David L. Questad

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 10,750,615
- Issue date Aug 18, 2020
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat laminate, symmetrical test structures and method of use to gau...
- Patent number 10,699,972
- Issue date Jun 30, 2020
- International Business Machines Corporation
- William E. Bernier
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Test cell for laminate and method
- Patent number 10,381,276
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 10,368,441
- Issue date Jul 30, 2019
- International Business Machines Corporation
- Michael A. Gaynes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink attachment on existing heat sinks
- Patent number 10,342,160
- Issue date Jul 2, 2019
- International Business Machines Corporation
- Louis-Marie Achard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Test cell for laminate and method
- Patent number 10,249,548
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fixture to constrain laminate and method of assembly
- Patent number 10,014,273
- Issue date Jul 3, 2018
- International Business Machines Corporation
- Thomas E. Lombardi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 9,974,179
- Issue date May 15, 2018
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat laminate, symmetrical test structures and method of use to gau...
- Patent number 9,899,279
- Issue date Feb 20, 2018
- International Business Machines Corporation
- William E. Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink attachment on existing heat sinks
- Patent number 9,883,612
- Issue date Jan 30, 2018
- International Business Machines Corporation
- Louis-Marie Achard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 9,627,784
- Issue date Apr 18, 2017
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic components on trenched substrates and method of forming...
- Patent number 9,508,789
- Issue date Nov 29, 2016
- GLOBALFOUNDRIES Inc.
- David Questad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture to constrain laminate and method of assembly
- Patent number 9,455,234
- Issue date Sep 27, 2016
- International Business Machines Corporation
- Thomas E. Lombardi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Construction of reliable stacked via in electronic substrates—verti...
- Patent number 9,099,458
- Issue date Aug 4, 2015
- International Business Machines Corporation
- Karan Kacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder interconnect with non-wettable sidewall pillars and methods...
- Patent number 9,018,760
- Issue date Apr 28, 2015
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat laminate, symmetrical test structures and method of use to gau...
- Patent number 8,957,531
- Issue date Feb 17, 2015
- International Business Machines Corporation
- William E. Bernier
- G01 - MEASURING TESTING
Information Patent Grant
Overcoming chip warping to enhance wetting of solder bumps and flip...
- Patent number 8,927,334
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Construction of reliable stacked via in electronic substrates—verti...
- Patent number 8,866,026
- Issue date Oct 21, 2014
- International Business Machines Corporation
- Karan Kacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optimization metallization for prevention of dielectric cracking un...
- Patent number 8,796,133
- Issue date Aug 5, 2014
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture to constrain laminate and method of assembly
- Patent number 8,759,151
- Issue date Jun 24, 2014
- International Business Machines Corporation
- Thomas E. Lombardi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Elastic modulus mapping of a chip carrier in a flip chip package
- Patent number 8,756,546
- Issue date Jun 17, 2014
- International Business Machines Corporation
- Erwin B. Cohen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic components on trenched substrates and method of forming...
- Patent number 8,659,119
- Issue date Feb 25, 2014
- International Business Machines Corporation
- Vijayeshwar D. Kharma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder interconnect with non-wettable sidewall pillars and methods...
- Patent number 8,637,392
- Issue date Jan 28, 2014
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clustered stacked vias for reliable electronic substrates
- Patent number 8,522,430
- Issue date Sep 3, 2013
- International Business Macines Corporation
- Karan Kacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal pad structure for thickness enhancement of polymer used in el...
- Patent number 8,508,043
- Issue date Aug 13, 2013
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust FBEOL and UBM structure of C4 interconnects
- Patent number 8,450,849
- Issue date May 28, 2013
- International Business Machines Corporation
- Minhua Lu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Dimensionally decoupled ball limiting metalurgy
- Patent number 8,338,286
- Issue date Dec 25, 2012
- International Business Machines Corporation
- Eric David Perfecto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset solder vias, methods of manufacturing and design structures
- Patent number 8,298,929
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Construction of reliable stacked via in electronic substrates—verti...
- Patent number 8,258,410
- Issue date Sep 4, 2012
- International Business Machines Corporation
- Karan Kacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clustered stacked vias for reliable electronic substrates
- Patent number 8,242,593
- Issue date Aug 14, 2012
- International Business Machines Corporation
- Karan Kacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20190281702
