David L. Gardell

Person

Fairfax, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Probe card assembly
- Patent number 11,085,949
- Issue date Aug 10, 2021
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Repairable rigid test probe card assembly
- Patent number 10,732,202
- Issue date Aug 4, 2020
- GLOBALFOUNDRIES Inc.
- Craig M. Bocash
- G01 - MEASURING TESTING
Information Patent Grant
Probe card assembly
- Patent number 10,578,648
- Issue date Mar 3, 2020
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Solder bump array probe tip structure for laser cleaning
- Patent number 10,571,490
- Issue date Feb 25, 2020
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Multiple contact probe head disassembly method and system
- Patent number 10,429,414
- Issue date Oct 1, 2019
- GLOBALFOUNDRIES Inc.
- Marvin G. L. Montaque
- G01 - MEASURING TESTING
Information Patent Grant
Organic probe substrate
- Patent number 10,288,645
- Issue date May 14, 2019
- GLOBALFOUNDRIES Inc.
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Gimbal assembly test system and method
- Patent number 10,041,976
- Issue date Aug 7, 2018
- GLOBALFOUNDRIES Inc.
- David L. Gardell
- G01 - MEASURING TESTING
Information Patent Grant
Solder bump array probe tip structure for laser cleaning
- Patent number 9,835,653
- Issue date Dec 5, 2017
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Probe card assembly
- Patent number 9,797,928
- Issue date Oct 24, 2017
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Programmable active thermal control
- Patent number 9,152,517
- Issue date Oct 6, 2015
- International Business Machines Corporation
- Harold Chase
- G01 - MEASURING TESTING
Information Patent Grant
Methodologies and test configurations for testing thermal interface...
- Patent number 9,116,200
- Issue date Aug 25, 2015
- International Business Machines Corporation
- Dustin Fregeau
- G01 - MEASURING TESTING
Information Patent Grant
Rigid probe with compliant characteristics
- Patent number 9,086,433
- Issue date Jul 21, 2015
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Rigid probe with compliant characteristics
- Patent number 9,081,034
- Issue date Jul 14, 2015
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Solder bump testing apparatus and methods of use
- Patent number 8,917,105
- Issue date Dec 23, 2014
- International Business Machines Corporation
- David L. Gardell
- G01 - MEASURING TESTING
Information Patent Grant
Vertical probe assembly with air channel
- Patent number 8,836,356
- Issue date Sep 16, 2014
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Thermal interface material, test structure and method of use
- Patent number 8,686,749
- Issue date Apr 1, 2014
- International Business Machines Corporation
- Brian M. Erwin
- G01 - MEASURING TESTING
Information Patent Grant
Methodologies and test configurations for testing thermal interface...
- Patent number 8,471,575
- Issue date Jun 25, 2013
- International Business Machines Corporation
- Dustin Fregeau
- G01 - MEASURING TESTING
Information Patent Grant
Containment of a wafer-chuck thermal interface fluid
- Patent number 8,002,025
- Issue date Aug 23, 2011
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Enhanced thermo-oxidative stability thermal interface compositions...
- Patent number 7,964,542
- Issue date Jun 21, 2011
- International Business Machines Corporation
- Krishna G. Sachdev
- C10 - PETROLEUM, GAS OR COKE INDUSTRIES TECHNICAL GASES CONTAINING CARBON MON...
Information Patent Grant
Liquid thermal interface having mixture of linearly structured poly...
- Patent number 7,808,099
- Issue date Oct 5, 2010
- International Business Machines Corporation
- Randall J. Bertrand
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Systems and methods for cooling an electronic device
- Patent number 7,684,194
- Issue date Mar 23, 2010
- International Business Machines Corporation
- Govindarajan Natarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid recovery, collection method and apparatus in a non-recircula...
- Patent number 7,567,090
- Issue date Jul 28, 2009
- International Business Machines Corporation
- Normand Cote
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for temporary thermal coupling of an electronic device to...
- Patent number 7,332,927
- Issue date Feb 19, 2008
- International Business Machines Corporation
- Paul J. Aube
- G01 - MEASURING TESTING
Information Patent Grant
Device burn in utilizing voltage control
- Patent number 7,265,561
- Issue date Sep 4, 2007
- International Business Machines Corporation
- Dennis R. Conti
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for temporary thermal coupling of an electroni...
- Patent number 7,259,580
- Issue date Aug 21, 2007
- International Business Machines Corporation
- Paul J. Aube
- G01 - MEASURING TESTING
Information Patent Grant
Probe card assembly
- Patent number 7,084,651
- Issue date Aug 1, 2006
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for functional and stress testing of exposed chip land gr...
- Patent number 6,911,836
- Issue date Jun 28, 2005
- International Business Machines Corporation
- Lonnie J. Cannon
- G01 - MEASURING TESTING
Information Patent Grant
Method for wafer test and wafer test system for implementing the me...
- Patent number 6,720,789
- Issue date Apr 13, 2004
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Force and centrality measuring tool
- Patent number 6,590,404
- Issue date Jul 8, 2003
- International Business Machines Corp.
- David L. Gardell
- G01 - MEASURING TESTING
Information Patent Grant
Method of burning in an integrated circuit chip package
- Patent number 6,577,146
- Issue date Jun 10, 2003
- International Business Machines Corporation
- Roger G. Gamache
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
PROBE CARD ASSEMBLY
- Publication number 20200049738
- Publication date Feb 13, 2020
- International Business Machines Corporation
- David M. AUDETTE
- G01 - MEASURING TESTING
