David P. Pagnani

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Apalachin, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
System and method for generating wire bond fingers
- Patent number 6,269,327
- Issue date Jul 31, 2001
- International Business Machines Corporation
- Richard G. Bednar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual substrate package assembly having dielectric member engaging c...
- Patent number 6,046,911
- Issue date Apr 4, 2000
- International Business Machines Corporation
- David William Dranchak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual substrate package assembly coupled to a conducting member
- Patent number 5,953,214
- Issue date Sep 14, 1999
- International Business Machines Corporation
- David William Dranchak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunable inductor
- Patent number 5,239,289
- Issue date Aug 24, 1993
- International Business Machines Corporation
- Frank D. Ferraiolo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel integrated circuit packaging structures
- Patent number 5,028,983
- Issue date Jul 2, 1991
- International Business Machines Corporation
- Harry R. Bickford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite dielectric structure for optimizing electrical performanc...
- Patent number 4,916,259
- Issue date Apr 10, 1990
- International Business Machines Corporation
- Ronald S. Charsky
- H01 - BASIC ELECTRIC ELEMENTS