David S. Chau

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Flexible interconnect pattern on semiconductor package
- Patent number 8,518,750
- Issue date Aug 27, 2013
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible interconnect pattern on semiconductor package
- Patent number 8,409,924
- Issue date Apr 2, 2013
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible interconnect pattern on semiconductor package
- Patent number 8,227,907
- Issue date Jul 24, 2012
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible interconnect pattern on semiconductor package
- Patent number 7,915,081
- Issue date Mar 29, 2011
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket enabled current delivery to a thermoelectric cooler to cool...
- Patent number 7,739,876
- Issue date Jun 22, 2010
- Intel Corporation
- Ashish Gupta
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Densely packed thermoelectric cooler
- Patent number 7,560,640
- Issue date Jul 14, 2009
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized microelectronic cooling
- Patent number 7,430,870
- Issue date Oct 7, 2008
- Intel Corporation
- David S. Chau
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Cold plate and mating manifold plate for IC device cooling system e...
- Patent number 7,336,487
- Issue date Feb 26, 2008
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating thermoelectric elements into wafer for heat extraction
- Patent number 7,211,890
- Issue date May 1, 2007
- Intel Corporation
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat pipe having an inner retaining wall for wicking components
- Patent number 6,868,898
- Issue date Mar 22, 2005
- Intel Corporation
- David S. Chau
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE INTERCONNECT PATTERN ON SEMICONDUCTOR PACKAGE
- Publication number 20130122656
- Publication date May 16, 2013
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE INTERCONNECT PATTERN ON SEMICONDUCTOR PACKAGE
- Publication number 20120289002
- Publication date Nov 15, 2012
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE INTERCONNECT PATTERN ON SEMICONDUCTOR PACKAGE
- Publication number 20110103438
- Publication date May 5, 2011
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD APPARATUS FOR COOLING SYSTEM HAVING AN S-SHAPED AIR FLOW PAT...
- Publication number 20090109619
- Publication date Apr 30, 2009
- MOTOROLA, INC.
- Jeffrey L. Wise
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOCKET ENABLED CURRENT DELIVERY TO A THERMOELECTRIC COOLER TO COOL...
- Publication number 20080155990
- Publication date Jul 3, 2008
- Ashish Gupta
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
Flexible interconnect pattern on semiconductor package
- Publication number 20070231953
- Publication date Oct 4, 2007
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Localized microelectronic cooling
- Publication number 20070000256
- Publication date Jan 4, 2007
- David S. Chau
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
Densely packed thermoelectric cooler
- Publication number 20060107988
- Publication date May 25, 2006
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrating thermoelectric elements into wafer for heat extraction
- Publication number 20050067692
- Publication date Mar 31, 2005
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat pipe having an inner retaining wall for wicking components
- Publication number 20040188067
- Publication date Sep 30, 2004
- David S. Chau
- F28 - HEAT EXCHANGE IN GENERAL

David S. Chau

Person

Patents Grantslast 30 patents

Flexible interconnect pattern on semiconductor package

Flexible interconnect pattern on semiconductor package

Flexible interconnect pattern on semiconductor package

Flexible interconnect pattern on semiconductor package

Socket enabled current delivery to a thermoelectric cooler to cool...

Densely packed thermoelectric cooler

Localized microelectronic cooling

Cold plate and mating manifold plate for IC device cooling system e...

Integrating thermoelectric elements into wafer for heat extraction

Heat pipe having an inner retaining wall for wicking components

Patents Applicationslast 30 patents

FLEXIBLE INTERCONNECT PATTERN ON SEMICONDUCTOR PACKAGE

FLEXIBLE INTERCONNECT PATTERN ON SEMICONDUCTOR PACKAGE

FLEXIBLE INTERCONNECT PATTERN ON SEMICONDUCTOR PACKAGE

METHOD APPARATUS FOR COOLING SYSTEM HAVING AN S-SHAPED AIR FLOW PAT...

SOCKET ENABLED CURRENT DELIVERY TO A THERMOELECTRIC COOLER TO COOL...

Flexible interconnect pattern on semiconductor package

Localized microelectronic cooling

Densely packed thermoelectric cooler

Integrating thermoelectric elements into wafer for heat extraction

Heat pipe having an inner retaining wall for wicking components