David Ross Economy

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Access line grain modulation in a memory device
- Patent number 12,087,358
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- David Ross Economy
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory cell stack and via formation for a memory device
- Patent number 12,022,666
- Issue date Jun 25, 2024
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies having conductive structures with three or more differen...
- Patent number 11,990,528
- Issue date May 21, 2024
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device with low density thermal barrier
- Patent number 11,984,382
- Issue date May 14, 2024
- Micron Technology, Inc.
- Pengyuan Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device with high resistivity thermal barrier
- Patent number 11,721,606
- Issue date Aug 8, 2023
- Micron Technology Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies having conductive structures with three or more differen...
- Patent number 11,705,500
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming tungsten structures
- Patent number 11,646,206
- Issue date May 9, 2023
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming apparatuses including air gaps between conductiv...
- Patent number 11,456,208
- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Sidhartha Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cells
- Patent number 11,349,068
- Issue date May 31, 2022
- Intel Corporation
- Pengyuan Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell stack and via formation for a memory device
- Patent number 11,189,662
- Issue date Nov 30, 2021
- Micron Technology
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device with low density thermal barrier
- Patent number 11,158,561
- Issue date Oct 26, 2021
- Micron Technology, Inc.
- Pengyuan Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase change memory structures
- Patent number 11,018,298
- Issue date May 25, 2021
- Intel Corporation
- Christopher W. Petz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Access line grain modulation in a memory device
- Patent number 10,991,425
- Issue date Apr 27, 2021
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device with high resistivity thermal barrier
- Patent number 10,964,621
- Issue date Mar 30, 2021
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies having conductive structures with three or more differen...
- Patent number 10,957,775
- Issue date Mar 23, 2021
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies having vertically-extending structures, and methods of f...
- Patent number 10,916,564
- Issue date Feb 9, 2021
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming tungsten structures
- Patent number 10,847,367
- Issue date Nov 24, 2020
- Micron Technology, Inc.
- David R. Economy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Assemblies having vertically-extending structures, and methods of f...
- Patent number 10,700,091
- Issue date Jun 30, 2020
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive components and memory assemblies
- Patent number 10,475,810
- Issue date Nov 12, 2019
- Micron Technology, Inc.
- Sudip Bandyopadhyay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies having vertically-extending structures
- Patent number 10,355,014
- Issue date Jul 16, 2019
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive components and memory assemblies
- Patent number 10,014,319
- Issue date Jul 3, 2018
- Micron Technology, Inc.
- Sudip Bandyopadhyay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive components and memory assemblies
- Patent number 9,773,807
- Issue date Sep 26, 2017
- Micron Technology, Inc.
- Sudip Bandyopadhyay
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY DEVICE WITH LOW DENSITY THERMAL BARRIER
- Publication number 20240347418
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Pengyuan Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20230395149
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20230397423
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Pengyuan Zheng
Information Patent Application
BIT LINES HAVING HIGH ELECTRICAL CONDUCTIVITY AND LOW MUTUAL CAPACI...
- Publication number 20230207458
- Publication date Jun 29, 2023
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIT LINES HAVING HIGH ELECTRICAL CONDUCTIVITY AND LOW MUTUAL CAPACI...
- Publication number 20230209810
- Publication date Jun 29, 2023
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Conductive Structures with Three or More Differen...
- Publication number 20230121315
- Publication date Apr 20, 2023
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND MEMORY DEVICES INCLUDING AIR GAPS BETWEEN CONDUCTIV...
- Publication number 20220384242
- Publication date Dec 1, 2022
- Micron Technology, Inc.
- Sidhartha Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING CONTROL GATES HAVING TUNGSTEN STRUCTURE
- Publication number 20220310524
- Publication date Sep 29, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FORMATION FOR A MEMORY DEVICE
- Publication number 20220165793
- Publication date May 26, 2022
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING APPARATUSES INCLUDING AIR GAPS BETWEEN CONDUCTIV...
- Publication number 20220051930
- Publication date Feb 17, 2022
- Micron Technology, Inc.
- Sidhartha Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE WITH LOW DENSITY THERMAL BARRIER
- Publication number 20220020662
- Publication date Jan 20, 2022
- Micron Technology, Inc.
- Pengyuan Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCESS LINE GRAIN MODULATION IN A MEMORY DEVICE
- Publication number 20210312978
- Publication date Oct 7, 2021
- Micron Technology, Inc.
- David Ross Economy
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE WITH HIGH RESISTIVITY THERMAL BARRIER
- Publication number 20210287960
- Publication date Sep 16, 2021
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FORMATION FOR A MEMORY DEVICE
- Publication number 20210225937
- Publication date Jul 22, 2021
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Conductive Structures with Three or More Differen...
- Publication number 20210202710
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING TUNGSTEN STRUCTURES
- Publication number 20210183651
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- David Ross Economy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Assemblies Having Conductive Structures with Three or More Differen...
- Publication number 20210005732
- Publication date Jan 7, 2021
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE WITH LOW DENSITY THERMAL BARRIER
- Publication number 20200350226
- Publication date Nov 5, 2020
- Micron Technology, Inc.
- Pengyuan Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE WITH HIGH RESISTIVITY THERMAL BARRIER
- Publication number 20200350225
- Publication date Nov 5, 2020
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Vertically-Extending Structures, and Methods of F...
- Publication number 20200266210
- Publication date Aug 20, 2020
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING TUNGSTEN STRUCTURES
- Publication number 20200211843
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- David Ross Economy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PHASE CHANGE MEMORY STRUCTURES
- Publication number 20200119270
- Publication date Apr 16, 2020
- Intel Corporation
- Christopher W. Petz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCESS LINE GRAIN MODULATION IN A MEMORY DEVICE
- Publication number 20200051624
- Publication date Feb 13, 2020
- Micron Technology, Inc.
- David Ross Economy
- G11 - INFORMATION STORAGE
Information Patent Application
Assemblies Having Vertically-Extending Structures, and Methods of F...
- Publication number 20190304996
- Publication date Oct 3, 2019
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Vertically-Extending Structures, and Methods of F...
- Publication number 20190198519
- Publication date Jun 27, 2019
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELLS
- Publication number 20190198756
- Publication date Jun 27, 2019
- Intel Corporation
- Pengyuan Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Components and Memory Assemblies
- Publication number 20180308861
- Publication date Oct 25, 2018
- Micron Technology, Inc.
- Sudip Bandyopadhyay
- H01 - BASIC ELECTRIC ELEMENTS

