermal stretching layer
- Patent number 6,992,379
- Issue date Jan 31, 2006
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of reforming reformable members of an electronic package and...
- Patent number 6,978,542
- Issue date Dec 27, 2005
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module with adhesively attached heat sink
- Patent number 6,949,415
- Issue date Sep 27, 2005
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 6,887,779
- Issue date May 3, 2005
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hyperbga buildup laminate
- Patent number 6,879,492
- Issue date Apr 12, 2005
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress-relieving heatsink structure and method of attachment to an...
- Patent number 6,830,960
- Issue date Dec 14, 2004
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant laminate connector
- Patent number 6,816,385
- Issue date Nov 9, 2004
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package with strengthened conductive pad
- Patent number 6,815,837
- Issue date Nov 9, 2004
- Endicott Interconnect Technologies, Inc.
- David Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module with adhesively attached heat sink
- Patent number 6,744,132
- Issue date Jun 1, 2004
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for semiconductor chip carriers
- Patent number 6,740,959
- Issue date May 25, 2004
- International Business Machines Corporation
- David James Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 6,720,502
- Issue date Apr 13, 2004
- International Business Machine Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress reducing stiffener ring
- Patent number 6,703,704
- Issue date Mar 9, 2004
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an apparatus to reduce thermal fatigue stress on...
- Patent number 6,667,557
- Issue date Dec 23, 2003
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced lid for multichip modules
- Patent number 6,665,187
- Issue date Dec 16, 2003
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-stress compressive heatsink structure
- Patent number 6,654,250
- Issue date Nov 25, 2003
- International Business Machines Corporation
- David James Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package with thermally conductive standoff
- Patent number 6,631,078
- Issue date Oct 7, 2003
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of reforming reformable members of an electronic package and...
- Patent number 6,583,354
- Issue date Jun 24, 2003
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus to reduce thermal fatigue stress on flip chip solder conn...
- Patent number 6,570,259
- Issue date May 27, 2003
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress-relieving heatsink structure and method of attachment to an...
- Patent number 6,455,924
- Issue date Sep 24, 2002
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making electronic package with compressible heatsink stru...
- Patent number 6,255,136
- Issue date Jul 3, 2001
- International Business Machines Corporation
- David James Alcoe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY CONNECTOR FOR INTERCONNECTING FINE PITCH CIRCUIT PACKA...
- Publication number 20100323558
- Publication date Dec 23, 2010
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible circuit electronic package with standoffs
- Publication number 20080237840
- Publication date Oct 2, 2008
- Endicott Interconnect Technologies, Inc.
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making circuitized substrate with solder balls having rou...
- Publication number 20080164300
- Publication date Jul 10, 2008
- Endicott Interconnect Technologies, Inc.
- David J. Alcoe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adjustable thickness thermal interposer and electronic package util...
- Publication number 20070230130
- Publication date Oct 4, 2007
- Endicott Interconnect Technologies, Inc.
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REFORMING REFORMABLE MEMBERS OF AN ELECTRONIC PACKAGE AND...
- Publication number 20060005986
- Publication date Jan 12, 2006
- David J. Alcoe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Hyperbga buildup laminate
- Publication number 20050099783
- Publication date May 12, 2005
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component test apparatus
- Publication number 20050022376
- Publication date Feb 3, 2005
- Endicott Interconnect Technologies, Inc.
- David Alcoe
- G01 - MEASURING TESTING
Information Patent Application
Electronic device carrier adapted for transmitting high frequency s...
- Publication number 20050006137
- Publication date Jan 13, 2005
- Dave Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic pckage with conductive pad capable of withstanding signi...
- Publication number 20040238970
- Publication date Dec 2, 2004
- Endicott Interconnect Technologies, Inc.
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pinned electronic package with strengthened conductive pad
- Publication number 20040182604
- Publication date Sep 23, 2004
- David Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip carrier with optimized circuitization pattern
- Publication number 20040183211
- Publication date Sep 23, 2004
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE WITH STRENGTHENED CONDUCTIVE PAD
- Publication number 20040183212
- Publication date Sep 23, 2004
- Endicott Interconnect Technologies, Inc.
- David Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Module with adhesively attached heat sink
- Publication number 20040164401
- Publication date Aug 26, 2004
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit structure
- Publication number 20040099939
- Publication date May 27, 2004
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermally enhanced lid for multichip modules
- Publication number 20040057214
- Publication date Mar 25, 2004
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN APPARATUS TO REDUCE THERMAL FATIGUE STRESS ON...
- Publication number 20030210531
- Publication date Nov 13, 2003
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of reforming reformable members of an electronic package and...
- Publication number 20030196826
- Publication date Oct 23, 2003
- David J. Alcoe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Module with adhesively attached heat sink
- Publication number 20030141586
- Publication date Jul 31, 2003
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH THERMALLY CONDUCTIVE STANDOFF
- Publication number 20030129863
- Publication date Jul 10, 2003
- International Business Machines Corporation
- David J. Alcoe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic package having a thermal stretching layer
- Publication number 20030047807
- Publication date Mar 13, 2003
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI shielding for semiconductor chip carriers
- Publication number 20030025180
- Publication date Feb 6, 2003
- International Business Machines Corporation
- David James Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress-relieving heatsink structure and method of attachment to an...
- Publication number 20030001248
- Publication date Jan 2, 2003
- Internationl Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hyperbga buildup laminate
- Publication number 20020139578
- Publication date Oct 3, 2002
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus to reduce thermal fatigue stress on flip chip solder conn...
- Publication number 20020135063
- Publication date Sep 26, 2002
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-RELIEVING HEATSINK STRUCTURE AND METHOD OF ATTACHMENT TO AN...
- Publication number 20020135052
- Publication date Sep 26, 2002
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REFORMING REFORMABLE MEMBERS OF AN ELECTRONIC PACKAGE AND...
- Publication number 20020046856
- Publication date Apr 25, 2002
- DAVID J. ALCOE
- H01 - BASIC ELECTRIC ELEMENTS

