David Permana

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Dallas, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
System for improving thermal stability of copper damascene structure
- Patent number 6,903,000
- Issue date Jun 7, 2005
- Texas Instruments Incorporated
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preventing seam defects in isolated lines
- Patent number 6,709,974
- Issue date Mar 23, 2004
- Texas Instruments Incorporated
- David Permana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of a sacrificial layer to facilitate metallization for small fe...
- Patent number 6,583,053
- Issue date Jun 24, 2003
- Texas Instruments Incorporated
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
System for improving thermal stability of copper damascene structure
- Publication number 20050186788
- Publication date Aug 25, 2005
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of preventing seam defects in isolated lines
- Publication number 20030199150
- Publication date Oct 23, 2003
- David Permana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System for improving thermal stability of copper damascene structure
- Publication number 20030124828
- Publication date Jul 3, 2003
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of a sacrificial layer to facilitate metallization for small fe...
- Publication number 20020137337
- Publication date Sep 26, 2002
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS