David R. McCann

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 12,191,241
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 11,088,064
- Issue date Aug 10, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 10,418,318
- Issue date Sep 17, 2019
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 10,224,270
- Issue date Mar 5, 2019
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 9,462,690
- Issue date Oct 4, 2016
- Amkor Technologies, Inc.
- Robert Francis Darveaux
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 8,536,458
- Issue date Sep 17, 2013
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally enhanced chip scale lead on chip semiconductor package an...
- Patent number 7,064,009
- Issue date Jun 20, 2006
- Amkor Technology, Inc.
- David R. McCann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced chip scale lead on chip semiconductor package an...
- Patent number 7,045,883
- Issue date May 16, 2006
- Amkor Technology, Inc.
- David R. McCann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced chip scale lead on chip semiconductor package an...
- Patent number 6,873,032
- Issue date Mar 29, 2005
- Amkor Technology, Inc.
- David R. McCann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced chip scale lead on chip semiconductor package
- Patent number 6,597,059
- Issue date Jul 22, 2003
- Amkor Technology, Inc.
- David R. McCann
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FINE PITCH COPPER PILLAR PACKAGE AND METHOD
- Publication number 20220189866
- Publication date Jun 16, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE PITCH COPPER PILLAR PACKAGE AND METHOD
- Publication number 20200219802
- Publication date Jul 9, 2020
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS

David R. McCann

Person

Patents Grantslast 30 patents

Fine pitch copper pillar package and method

Fine pitch copper pillar package and method

Fine pitch copper pillar package and method

Fine pitch copper pillar package and method

Fine pitch copper pillar package and method

Fine pitch copper pillar package and method

Thermally enhanced chip scale lead on chip semiconductor package an...

Thermally enhanced chip scale lead on chip semiconductor package an...

Thermally enhanced chip scale lead on chip semiconductor package an...

Thermally enhanced chip scale lead on chip semiconductor package

Patents Applicationslast 30 patents

FINE PITCH COPPER PILLAR PACKAGE AND METHOD

FINE PITCH COPPER PILLAR PACKAGE AND METHOD