David M. Audette

Person

Colchester, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Compliant wafer probe assembly
- Patent number 11,675,010
- Issue date Jun 13, 2023
- International Business Machines Corporation
- David Michael Audette
- G01 - MEASURING TESTING
Information Patent Grant
Wafer probe with elastomer support
- Patent number 11,662,366
- Issue date May 30, 2023
- International Business Machines Corporation
- David Michael Audette
- G01 - MEASURING TESTING
Information Patent Grant
Compliant organic substrate assembly for rigid probes
- Patent number 11,561,243
- Issue date Jan 24, 2023
- International Business Machines Corporation
- David Audette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect and tuning thereof
- Patent number 11,322,473
- Issue date May 3, 2022
- International Business Machines Corporation
- David Audette
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Low-force wafer test probes
- Patent number 11,131,689
- Issue date Sep 28, 2021
- International Business Machines Corporation
- David M. Audette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe card assembly
- Patent number 11,085,949
- Issue date Aug 10, 2021
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Fluidized alignment of a semiconductor die to a test probe
- Patent number 11,041,879
- Issue date Jun 22, 2021
- International Business Machines Corporation
- Eugene Atwood
- G01 - MEASURING TESTING
Information Patent Grant
Low force wafer test probe
- Patent number 11,029,334
- Issue date Jun 8, 2021
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit tester probe contact liner
- Patent number 11,009,545
- Issue date May 18, 2021
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrochemical cleaning of test probes
- Patent number 10,955,439
- Issue date Mar 23, 2021
- International Business Machines Corporation
- Charles L. Arvin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit tester probe contact liner
- Patent number 10,670,653
- Issue date Jun 2, 2020
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low force wafer test probe with variable geometry
- Patent number 10,663,487
- Issue date May 26, 2020
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Probe card assembly
- Patent number 10,578,648
- Issue date Mar 3, 2020
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Solder bump array probe tip structure for laser cleaning
- Patent number 10,571,490
- Issue date Feb 25, 2020
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Gimbal assembly test system and method
- Patent number 10,514,393
- Issue date Dec 24, 2019
- GLOBALFOUNDRIES Inc.
- David L. Gardell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low force wafer test probe
- Patent number 10,444,260
- Issue date Oct 15, 2019
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Organic probe substrate
- Patent number 10,288,645
- Issue date May 14, 2019
- GLOBALFOUNDRIES Inc.
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Low force wafer test probe with variable geometry
- Patent number 10,261,108
- Issue date Apr 16, 2019
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Gimbal assembly test system and method
- Patent number 10,041,976
- Issue date Aug 7, 2018
- GLOBALFOUNDRIES Inc.
- David L. Gardell
- G01 - MEASURING TESTING
Information Patent Grant
Solder bump array probe tip structure for laser cleaning
- Patent number 9,835,653
- Issue date Dec 5, 2017
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Probe card assembly
- Patent number 9,797,928
- Issue date Oct 24, 2017
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Rigid probe with compliant characteristics
- Patent number 9,086,433
- Issue date Jul 21, 2015
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Rigid probe with compliant characteristics
- Patent number 9,081,034
- Issue date Jul 14, 2015
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Probe-on-substrate
- Patent number 9,057,741
- Issue date Jun 16, 2015
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Probe-on-substrate
- Patent number 8,933,717
- Issue date Jan 13, 2015
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Vertical probe assembly with air channel
- Patent number 8,836,356
- Issue date Sep 16, 2014
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Method of fabricating a compliant membrane probe
- Patent number 8,640,324
- Issue date Feb 4, 2014
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Containment of a wafer-chuck thermal interface fluid
- Patent number 8,002,025
- Issue date Aug 23, 2011
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Compliant membrane thin film interposer probe for intergrated circu...
- Patent number 7,688,089
- Issue date Mar 30, 2010
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Application of a thermally conductive thin film to a wafer backside...
- Patent number 7,387,911
- Issue date Jun 17, 2008
- International Business Machines Corporation
- David M Audette
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPLIANT WAFER PROBE ASSEMBLY
- Publication number 20230168301
- Publication date Jun 1, 2023
- International Business Machines Corporation
- David Michael Audette
- G01 - MEASURING TESTING
Information Patent Application
WAFER PROBE WITH ELASTOMER SUPPORT
