David L. Crouthamel

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Bethlehem, PA, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit chip assembly having array of thermally conducti...
- Patent number 7,982,307
- Issue date Jul 19, 2011
- Agere Systems Inc.
- Ahmed Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic packages
- Patent number 7,671,436
- Issue date Mar 2, 2010
- Agere Systems Inc.
- Ahmed Nur Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low thermal resistance assembly for flip chip applications
- Patent number 7,479,695
- Issue date Jan 20, 2009
- Agere Systems Inc.
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Flip-Chip Bonding Using Copper Pillars
- Publication number 20150243617
- Publication date Aug 27, 2015
- LSI Corporation
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic packages
- Publication number 20090273078
- Publication date Nov 5, 2009
- Ahmed Nur Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip Chip Assembly Having Improved Thermal Dissipation
- Publication number 20080116567
- Publication date May 22, 2008
- Ahmed Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low thermal resistance assembly for flip chip applications
- Publication number 20070216034
- Publication date Sep 20, 2007
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulating compound having reduced dielectric constant
- Publication number 20050287350
- Publication date Dec 29, 2005
- David L. Crouthamel
- H01 - BASIC ELECTRIC ELEMENTS