David Ovrutsky

Person

Charlotte, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Aspect ratio modifying imaging systems and methods
- Patent number 11,982,797
- Issue date May 14, 2024
- Teledyne FLIR Commercial Systems, Inc.
- Michael D. Walters
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Methods for routing electrical interconnections and resultant struc...
- Patent number 11,063,159
- Issue date Jul 13, 2021
- FLIR Systems, Inc.
- Hagit Gershtenman-Avsian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for singulation and packaging
- Patent number 10,818,550
- Issue date Oct 27, 2020
- FLIR Systems, Inc.
- David Ovrutsky
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
TIR imaging lens, image capturing system having the same, and assoc...
- Patent number 10,409,041
- Issue date Sep 10, 2019
- FLIR Systems, Inc.
- David Ovrutsky
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wafer level optical elements and applications thereof
- Patent number 9,910,239
- Issue date Mar 6, 2018
- FLIR Systems Trading Belgium BVBA
- David Ovrutsky
- G02 - OPTICS
Information Patent Grant
Off-chip vias in stacked chips
- Patent number 9,899,353
- Issue date Feb 20, 2018
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor chips with array
- Patent number 9,548,254
- Issue date Jan 17, 2017
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor chips with array
- Patent number 9,070,678
- Issue date Jun 30, 2015
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Off-chip vias in stacked chips
- Patent number 9,048,234
- Issue date Jun 2, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level optical elements and applications thereof
- Patent number 9,030,745
- Issue date May 12, 2015
- Nan Chang O-Film Optoelectronics Technology Ltd
- David Ovrutsky
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Focus compensation for optical elements and applications thereof
- Patent number 8,885,257
- Issue date Nov 11, 2014
- FLIR Systems Trading Belgium BVBA
- David Ovrutsky
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Reconstituted wafer stack packaging with after-applied pad extensions
- Patent number 8,883,562
- Issue date Nov 11, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Focus compensation for optical elements and applications thereof
- Patent number 8,848,301
- Issue date Sep 30, 2014
- FLIR Systems Trading Belgium BVBA
- William Hudson Welch
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microelectronic assemblies having compliancy and methods therefor
- Patent number 8,759,973
- Issue date Jun 24, 2014
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor chips
- Patent number 8,704,347
- Issue date Apr 22, 2014
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed optical surfaces
- Patent number 8,687,294
- Issue date Apr 1, 2014
- DigitalOptics Corporation
- Gregory J. Kintz
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Packaged semiconductor chips with array
- Patent number 8,653,644
- Issue date Feb 18, 2014
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Off-chip VIAS in stacked chips
- Patent number 8,476,774
- Issue date Jul 2, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted wafer stack packaging with after-applied pad extensions
- Patent number 8,461,672
- Issue date Jun 11, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level optical elements and applications thereof
- Patent number 8,422,138
- Issue date Apr 16, 2013
- Digitaloptics Corporation East
- David Ovrutsky
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Recessed optical surfaces
- Patent number 8,189,277
- Issue date May 29, 2012
- Digitaloptics Corporation East
- Gregory J. Kintz
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Microelectronic assemblies having compliancy and methods therefor
- Patent number 8,115,308
- Issue date Feb 14, 2012
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Off-chip vias in stacked chips
- Patent number 8,076,788
- Issue date Dec 13, 2011
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a wafer level package
- Patent number 8,053,281
- Issue date Nov 8, 2011
- Tessera, Inc.
- Kenneth Allen Honer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted wafer level stacking
- Patent number 7,901,989
- Issue date Mar 8, 2011
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ATHERMALIZED LENS SYSTEMS AND METHODS
- Publication number 20240168268
- Publication date May 23, 2024
- Teledyne FLIR Commercial Systems, Inc.
- David Ovrutsky
- G02 - OPTICS
Information Patent Application
HEATED CAMERAS AND RELATED METHODS
- Publication number 20240126147
- Publication date Apr 18, 2024
- Teledyne FLIR Commercial Systems, Inc.
- Nile E. Fairfield
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SNAP-FIT LENS BARREL SYSTEMS AND METHODS
- Publication number 20230288784
- Publication date Sep 14, 2023
- Teledyne FLIR Commercial Systems, Inc.
- William J. Hall
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGER OPTICAL SYSTEMS AND METHODS