- Publication number 20230089411
- Publication date Mar 23, 2023
- International Business Machines Corporation
- David Michael Audette
- G01 - MEASURING TESTING
Information Patent Application
COMPLIANT ORGANIC SUBSTRATE ASSEMBLY FOR RIGID PROBES
- Publication number 20210080486
- Publication date Mar 18, 2021
- International Business Machines Corporation
- David Audette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT AND TUNING THEREOF
- Publication number 20210082860
- Publication date Mar 18, 2021
- International Business Machines Corporation
- David Audette
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLUIDIZED ALIGNMENT OF A SEMICONDUCTOR DIE TO A TEST PROBE
- Publication number 20200386785
- Publication date Dec 10, 2020
- International Business Machines Corporation
- Eugene Atwood
- G01 - MEASURING TESTING
Information Patent Application
ELECTROCHEMICAL CLEANING OF TEST PROBES
- Publication number 20200292577
- Publication date Sep 17, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT TESTER PROBE CONTACT LINER
- Publication number 20200209308
- Publication date Jul 2, 2020
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROBE CARD ASSEMBLY
- Publication number 20200049738
- Publication date Feb 13, 2020
- International Business Machines Corporation
- David M. AUDETTE
- G01 - MEASURING TESTING
Information Patent Application
LOW FORCE WAFER TEST PROBE
- Publication number 20190361048
- Publication date Nov 28, 2019
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT TESTER PROBE CONTACT LINER
- Publication number 20190353702
- Publication date Nov 21, 2019
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSES FOR FABRICATING LOW-FORCE WAFER TEST PROBES AND THEIR STR...
- Publication number 20190227100
- Publication date Jul 25, 2019
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
LOW FORCE WAFER TEST PROBE WITH VARIABLE GEOMETRY
- Publication number 20190195913
- Publication date Jun 27, 2019
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TES...
- Publication number 20180358321
- Publication date Dec 13, 2018
- International Business Machines Corporation
- David M. Audette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TES...
- Publication number 20180358322
- Publication date Dec 13, 2018
- International Business Machines Corporation
- David M. Audette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TES...
- Publication number 20180358323
- Publication date Dec 13, 2018
- International Business Machines Corporation
- David M. Audette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSES FOR FABRICATING LOW-FORCE WAFER TEST PROBES AND THEIR STR...
- Publication number 20180340958
- Publication date Nov 29, 2018
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
PROCESSES FOR FABRICATING LOW-FORCE WAFER TEST PROBES AND THEIR STR...
- Publication number 20180340959
- Publication date Nov 29, 2018
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
GIMBAL ASSEMBLY TEST SYSTEM AND METHOD
- Publication number 20180217184
- Publication date Aug 2, 2018
- GLOBALFOUNDRIES INC.
- David L. Gardell
- G01 - MEASURING TESTING
Information Patent Application
SOLDER BUMP ARRAY PROBE TIP STRUCTURE FOR LASER CLEANING
- Publication number 20180059141
- Publication date Mar 1, 2018
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
LOW FORCE WAFER TEST PROBE
- Publication number 20180017592
- Publication date Jan 18, 2018
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
LOW FORCE WAFER TEST PROBE WITH VARIABLE GEOMETRY
- Publication number 20180017596
- Publication date Jan 18, 2018
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD ASSEMBLY
- Publication number 20170356933
- Publication date Dec 14, 2017
- International Business Machines Corporation
- David M. AUDETTE
- G01 - MEASURING TESTING
Information Patent Application
GIMBAL ASSEMBLY TEST SYSTEM AND METHOD
- Publication number 20170219626
- Publication date Aug 3, 2017
- GLOBALFOUNDRIES INC.
- David L. Gardell
- G01 - MEASURING TESTING
Information Patent Application
ORGANIC PROBE SUBSTRATE
- Publication number 20170003318
- Publication date Jan 5, 2017
- International Business Machines Corporation
- David M. AUDETTE
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD ASSEMBLY
- Publication number 20160077129
- Publication date Mar 17, 2016
- International Business Machines Corporation
- David M. AUDETTE
- G01 - MEASURING TESTING
Information Patent Application
SOLDER BUMP ARRAY PROBE TIP STRUCTURE FOR LASER CLEANING
- Publication number 20150331014
- Publication date Nov 19, 2015
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
RIGID PROBE WITH COMPLIANT CHARACTERISTICS
- Publication number 20140167801
- Publication date Jun 19, 2014
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
RIGID PROBE WITH COMPLIANT CHARACTERISTICS
- Publication number 20140167802
- Publication date Jun 19, 2014
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
PROBE-ON-SUBSTRATE
- Publication number 20130344694
- Publication date Dec 26, 2013
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
PROBE-ON-SUBSTRATE
- Publication number 20130342234
- Publication date Dec 26, 2013
- Intenational Business Machines Corporation
- David M. AUDETTE
- G01 - MEASURING TESTING

