David PARKER

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Greasque, FR

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Patents Grantslast 30 patents

Information Patent Grant
Thin semiconductor chip using a dummy sidewall layer
- Patent number 11,502,029
- Issue date Nov 15, 2022
- STMicroelectronics Pte Ltd
- Laurent Herard
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR DICING A SEMICONDUCTOR WAFER
- Publication number 20240321639
- Publication date Sep 26, 2024
- STMicroelectronics International N.V.
- Carlos Augusto SUAREZ SEGOVIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING INTEGRATED CIRCUITS FROM A SEMICONDUCTOR S...
- Publication number 20230223358
- Publication date Jul 13, 2023
- STMicroelectronics (Crolles 2) SAS
- Carlos Augusto SUAREZ SEGOVIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A THIN SEMICONDUCTOR CHIP USING A DUMMY SID...
- Publication number 20210020555
- Publication date Jan 21, 2021
- STMicroelectronics Pte Ltd
- Laurent HERARD
- H01 - BASIC ELECTRIC ELEMENTS