Claims
- 1. A composite structure for an electronic package when electrical impedance or capacitance of a thin film dielectric component part between two metallic levels is predetermined, comprising:
- a substrate of electrically non-conductive material providing a first surface with electrically conductive elements deposited thereon for functioning as a reference plane;
- a dielectric component part providing a second surface with electrically conductive elements deposited thereon for functioning as circuit conductors, said second surface being arranged substantially parallel to said first surface; and
- said dielectric component part being located intermediate said reference plane and said circuit conductors, said dielectric component part having a relative dielectric constant greater than 1.0 and comprising:
- a first layer of a ceramic material having a thickness composed of a predetermined number of discrete layers; and
- a second layer of a polyimide material having a thickness composed of a predetermined number of spray coated layers of polyimide, each layer having a thickness less than 0.0004 inch;
- whereby the electrical impedance or capacitance of said dielectric component part is predeterminable.
- 2. A composite dielectric structure having predetermined electrically insulating characteristics for use in thin film electronic packages when electrical impedance or capacitance is predetermined, comprising:
- a first layer formed of discrete elements of a preselected electrically insulating material having a first, predetermined dielectric property; and
- a second spray coated layer of a preselected electrically insulating material having a second, predetermined dielectric property;
- whereby a composite structure with desired predetermined electrical impedance or capacitance characteristics is formed for thin film packaging of electronic components.
- 3. A composite dielectric structure as defined in claim 2 wherein said first layer is in the form of ceramic tape having predetermined electrically insulating characteristics.
- 4. A composite dielectric structure as defined in claim 2 wherein said second spray coated layer is formed directly on and is supported by said first layer of discrete elements.
- 5. A composite dielectric structure as defined in claim 2 wherein said first layer of electrically insulating material is ceramic.
- 6. A composite dielectric structure as defined in claim 2 wherein said second layer of electrically insulating material is polyimide.
Parent Case Info
This is a continuation of Ser. No. 226,579 l filed Aug. 1, 1988, now abandoned.
US Referenced Citations (7)
Foreign Referenced Citations (1)
Number |
Date |
Country |
224373 |
Oct 1959 |
AUX |
Non-Patent Literature Citations (1)
Entry |
Abolafia, O. R. et al., Use of Polyimide to Obtain a Smooth Surface; IBM Technical Disclosure Bulletin; vol. 20, No. 8; Jan. 1978; p. 3020. |
Continuations (1)
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Number |
Date |
Country |
Parent |
226579 |
Aug 1988 |
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