David Ross Economy

Person

Patents Grantslast 30 patents

Access line grain modulation in a memory device

Memory cell stack and via formation for a memory device

Assemblies having conductive structures with three or more differen...

Memory device with low density thermal barrier

Memory device with high resistivity thermal barrier

Assemblies having conductive structures with three or more differen...

Methods of forming tungsten structures

Methods of forming apparatuses including air gaps between conductiv...

Memory cells

Memory cell stack and via formation for a memory device

Memory device with low density thermal barrier

Phase change memory structures

Access line grain modulation in a memory device

Memory device with high resistivity thermal barrier

Assemblies having conductive structures with three or more differen...

Assemblies having vertically-extending structures, and methods of f...

Methods of forming tungsten structures

Assemblies having vertically-extending structures, and methods of f...

Conductive components and memory assemblies

Assemblies having vertically-extending structures

Conductive components and memory assemblies

Conductive components and memory assemblies

Patents Applicationslast 30 patents

MEMORY DEVICE WITH LOW DENSITY THERMAL BARRIER

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

BIT LINES HAVING HIGH ELECTRICAL CONDUCTIVITY AND LOW MUTUAL CAPACI...

BIT LINES HAVING HIGH ELECTRICAL CONDUCTIVITY AND LOW MUTUAL CAPACI...

Assemblies Having Conductive Structures with Three or More Differen...

APPARATUSES AND MEMORY DEVICES INCLUDING AIR GAPS BETWEEN CONDUCTIV...

MEMORY DEVICE INCLUDING CONTROL GATES HAVING TUNGSTEN STRUCTURE

VIA FORMATION FOR A MEMORY DEVICE

METHODS OF FORMING APPARATUSES INCLUDING AIR GAPS BETWEEN CONDUCTIV...

MEMORY DEVICE WITH LOW DENSITY THERMAL BARRIER

ACCESS LINE GRAIN MODULATION IN A MEMORY DEVICE

MEMORY DEVICE WITH HIGH RESISTIVITY THERMAL BARRIER

VIA FORMATION FOR A MEMORY DEVICE

Assemblies Having Conductive Structures with Three or More Differen...

METHODS OF FORMING TUNGSTEN STRUCTURES

Assemblies Having Conductive Structures with Three or More Differen...

MEMORY DEVICE WITH LOW DENSITY THERMAL BARRIER

MEMORY DEVICE WITH HIGH RESISTIVITY THERMAL BARRIER

Assemblies Having Vertically-Extending Structures, and Methods of F...

METHODS OF FORMING TUNGSTEN STRUCTURES

PHASE CHANGE MEMORY STRUCTURES

ACCESS LINE GRAIN MODULATION IN A MEMORY DEVICE

Assemblies Having Vertically-Extending Structures, and Methods of F...

Assemblies Having Vertically-Extending Structures, and Methods of F...

MEMORY CELLS

Conductive Components and Memory Assemblies