- Publication date Sep 12, 2019
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20180213645
- Publication date Jul 26, 2018
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT LAMINATE, SYMMETRICAL TEST STRUCTURES AND METHOD OF USE TO GAU...
- Publication number 20180082912
- Publication date Mar 22, 2018
- International Business Machines Corporation
- William E. Bernier
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
TEST CELL FOR LAMINATE AND METHOD
- Publication number 20180076101
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT SINK ATTACHMENT ON EXISTING HEAT SINKS
- Publication number 20180054915
- Publication date Feb 22, 2018
- International Business Machines Corporation
- Louis-Marie Achard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20170196089
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST CELL FOR LAMINATE AND METHOD
- Publication number 20170178982
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT SINK ATTACHMENT ON EXISTING HEAT SINKS
- Publication number 20160360645
- Publication date Dec 8, 2016
- International Business Machines Corporation
- Louis-Marie Achard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY
- Publication number 20160329297
- Publication date Nov 10, 2016
- International Business Machines Corporation
- Thomas E. LOMBARDI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLAT LAMINATE, SYMMETRICAL TEST STRUCTURES AND METHOD OF USE TO GAU...
- Publication number 20150036716
- Publication date Feb 5, 2015
- International Business Machines Corporation
- William E. Bernier
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY
- Publication number 20140197228
- Publication date Jul 17, 2014
- International Business Machines Corporation
- Thomas E. LOMBARDI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING...
- Publication number 20140151849
- Publication date Jun 5, 2014
- International Business Machines Corporation
- David Questad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERCOMING CHIP WARPING TO ENHANCE WETTING OF SOLDER BUMPS AND FLIP...
- Publication number 20140084453
- Publication date Mar 27, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER INTERCONNECT WITH NON-WETTABLE SIDEWALL PILLARS AND METHODS...
- Publication number 20140077367
- Publication date Mar 20, 2014
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC MODULUS MAPPING OF A CHIP CARRIER IN A FLIP CHIP PACKAGE
- Publication number 20140033148
- Publication date Jan 30, 2014
- International Business Machines Corporation
- Erwin B. Cohen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTIMIZATION METALLIZATION FOR PREVENTION OF DIELECTRIC CRACKING UN...
- Publication number 20140021622
- Publication date Jan 23, 2014
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PAD STRUCTURE FOR THICKNESS ENHANCEMENT OF POLYMER USED IN EL...
- Publication number 20130119534
- Publication date May 16, 2013
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat Laminate, Symmetrical Test Structures and Method of Use To Gau...
- Publication number 20130098176
- Publication date Apr 25, 2013
- International Business Machines Corporation
- William E. Bernier
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
CONSTRUCTION OF RELIABLE STACKED VIA IN ELECTRONIC SUBSTRATES - VER...
- Publication number 20120299195
- Publication date Nov 29, 2012
- International Business Machines Corporation
- Karan Kacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Robust FEBOL and UBM Structure of C4 Interconnects
- Publication number 20120286433
- Publication date Nov 15, 2012
- International Business Machines Corporation
- Minhua Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLUSTERED STACKED VIAS FOR RELIABLE ELECTRONIC SUBSTRATES
- Publication number 20120279061
- Publication date Nov 8, 2012
- International Business Machines Corporation
- Karan Kacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONSTRUCTION OF RELIABLE STACKED VIA IN ELECTRONIC SUBSTRATES - VER...
- Publication number 20120267158
- Publication date Oct 25, 2012
- International Business Machines Corporation
- Karan Kacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY
- Publication number 20120187180
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Thomas E. Lombardi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
OFFSET SOLDER VIAS, METHODS OF MANUFACTURING AND DESIGN STRUCTURES
- Publication number 20120139123
- Publication date Jun 7, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIMENSIONALLY DECOUPLED BALL LIMITING METALURGY
- Publication number 20120083114
- Publication date Apr 5, 2012
- International Business Machines Corporation
- ERIC DANIEL PERFECTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY
- Publication number 20120070940
- Publication date Mar 22, 2012
- International Business Machines Corporation
- Thomas E. Lombardi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Interconnect with Non-Wettable Sidewall Pillars and Methods...
- Publication number 20110193218
- Publication date Aug 11, 2011
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Robust FBEOL and UBM Structure of C4 Interconnects
- Publication number 20110063815
- Publication date Mar 17, 2011
- International Business Machines Corporation
- Minhua Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures and methods to improve lead-free C4 interconnect reliabi...
- Publication number 20110006422
- Publication date Jan 13, 2011
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING...
- Publication number 20100276784
- Publication date Nov 4, 2010
- International Business Machines Corporation
- David Questad
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