David James Alcoe

Person

Patents Grantslast 30 patents

High density connector for interconnecting fine pitch circuit packa...

Flexible circuit electronic package with standoffs

Adjustable thickness thermal interposer and electronic package util...

Hyperbga buildup laminate

Thermally enhanced lid for multichip modules

Electronic component test apparatus

Electronic package with optimized circuitization pattern

Pinned electronic package with strengthened conductive pad

Method of reforming reformable members of an electronic package and...

Electronic device carrier adapted for transmitting high frequency s...

Electronic package having a thermal stretching layer

Method of reforming reformable members of an electronic package and...

Module with adhesively attached heat sink

Integrated circuit structure

Hyperbga buildup laminate

Stress-relieving heatsink structure and method of attachment to an...

Compliant laminate connector

Electronic package with strengthened conductive pad

Module with adhesively attached heat sink

EMI shielding for semiconductor chip carriers

Integrated circuit structure

Stress reducing stiffener ring

Method of forming an apparatus to reduce thermal fatigue stress on...

Thermally enhanced lid for multichip modules

Low-stress compressive heatsink structure

Electronic package with thermally conductive standoff

Method of reforming reformable members of an electronic package and...

Apparatus to reduce thermal fatigue stress on flip chip solder conn...

Stress-relieving heatsink structure and method of attachment to an...

Method of making electronic package with compressible heatsink stru...

Patents Applicationslast 30 patents

HIGH DENSITY CONNECTOR FOR INTERCONNECTING FINE PITCH CIRCUIT PACKA...

Flexible circuit electronic package with standoffs

Method of making circuitized substrate with solder balls having rou...

Adjustable thickness thermal interposer and electronic package util...

METHOD OF REFORMING REFORMABLE MEMBERS OF AN ELECTRONIC PACKAGE AND...

Hyperbga buildup laminate

Electronic component test apparatus

Electronic device carrier adapted for transmitting high frequency s...

Electronic pckage with conductive pad capable of withstanding signi...

Pinned electronic package with strengthened conductive pad

Chip carrier with optimized circuitization pattern

ELECTRONIC PACKAGE WITH STRENGTHENED CONDUCTIVE PAD

Module with adhesively attached heat sink

Integrated circuit structure

Thermally enhanced lid for multichip modules

METHOD OF FORMING AN APPARATUS TO REDUCE THERMAL FATIGUE STRESS ON...

Method of reforming reformable members of an electronic package and...

Module with adhesively attached heat sink

ELECTRONIC PACKAGE WITH THERMALLY CONDUCTIVE STANDOFF

Electronic package having a thermal stretching layer

EMI shielding for semiconductor chip carriers

Stress-relieving heatsink structure and method of attachment to an...

Hyperbga buildup laminate

Apparatus to reduce thermal fatigue stress on flip chip solder conn...

STRESS-RELIEVING HEATSINK STRUCTURE AND METHOD OF ATTACHMENT TO AN...

METHOD OF REFORMING REFORMABLE MEMBERS OF AN ELECTRONIC PACKAGE AND...