Number | Name | Date | Kind |
---|---|---|---|
5045921 | Lin et al. | Sep 1991 | A |
5170931 | Desai et al. | Dec 1992 | A |
5541450 | Jones et al. | Jul 1996 | A |
5661902 | Katchmar | Sep 1997 | A |
5714803 | Queyssac | Feb 1998 | A |
5781412 | de Sorgo | Jul 1998 | A |
5804882 | Tsukagoshi et al. | Sep 1998 | A |
5805427 | Hoffman | Sep 1998 | A |
5889652 | Turturro | Mar 1999 | A |
5901041 | Davies et al. | May 1999 | A |
5931371 | Pao et al. | Aug 1999 | A |
6016007 | Sanger et al. | Jan 2000 | A |
6268239 | Ikeda | Jul 2001 | B1 |
6411513 | Bedard | Jun 2002 | B1 |
Entry |
---|
IBM Technical Disclosure Bulletin by V.D. Coombs, entitled “Chip Mounting With Prestretched Joints”, vol. 16, No. 3, Aug. 1973, pp. 767. |
IBM Technical Disclosure Bulletin by A.F. Galloway, et al., entitled “Stand-Offs For Chip Allignment As Well As Controlled Collapse In Chip Joining”, vol. 23, No. 5, Oct. 1980, pp. 2156-2158. |
IBM Technical Disclosure Bulletin by R.A. Foster, entitled “Area Array Substrate-To-Carrier Interconnection Using Corner Standoff”, vol. 29, No. 11, Apr. 1987, pp. 4736-4737. |