David M. Audette

Person

Patents Grantslast 30 patents

Compliant wafer probe assembly

Wafer probe with elastomer support

Compliant organic substrate assembly for rigid probes

Interconnect and tuning thereof

Low-force wafer test probes

Probe card assembly

Fluidized alignment of a semiconductor die to a test probe

Low force wafer test probe

Integrated circuit tester probe contact liner

Electrochemical cleaning of test probes

Integrated circuit tester probe contact liner

Low force wafer test probe with variable geometry

Probe card assembly

Solder bump array probe tip structure for laser cleaning

Gimbal assembly test system and method

Low force wafer test probe

Organic probe substrate

Low force wafer test probe with variable geometry

Gimbal assembly test system and method

Solder bump array probe tip structure for laser cleaning

Probe card assembly

Rigid probe with compliant characteristics

Rigid probe with compliant characteristics

Probe-on-substrate

Probe-on-substrate

Vertical probe assembly with air channel

Method of fabricating a compliant membrane probe

Containment of a wafer-chuck thermal interface fluid

Compliant membrane thin film interposer probe for intergrated circu...

Application of a thermally conductive thin film to a wafer backside...

Patents Applicationslast 30 patents

COMPLIANT WAFER PROBE ASSEMBLY

WAFER PROBE WITH ELASTOMER SUPPORT

COMPLIANT ORGANIC SUBSTRATE ASSEMBLY FOR RIGID PROBES

INTERCONNECT AND TUNING THEREOF

FLUIDIZED ALIGNMENT OF A SEMICONDUCTOR DIE TO A TEST PROBE

ELECTROCHEMICAL CLEANING OF TEST PROBES

INTEGRATED CIRCUIT TESTER PROBE CONTACT LINER

PROBE CARD ASSEMBLY

LOW FORCE WAFER TEST PROBE

INTEGRATED CIRCUIT TESTER PROBE CONTACT LINER

PROCESSES FOR FABRICATING LOW-FORCE WAFER TEST PROBES AND THEIR STR...

LOW FORCE WAFER TEST PROBE WITH VARIABLE GEOMETRY

PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TES...

PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TES...

PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TES...

PROCESSES FOR FABRICATING LOW-FORCE WAFER TEST PROBES AND THEIR STR...

PROCESSES FOR FABRICATING LOW-FORCE WAFER TEST PROBES AND THEIR STR...

GIMBAL ASSEMBLY TEST SYSTEM AND METHOD

SOLDER BUMP ARRAY PROBE TIP STRUCTURE FOR LASER CLEANING

LOW FORCE WAFER TEST PROBE

LOW FORCE WAFER TEST PROBE WITH VARIABLE GEOMETRY

PROBE CARD ASSEMBLY

GIMBAL ASSEMBLY TEST SYSTEM AND METHOD

ORGANIC PROBE SUBSTRATE

PROBE CARD ASSEMBLY

SOLDER BUMP ARRAY PROBE TIP STRUCTURE FOR LASER CLEANING

RIGID PROBE WITH COMPLIANT CHARACTERISTICS

RIGID PROBE WITH COMPLIANT CHARACTERISTICS

PROBE-ON-SUBSTRATE

PROBE-ON-SUBSTRATE