- Publication number 20230232086
- Publication date Jul 20, 2023
- Teledyne FLIR Commercial Systems, Inc.
- David Ovrutsky
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIDE FIELD OF VIEW IMAGING SYSTEMS AND METHODS
- Publication number 20230140342
- Publication date May 4, 2023
- FLIR Commercial Systems, Inc.
- David Ovrutsky
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUPERHYDROPHOBIC SURFACE IN THERMAL INFRARED IMAGING DEVICE
- Publication number 20230051264
- Publication date Feb 16, 2023
- Teledyne FLIR Commercial Systems, Inc.
- David Ovrutsky
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICAL COMPONENTS FOR GHOST IMAGE SUPPRESSION SYSTEMS AND METHODS
- Publication number 20220326514
- Publication date Oct 13, 2022
- Teledyne FLIR Commercial Systems, Inc.
- Gregory Fitzgerald
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ASPECT RATIO MODIFYING IMAGING SYSTEMS AND METHODS
- Publication number 20220221691
- Publication date Jul 14, 2022
- FLIR Commercial Systems, Inc.
- Michael D. Walters
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHODS FOR ROUTING ELECTRICAL INTERCONNECTIONS AND RESULTANT STRUC...
- Publication number 20190221679
- Publication date Jul 18, 2019
- FLIR SYSTEMS, INC.
- Hagit Gershtenman-Avsian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SINGULATION AND PACKAGING
- Publication number 20190148232
- Publication date May 16, 2019
- FLIR SYSTEMS, INC.
- David OVRUTSKY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TIR IMAGING LENS, IMAGE CAPTURING SYSTEM HAVING THE SAME, AND ASSOC...
- Publication number 20180292632
- Publication date Oct 11, 2018
- FLIR SYSTEMS, INC.
- David OVRUTSKY
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGED SEMICONDUCTOR CHIPS WITH ARRAY
- Publication number 20150380336
- Publication date Dec 31, 2015
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFF-CHIP VIAS IN STACKED CHIPS
- Publication number 20150333042
- Publication date Nov 19, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIR IMAGING LENS, IMAGE CAPTURING SYSTEM HAVING THE SAME, AND ASSOC...
- Publication number 20150109456
- Publication date Apr 23, 2015
- FLIR SYSTEMS, INC.
- David OVRUTSKY
- G02 - OPTICS
Information Patent Application
PACKAGED SEMICONDUCTOR CHIPS WITH ARRAY
- Publication number 20140151881
- Publication date Jun 5, 2014
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED WAFER STACK PACKAGING WITH AFTER-APPLIED PAD EXTENSIONS
- Publication number 20130344652
- Publication date Dec 26, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFF-CHIP VIAS IN STACKED CHIPS
- Publication number 20130273693
- Publication date Oct 17, 2013
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Optical Elements and Applications Thereof
- Publication number 20130229719
- Publication date Sep 5, 2013
- DigitalOptics Corporation East
- David Ovrutsky
- G02 - OPTICS
Information Patent Application
RECESSED OPTICAL SURFACES
- Publication number 20120229908
- Publication date Sep 13, 2012
- DigitalOptics Corporation East
- Gregory J. Kintz
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PACKAGED SEMICONDUCTOR CHIPS WITH ARRAY
- Publication number 20120153443
- Publication date Jun 21, 2012
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL OPTICAL ELEMENTS AND APPLICATIONS THEREOF
- Publication number 20120133916
- Publication date May 31, 2012
- David Ovrutsky
- G02 - OPTICS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING COMPLIANCY AND METHODS THEREFOR
- Publication number 20120091582
- Publication date Apr 19, 2012
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFF-CHIP VIAS IN STACKED CHIPS
- Publication number 20120080807
- Publication date Apr 5, 2012
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Focus Compensation For Optical Elements And Applications Thereof
- Publication number 20110304930
- Publication date Dec 15, 2011
- William Hudson Welch
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
RECESSED OPTICAL SURFACES
- Publication number 20110222171
- Publication date Sep 15, 2011
- Gregory J. KINTZ
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
FOCUS COMPENSATION FOR OPTICAL ELEMENTS AND APPLICATIONS THEREOF
- Publication number 20110181854
- Publication date Jul 28, 2011
- David Ovrutsky
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OFF-CHIP VIAS IN STACKED CHIPS
- Publication number 20110049696
- Publication date Mar 3, 2011
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR CHIPS
- Publication number 20110012259
- Publication date Jan 20, 2011
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED WAFER STACK PACKAGING WITH AFTER-APPLIED PAD EXTENSIONS
- Publication number 20110006432
- Publication date Jan 13, 2011
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL OPTICAL ELEMENTS AND APPLICATIONS THEREOF
- Publication number 20110002053
- Publication date Jan 6, 2011
- David Ovrutsky
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