David L. Questad

Person

Patents Grantslast 30 patents

Method and apparatus for strain relieving surface mount attached co...

Flat laminate, symmetrical test structures and method of use to gau...

Test cell for laminate and method

Method and apparatus for strain relieving surface mount attached co...

Heat sink attachment on existing heat sinks

Test cell for laminate and method

Fixture to constrain laminate and method of assembly

Method and apparatus for strain relieving surface mount attached co...

Flat laminate, symmetrical test structures and method of use to gau...

Heat sink attachment on existing heat sinks

Method and apparatus for strain relieving surface mount attached co...

Electronic components on trenched substrates and method of forming...

Fixture to constrain laminate and method of assembly

Construction of reliable stacked via in electronic substrates—verti...

Solder interconnect with non-wettable sidewall pillars and methods...

Flat laminate, symmetrical test structures and method of use to gau...

Overcoming chip warping to enhance wetting of solder bumps and flip...

Construction of reliable stacked via in electronic substrates—verti...

Optimization metallization for prevention of dielectric cracking un...

Fixture to constrain laminate and method of assembly

Elastic modulus mapping of a chip carrier in a flip chip package

Electronic components on trenched substrates and method of forming...

Solder interconnect with non-wettable sidewall pillars and methods...

Clustered stacked vias for reliable electronic substrates

Metal pad structure for thickness enhancement of polymer used in el...

Robust FBEOL and UBM structure of C4 interconnects

Dimensionally decoupled ball limiting metalurgy

Offset solder vias, methods of manufacturing and design structures

Construction of reliable stacked via in electronic substrates—verti...

Clustered stacked vias for reliable electronic substrates

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

FLAT LAMINATE, SYMMETRICAL TEST STRUCTURES AND METHOD OF USE TO GAU...

TEST CELL FOR LAMINATE AND METHOD

HEAT SINK ATTACHMENT ON EXISTING HEAT SINKS

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

TEST CELL FOR LAMINATE AND METHOD

HEAT SINK ATTACHMENT ON EXISTING HEAT SINKS

FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY

FLAT LAMINATE, SYMMETRICAL TEST STRUCTURES AND METHOD OF USE TO GAU...

FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY

ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING...

OVERCOMING CHIP WARPING TO ENHANCE WETTING OF SOLDER BUMPS AND FLIP...

SOLDER INTERCONNECT WITH NON-WETTABLE SIDEWALL PILLARS AND METHODS...

ELASTIC MODULUS MAPPING OF A CHIP CARRIER IN A FLIP CHIP PACKAGE

OPTIMIZATION METALLIZATION FOR PREVENTION OF DIELECTRIC CRACKING UN...

METAL PAD STRUCTURE FOR THICKNESS ENHANCEMENT OF POLYMER USED IN EL...

Flat Laminate, Symmetrical Test Structures and Method of Use To Gau...

CONSTRUCTION OF RELIABLE STACKED VIA IN ELECTRONIC SUBSTRATES - VER...

Robust FEBOL and UBM Structure of C4 Interconnects

CLUSTERED STACKED VIAS FOR RELIABLE ELECTRONIC SUBSTRATES

CONSTRUCTION OF RELIABLE STACKED VIA IN ELECTRONIC SUBSTRATES - VER...

FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY

OFFSET SOLDER VIAS, METHODS OF MANUFACTURING AND DESIGN STRUCTURES

DIMENSIONALLY DECOUPLED BALL LIMITING METALURGY

FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY

Solder Interconnect with Non-Wettable Sidewall Pillars and Methods...

Robust FBEOL and UBM Structure of C4 Interconnects

Structures and methods to improve lead-free C4 interconnect reliabi...

ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING...