David L. Vos

Person

Apalachin, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Phase-change material (PCM) embedded heat exchanger assembly for la...
- Patent number 10,923,876
- Issue date Feb 16, 2021
- Lockheed Martin Corporation
- Aleksandra Shepsis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated multi-chamber heat exchanger
- Patent number 10,914,535
- Issue date Feb 9, 2021
- Lockheed Martin Corporation
- David L. Vos
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated multi-chamber heat exchanger
- Patent number 10,816,280
- Issue date Oct 27, 2020
- Lockheed Martin Corporation
- David L. Vos
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for installing an insert for fluid-flow-through cooling of...
- Patent number 10,548,243
- Issue date Jan 28, 2020
- Lockheed Martin Corporation
- Brian W. Kaplun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated multi-chamber heat exchanger
- Patent number 10,527,362
- Issue date Jan 7, 2020
- Lockheed Martin Corporation
- David L. Vos
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated multi-chamber heat exchanger
- Patent number 10,461,018
- Issue date Oct 29, 2019
- Lockheed Martin Corporation
- David L. Vos
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated multi-chamber heat exchanger
- Patent number 10,371,462
- Issue date Aug 6, 2019
- Lockheed Martin Corporation
- David L. Vos
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for making an apparatus with fluid-flow-through cooling of...
- Patent number 10,362,713
- Issue date Jul 23, 2019
- Lockheed Martin Corporation
- Brian W. Kaplun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat exchanger construction using low temperature sinter techniques
- Patent number 9,851,161
- Issue date Dec 26, 2017
- Lockheed Martin Corporation
- David L. Vos
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Dimensionally tolerant multiband conformal antenna arrays
- Patent number 9,673,514
- Issue date Jun 6, 2017
- Lockheed Martin Corporation
- David L. Vos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid-cooled module for integrated circuit devices
- Patent number 9,510,479
- Issue date Nov 29, 2016
- Lockheed Martin Corporation
- David L. Vos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid-flow-through cooling of circuit boards
- Patent number 9,426,931
- Issue date Aug 23, 2016
- Lockheed Martin Corporation
- Brian W. Kaplun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor array packaging solution
- Patent number 9,389,103
- Issue date Jul 12, 2016
- Lockheed Martin Corporation
- James E. Bishop
- G01 - MEASURING TESTING
Information Patent Grant
Dimensionally tolerant multiband conformal antenna arrays
- Patent number 8,847,823
- Issue date Sep 30, 2014
- Lockheed Martin Corporation
- David L. Vos
- B32 - LAYERED PRODUCTS
Information Patent Grant
Fluid-cooled module for integrated circuit devices
- Patent number 8,730,673
- Issue date May 20, 2014
- Lockheed Martin Corporation
- David L. Vos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance large tolerance heat sink
- Patent number 7,995,344
- Issue date Aug 9, 2011
- Lockheed Martin Corporation
- Charles H. Dando, III
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced reliability semiconductor package
- Patent number 7,719,108
- Issue date May 18, 2010
- Lockheed Martin Corporation
- William E. Murphy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reliability enhancement process
- Patent number 7,670,877
- Issue date Mar 2, 2010
- Lockheed Martin Corporation
- William E. Murphy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flow through cooling assemblies for conduction-cooled circuit modules
- Patent number 7,324,336
- Issue date Jan 29, 2008
- Lockheed Martin Corporation
- David L. Vos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-sustaining environmental control unit
- Patent number 7,272,468
- Issue date Sep 18, 2007
- Lockheed Martin Corporation
- J. Claude Caci
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-sustaining environmental control unit
- Patent number 7,203,574
- Issue date Apr 10, 2007
- Lockheed Martin Corporation
- J. Claude Caci
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extended temperature range fluorescent lamp
- Patent number 6,479,931
- Issue date Nov 12, 2002
- Lockheed Martin Corporation
- Gerhard George Lange
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus facilitating use of cots electronics in harsh environments
- Patent number 6,330,152
- Issue date Dec 11, 2001
- David L. Vos
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Thermally conductive vibration isolators
- Patent number 6,151,216
- Issue date Nov 21, 2000
- Lockheed Martin Corporation
- David L. Vos
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Thermally conductive vibration isolators
- Patent number 6,002,588
- Issue date Dec 14, 1999
- Lockheed Martin Corporation
- David L. Vos
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED MULTI-CHAMBER HEAT EXCHANGER
- Publication number 20180043482
- Publication date Feb 15, 2018
- Lockheed Martin Corporation
- David L. Vos
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
INTEGRATED MULTI-CHAMBER HEAT EXCHANGER
- Publication number 20180043480
- Publication date Feb 15, 2018
- Lockheed Martin Corporation
- David L. Vos
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
INTEGRATED MULTI-CHAMBER HEAT EXCHANGER
- Publication number 20180043481
- Publication date Feb 15, 2018
- Lockheed Martin Corporation
- David L. Vos
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
INTEGRATED MULTI-CHAMBER HEAT EXCHANGER
- Publication number 20170082371
- Publication date Mar 23, 2017
- Lockheed Martin Corporation
- David L. Vos
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED MULTI-CHAMBER HEAT EXCHANGER
- Publication number 20170082372
- Publication date Mar 23, 2017
- Lockheed Martin Corporation
- David L. Vos
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUID-FLOW-THROUGH COOLING OF CIRCUIT BOARDS
- Publication number 20160278240
- Publication date Sep 22, 2016
- Lockheed Martin Corporation
- Brian W. Kaplun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUID-FLOW-THROUGH COOLING OF CIRCUIT BOARDS
- Publication number 20160278241
- Publication date Sep 22, 2016
- Lockheed Martin Corporation
- Brian W. Kaplun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR ARRAY PACKAGING SOLUTION
- Publication number 20160178410
- Publication date Jun 23, 2016
- Lockheed Martin Corporation
- James E. BISHOP
- G01 - MEASURING TESTING
Information Patent Application
DIMENSIONALLY TOLERANT MULTIBAND CONFORMAL ANTENNA ARRAYS
- Publication number 20150303554
- Publication date Oct 22, 2015
- Lockheed Martin Corporation
- DAVID L. VOS
- B32 - LAYERED PRODUCTS
Information Patent Application
FLUID-FLOW-THROUGH COOLING OF CIRCUIT BOARDS
- Publication number 20150230365
- Publication date Aug 13, 2015
- Lockheed Martin Corporation
- Brian W. Kaplun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUID-COOLED MODULE FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20140340848
- Publication date Nov 20, 2014
- Lockheed Martin Corporation
- David L. Vos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIMENSIONALLY TOLERANT MULTIBAND CONFORMAL ANTENNA ARRAYS
- Publication number 20130176176
- Publication date Jul 11, 2013
- Lockheed Martin Corporation
- David L. Vos
- B32 - LAYERED PRODUCTS
Information Patent Application
HEAT EXCHANGER CONSTRUCTION USING LOW TEMPERATURE SINTER TECHNIQUES
- Publication number 20130168072
- Publication date Jul 4, 2013
- Lockheed Martin Corporation
- DAVID L. VOS
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
FLUID-COOLED MODULE FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20120300402
- Publication date Nov 29, 2012
- Lockheed Martin Corporation
- David L. Vos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABILITY ENHANCEMENT PROCESS
- Publication number 20080032455
- Publication date Feb 7, 2008
- Lockheed Martin Corporation
- William E. Murphy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Performance Large Tolerance Heat Sink
- Publication number 20070159799
- Publication date Jul 12, 2007
- Lockheed Martin Corporation
- Charles H. Dando
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flow through cooling assemblies for conduction-cooled circuit modules
- Publication number 20070070601
- Publication date Mar 29, 2007
- Lockheed Martin Corporation
- David L. Vos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reliability enhancement process
- Publication number 20060151581
- Publication date Jul 13, 2006
- William E. Murphy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Environmental control method and apparatus for electronic device en...
- Publication number 20050213306
- Publication date Sep 29, 2005
- Lockheed Martin Corporation
- David L. Vos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Self-sustaining environmental control unit
- Publication number 20050128689
- Publication date Jun 16, 2005
- Lockheed Martin Corporation
- J. Claude Caci
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Self-sustaining environmental control unit
- Publication number 20040190229
- Publication date Sep 30, 2004
- J. Claude Caci
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