Information Patent Application
GIMBAL ASSEMBLY TEST SYSTEM AND METHOD
- Publication number 20180217184
- Publication date Aug 2, 2018
- GLOBALFOUNDRIES INC.
- David L. Gardell
- G01 - MEASURING TESTING
Information Patent Application
SOLDER BUMP ARRAY PROBE TIP STRUCTURE FOR LASER CLEANING
- Publication number 20180059141
- Publication date Mar 1, 2018
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD ASSEMBLY
- Publication number 20170356933
- Publication date Dec 14, 2017
- International Business Machines Corporation
- David M. AUDETTE
- G01 - MEASURING TESTING
Information Patent Application
REPAIRABLE RIGID TEST PROBE CARD ASSEMBLY
- Publication number 20170285068
- Publication date Oct 5, 2017
- GLOBALFOUNDRIES INC.
- CRAIG M. BOCASH
- G01 - MEASURING TESTING
Information Patent Application
GIMBAL ASSEMBLY TEST SYSTEM AND METHOD
- Publication number 20170219626
- Publication date Aug 3, 2017
- GLOBALFOUNDRIES INC.
- David L. Gardell
- G01 - MEASURING TESTING
Information Patent Application
MULTIPLE CONTACT PROBE HEAD DISASSEMBLY METHOD AND SYSTEM
- Publication number 20170219631
- Publication date Aug 3, 2017
- GLOBALFOUNDRIES INC.
- Marvin G. L. Montaque
- G01 - MEASURING TESTING
Information Patent Application
ORGANIC PROBE SUBSTRATE
- Publication number 20170003318
- Publication date Jan 5, 2017
- International Business Machines Corporation
- David M. AUDETTE
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD ASSEMBLY
- Publication number 20160077129
- Publication date Mar 17, 2016
- International Business Machines Corporation
- David M. AUDETTE
- G01 - MEASURING TESTING
Information Patent Application
SOLDER BUMP ARRAY PROBE TIP STRUCTURE FOR LASER CLEANING
- Publication number 20150331014
- Publication date Nov 19, 2015
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
RIGID PROBE WITH COMPLIANT CHARACTERISTICS
- Publication number 20140167801
- Publication date Jun 19, 2014
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
RIGID PROBE WITH COMPLIANT CHARACTERISTICS
- Publication number 20140167802
- Publication date Jun 19, 2014
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
SOLDER BUMP TESTING APPARATUS AND METHODS OF USE
- Publication number 20130314117
- Publication date Nov 28, 2013
- International Business Machines Corporation
- David L. GARDELL
- G01 - MEASURING TESTING
Information Patent Application
METHODOLOGIES AND TEST CONFIGURATIONS FOR TESTING THERMAL INTERFACE...
- Publication number 20130229198
- Publication date Sep 5, 2013
- International Business Machines Corporation
- Dustin FREGEAU
- G01 - MEASURING TESTING
Information Patent Application
VERTICAL PROBE ASSEMBLY WITH AIR CHANNEL
- Publication number 20130147502
- Publication date Jun 13, 2013
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
PROGRAMMABLE ACTIVE THERMAL CONTROL
- Publication number 20120272100
- Publication date Oct 25, 2012
- International Business Machines Corporation
- Harold Chase
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Methodologies and Test Configurations for Testing Thermal Interface...
- Publication number 20110267082
- Publication date Nov 3, 2011
- International Business Machines Corporation
- Dustin FREGEAU
- G01 - MEASURING TESTING
Information Patent Application
THERMAL INTERFACE MATERIAL, TEST STRUCTURE AND METHOD OF USE
- Publication number 20110267084
- Publication date Nov 3, 2011
- International Business Machines Corporation
- Brian M. ERWIN
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR COOLING AN ELECTRONIC DEVICE
- Publication number 20090303684
- Publication date Dec 10, 2009
- International Business Machines Corporation
- Govindarajan Natarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID THERMAL INTERFACE HAVING MIXTURE OF LINEARLY STRUCTURED POLY...
- Publication number 20090281254
- Publication date Nov 12, 2009
- International Business Machines Corporation
- Randall J. Bertrand
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Liquid Recovery, Collection Method And Apparatus In A Non-Recircula...
- Publication number 20080116921
- Publication date May 22, 2008
- Normand Cote
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS FOR TEMPORARY THERMAL COUPLING OF AN ELECTRONIC DEVICE TO...
- Publication number 20070285116
- Publication date Dec 13, 2007
- Paul J. Aube
- G01 - MEASURING TESTING
Information Patent Application
CONTAINMENT OF A WAFER-CHUCK THERMAL INTERFACE FLUID
- Publication number 20070252610
- Publication date Nov 1, 2007
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
Enhanced thermo-oxidative stability thermal interface compositions...
- Publication number 20070161521
- Publication date Jul 12, 2007
- Krishna G. Sachdev
- C10 - PETROLEUM, GAS OR COKE INDUSTRIES TECHNICAL GASES CONTAINING CARBON MON...
Information Patent Application
METHOD AND APPARATUS FOR TEMPORARY THERMAL COUPLING OF AN ELECTRONI...
- Publication number 20060186909
- Publication date Aug 24, 2006
- International Business Machines Corporation
- Paul J. Aube
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD ASSEMBLY
- Publication number 20060022685
- Publication date Feb 2, 2006
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
DEVICE BURN IN UTILIZING VOLTAGE CONTROL
- Publication number 20050068053
- Publication date Mar 31, 2005
- International Business Machines Corporation
- Dennis R. Conti
- G01 - MEASURING TESTING
Information Patent Application
Apparatus for functional and stress testing of exposed chip land gr...
- Publication number 20050040838
- Publication date Feb 24, 2005
- International Business Machines Corporation
- Lonnie J. Cannon
- G01 - MEASURING TESTING
Information Patent Application
Force and centrality measuring tool
- Publication number 20030006791
- Publication date Jan 9, 2003
- David L. Gardell
- G01 - MEASURING TESTING
Information Patent Application
Method of burning in an integrated circuit chip package
- Publication number 20020175694
- Publication date Nov 28, 2002
- Roger G. Gamache
- G01 - MEASURING TESTING