David Ovrutsky

Person

Patents Grantslast 30 patents

Aspect ratio modifying imaging systems and methods

Methods for routing electrical interconnections and resultant struc...

Methods for singulation and packaging

TIR imaging lens, image capturing system having the same, and assoc...

Wafer level optical elements and applications thereof

Off-chip vias in stacked chips

Packaged semiconductor chips with array

Packaged semiconductor chips with array

Off-chip vias in stacked chips

Wafer level optical elements and applications thereof

Focus compensation for optical elements and applications thereof

Reconstituted wafer stack packaging with after-applied pad extensions

Focus compensation for optical elements and applications thereof

Microelectronic assemblies having compliancy and methods therefor

Packaged semiconductor chips

Recessed optical surfaces

Packaged semiconductor chips with array

Off-chip VIAS in stacked chips

Reconstituted wafer stack packaging with after-applied pad extensions

Wafer level optical elements and applications thereof

Recessed optical surfaces

Microelectronic assemblies having compliancy and methods therefor

Off-chip vias in stacked chips

Method of forming a wafer level package

Reconstituted wafer level stacking

Patents Applicationslast 30 patents

ATHERMALIZED LENS SYSTEMS AND METHODS

HEATED CAMERAS AND RELATED METHODS

SNAP-FIT LENS BARREL SYSTEMS AND METHODS

IMAGER OPTICAL SYSTEMS AND METHODS

WIDE FIELD OF VIEW IMAGING SYSTEMS AND METHODS

SUPERHYDROPHOBIC SURFACE IN THERMAL INFRARED IMAGING DEVICE

OPTICAL COMPONENTS FOR GHOST IMAGE SUPPRESSION SYSTEMS AND METHODS

ASPECT RATIO MODIFYING IMAGING SYSTEMS AND METHODS

METHODS FOR ROUTING ELECTRICAL INTERCONNECTIONS AND RESULTANT STRUC...

METHODS FOR SINGULATION AND PACKAGING

TIR IMAGING LENS, IMAGE CAPTURING SYSTEM HAVING THE SAME, AND ASSOC...

PACKAGED SEMICONDUCTOR CHIPS WITH ARRAY

OFF-CHIP VIAS IN STACKED CHIPS

TIR IMAGING LENS, IMAGE CAPTURING SYSTEM HAVING THE SAME, AND ASSOC...

PACKAGED SEMICONDUCTOR CHIPS WITH ARRAY

RECONSTITUTED WAFER STACK PACKAGING WITH AFTER-APPLIED PAD EXTENSIONS

OFF-CHIP VIAS IN STACKED CHIPS

Wafer Level Optical Elements and Applications Thereof

RECESSED OPTICAL SURFACES

PACKAGED SEMICONDUCTOR CHIPS WITH ARRAY

WAFER LEVEL OPTICAL ELEMENTS AND APPLICATIONS THEREOF

MICROELECTRONIC ASSEMBLIES HAVING COMPLIANCY AND METHODS THEREFOR

OFF-CHIP VIAS IN STACKED CHIPS

Focus Compensation For Optical Elements And Applications Thereof

RECESSED OPTICAL SURFACES

FOCUS COMPENSATION FOR OPTICAL ELEMENTS AND APPLICATIONS THEREOF

OFF-CHIP VIAS IN STACKED CHIPS

PACKAGED SEMICONDUCTOR CHIPS

RECONSTITUTED WAFER STACK PACKAGING WITH AFTER-APPLIED PAD EXTENSIONS

WAFER LEVEL OPTICAL ELEMENTS AND APPLICATIONS THEREOF