David L. Vos

Person

Patents Grantslast 30 patents

Phase-change material (PCM) embedded heat exchanger assembly for la...

Integrated multi-chamber heat exchanger

Integrated multi-chamber heat exchanger

Process for installing an insert for fluid-flow-through cooling of...

Integrated multi-chamber heat exchanger

Integrated multi-chamber heat exchanger

Integrated multi-chamber heat exchanger

Process for making an apparatus with fluid-flow-through cooling of...

Heat exchanger construction using low temperature sinter techniques

Dimensionally tolerant multiband conformal antenna arrays

Fluid-cooled module for integrated circuit devices

Fluid-flow-through cooling of circuit boards

Sensor array packaging solution

Dimensionally tolerant multiband conformal antenna arrays

Fluid-cooled module for integrated circuit devices

High performance large tolerance heat sink

Enhanced reliability semiconductor package

Reliability enhancement process

Flow through cooling assemblies for conduction-cooled circuit modules

Self-sustaining environmental control unit

Self-sustaining environmental control unit

Extended temperature range fluorescent lamp

Apparatus facilitating use of cots electronics in harsh environments

Thermally conductive vibration isolators

Thermally conductive vibration isolators

Patents Applicationslast 30 patents

INTEGRATED MULTI-CHAMBER HEAT EXCHANGER

INTEGRATED MULTI-CHAMBER HEAT EXCHANGER

INTEGRATED MULTI-CHAMBER HEAT EXCHANGER

INTEGRATED MULTI-CHAMBER HEAT EXCHANGER

INTEGRATED MULTI-CHAMBER HEAT EXCHANGER

FLUID-FLOW-THROUGH COOLING OF CIRCUIT BOARDS

FLUID-FLOW-THROUGH COOLING OF CIRCUIT BOARDS

SENSOR ARRAY PACKAGING SOLUTION

DIMENSIONALLY TOLERANT MULTIBAND CONFORMAL ANTENNA ARRAYS

FLUID-FLOW-THROUGH COOLING OF CIRCUIT BOARDS

FLUID-COOLED MODULE FOR INTEGRATED CIRCUIT DEVICES

DIMENSIONALLY TOLERANT MULTIBAND CONFORMAL ANTENNA ARRAYS

HEAT EXCHANGER CONSTRUCTION USING LOW TEMPERATURE SINTER TECHNIQUES

FLUID-COOLED MODULE FOR INTEGRATED CIRCUIT DEVICES

RELIABILITY ENHANCEMENT PROCESS

High Performance Large Tolerance Heat Sink

Flow through cooling assemblies for conduction-cooled circuit modules

Reliability enhancement process

Environmental control method and apparatus for electronic device en...

Self-sustaining environmental control unit

Self-sustaining environmental control unit