David L. Gardell

Person

Patents Grantslast 30 patents

Probe card assembly

Repairable rigid test probe card assembly

Probe card assembly

Solder bump array probe tip structure for laser cleaning

Multiple contact probe head disassembly method and system

Organic probe substrate

Gimbal assembly test system and method

Solder bump array probe tip structure for laser cleaning

Probe card assembly

Programmable active thermal control

Methodologies and test configurations for testing thermal interface...

Rigid probe with compliant characteristics

Rigid probe with compliant characteristics

Solder bump testing apparatus and methods of use

Vertical probe assembly with air channel

Thermal interface material, test structure and method of use

Methodologies and test configurations for testing thermal interface...

Containment of a wafer-chuck thermal interface fluid

Enhanced thermo-oxidative stability thermal interface compositions...

Liquid thermal interface having mixture of linearly structured poly...

Systems and methods for cooling an electronic device

Liquid recovery, collection method and apparatus in a non-recircula...

Apparatus for temporary thermal coupling of an electronic device to...

Device burn in utilizing voltage control

Method and apparatus for temporary thermal coupling of an electroni...

Probe card assembly

Apparatus for functional and stress testing of exposed chip land gr...

Method for wafer test and wafer test system for implementing the me...

Force and centrality measuring tool

Method of burning in an integrated circuit chip package

Patents Applicationslast 30 patents

PROBE CARD ASSEMBLY

GIMBAL ASSEMBLY TEST SYSTEM AND METHOD

SOLDER BUMP ARRAY PROBE TIP STRUCTURE FOR LASER CLEANING

PROBE CARD ASSEMBLY

REPAIRABLE RIGID TEST PROBE CARD ASSEMBLY

GIMBAL ASSEMBLY TEST SYSTEM AND METHOD

MULTIPLE CONTACT PROBE HEAD DISASSEMBLY METHOD AND SYSTEM

ORGANIC PROBE SUBSTRATE

PROBE CARD ASSEMBLY

SOLDER BUMP ARRAY PROBE TIP STRUCTURE FOR LASER CLEANING

RIGID PROBE WITH COMPLIANT CHARACTERISTICS

RIGID PROBE WITH COMPLIANT CHARACTERISTICS

SOLDER BUMP TESTING APPARATUS AND METHODS OF USE

METHODOLOGIES AND TEST CONFIGURATIONS FOR TESTING THERMAL INTERFACE...

VERTICAL PROBE ASSEMBLY WITH AIR CHANNEL

PROGRAMMABLE ACTIVE THERMAL CONTROL

Methodologies and Test Configurations for Testing Thermal Interface...

THERMAL INTERFACE MATERIAL, TEST STRUCTURE AND METHOD OF USE

SYSTEMS AND METHODS FOR COOLING AN ELECTRONIC DEVICE

LIQUID THERMAL INTERFACE HAVING MIXTURE OF LINEARLY STRUCTURED POLY...

Liquid Recovery, Collection Method And Apparatus In A Non-Recircula...

APPARATUS FOR TEMPORARY THERMAL COUPLING OF AN ELECTRONIC DEVICE TO...

CONTAINMENT OF A WAFER-CHUCK THERMAL INTERFACE FLUID

Enhanced thermo-oxidative stability thermal interface compositions...

METHOD AND APPARATUS FOR TEMPORARY THERMAL COUPLING OF AN ELECTRONI...

PROBE CARD ASSEMBLY

DEVICE BURN IN UTILIZING VOLTAGE CONTROL

Apparatus for functional and stress testing of exposed chip land gr...

Force and centrality measuring tool

Method of burning in an integrated circuit chip package