Flexible interconnect pattern on semiconductor package

Abstract

An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of invention may best be understood by referring to the following description and accompanying drawings that are used to illustrate embodiments of the invention. In the drawings:

FIG. 1A is a diagram illustrating a manufacturing system in which one embodiment of the invention can be practiced.

FIG. 1B is a diagram illustrating a system according to one embodiment of the invention.

FIG. 2 is a diagram illustrating a package device according to one embodiment of the invention.

FIG. 3A is a diagram illustrating a routing pattern of a device assembly on a die according to one embodiment of the invention.

FIG. 3B is a diagram illustrating a routing pattern of a device assembly on a heat spreader according to one embodiment of the invention.

FIG. 3C is a diagram illustrating a routing pattern of the device assembly on a heat spreader with an interposer according to one embodiment of the invention.

FIG. 4 is a flowchart illustrating a process to fabricate a device assembly according to one embodiment of the invention.

FIG. 5 is a flowchart illustrating a process to print a metal trace of the device assembly according to one embodiment of the invention.

Claims

1. A method comprising: printing a first metal trace on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate; andmounting a device on the first metal trace, the device receiving power from the substrate when the package is powered.

2. The method of claim 1 wherein printing comprises: routing the first metal trace from backside of the die, over an underfill tongue and to surface of the substrate.

3. The method of claim 1 wherein printing comprises: routing the first metal trace on the cavity of the heat spreader to a metal bump on the substrate, the metal bump being connected to the power contact.

4. The method of claim 1 wherein printing comprises: routing the first metal trace on the cavity of the heat spreader to a first end of an interposer placed between the heat spreader and the substrate, the interposer having a flexible conductor connecting the first end and a second end of the interposer, the second end being connected to the power contact in the substrate.

5. The method of claim 1 wherein printing comprises: printing the first metal trace using ink-jet printing.

6. The method of claim 1 further comprising: curing the first metal trace before mounting the device.

7. The method of claim 1 wherein printing comprises: printing the first metal trace using a metal being one of copper, silver, aluminum, gold, solder, and metal alloy.

8. The method of claim 1 further comprising: printing a second metal trace, the second metal trace forming a multi-layered structure with the first metal trace.

9. The method of claim 1 wherein mounting the device comprises: mounting a thermo-electric cooler (TEC), the TEC cooling the die when the package is powered.

10. A method comprising: forming a power contact in a substrate; andprinting a first metal trace on a die attached to the substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to the power contact in the substrate.

11. The method of claim 10 wherein printing comprises: routing the first metal trace from backside of the die, over an underfill tongue and to surface of the substrate.

12. The method of claim 10 wherein printing comprises: routing the first metal trace on the cavity of the heat spreader to a metal bump on the substrate, the metal bump being connected to the power contact.

13. The method of claim 10 wherein printing comprises: routing the first metal trace on the cavity of the heat spreader to a first end of an interposer placed between the heat spreader and the substrate, the interposer having a flexible conductor connecting the first end and a second end of the interposer, the second end being connected to the power contact in the substrate.

14. The method of claim 10 wherein printing comprises: printing the first metal trace using ink-jet printing.

15. The method of claim 10 further comprising: mounting a thermoelectric cooler (TEC) on the first metal trace, the TEC cooling the die when the package is powered.

16. An apparatus comprising: a first metal trace printed on a die attached to a substrate or a cavity of a heat spreader in a package, the first metal trace being electrically connected to a power contact in the substrate; anda device mounted on the first metal trace, the device receiving power when the package is powered.

17. The apparatus of claim 16 wherein the first metal trace is routed from backside of the die, over an underfill tongue and to surface of the substrate.

18. The apparatus of claim 16 wherein the first metal trace is routed on the cavity of the heat spreader to a metal bump on the substrate, the metal bump being connected to the power contact.

19. The apparatus of claim 16 wherein the first metal trace is routed on the cavity of the heat spreader to a first end of an interposer placed between the heat spreader and the substrate, the interposer having a flexible conductor connecting the first end and a second end of the interposer, the second end being connected to the power contacts in the substrate.

20. The apparatus of claim 16 wherein the first metal trace is printed using ink-jet printing.

21. The apparatus of claim 16 wherein the first metal trace uses a metal being one of copper, silver, aluminum, gold, solder, and metal alloy.

22. The apparatus of claim 16 further comprising: a second metal trace forming a multi-layered structure with the first metal trace.

23. A system comprising: a front end processing unit to receive and transmit a radio frequency (RF) signal, the RF signal being converted to digital data; anda digital processor coupled to the front end processing unit to process the digital data, the digital processor being packaged in a package, the package comprising: a package substrate,a die attached to the substrate,a heat spreader to encapsulate the package substrate and the die, anda device assembly placed between the die and the heat spreader, the device assembly comprising: a first metal trace printed on the die or a cavity of the heat spreader, the first metal trace being electrically connected to a power contact in the substrate, anddevice mounted on the first metal trace, the device receiving power from the substrate when the package is powered.

24. The system of claim 23 wherein the first metal trace is routed from backside of the die, over an underfill tongue and to surface of the substrate.

25. The system of claim 23 wherein the first metal trace is routed on the cavity of the heat spreader to a metal bump on the substrate, the metal bump being connected to the power contact.

26. The system of claim 23 wherein the first metal trace is routed on the cavity of the heat spreader to a first end of an interposer placed between the heat spreader and the substrate, the interposer having a flexible conductor connecting the first end and a second end of the interposer, the second end being connected to the power contacts in the substrate.

27. The system of claim 23 wherein the first metal trace is printed using ink-jet printing.

28. The system of claim 23 wherein the first metal trace uses a metal being one of copper, silver, aluminum, gold, solder, and metal alloy.

29. The system of claim 23 wherein the device assembly further comprises: a second metal trace forming a multi-layered structure with the first metal trace.

30. The system of claim 23 further comprising: an intermediate frequency (IF) processing unit coupled to the front end processing unit to process IF signals to and from base-band signals; anda base-band processing unit coupled to the IF processing unit to process the base-band signals, the base-band processing unit comprising:a converter to convert the base-band signals to digital data or digital data to the base-band signals, and the digital signal processor.