David S. COLLINS

Person

Williston, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Structure and method of latchup robustness with placement of throug...
- Patent number 10,978,452
- Issue date Apr 13, 2021
- International Business Machines Corporation
- Phillip F. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of latchup robustness with placement of throug...
- Patent number 10,170,476
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Phillip F. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of latchup robustness with placement of throug...
- Patent number 9,842,838
- Issue date Dec 12, 2017
- International Business Machines Corporation
- Phillip F. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of latchup robustness with placement of throug...
- Patent number 9,397,010
- Issue date Jul 19, 2016
- International Business Machines Corporation
- Phillip F. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of latchup robustness with placement of throug...
- Patent number 9,275,997
- Issue date Mar 1, 2016
- International Business Machines Corporation
- Phillip F. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of latchup robustness with placement of throug...
- Patent number 8,853,789
- Issue date Oct 7, 2014
- International Business Machines Corporation
- Phillip F. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having vias and high density capacitors
- Patent number 8,674,423
- Issue date Mar 18, 2014
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of latchup robustness with placement of throug...
- Patent number 8,420,518
- Issue date Apr 16, 2013
- International Business Machines Corporation
- Phillip F. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI (silicon on insulator) substrate improvements
- Patent number 8,288,821
- Issue date Oct 16, 2012
- International Business Machines Corporation
- Alan Bernard Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral passive device having dual annular electrodes
- Patent number 8,288,244
- Issue date Oct 16, 2012
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal wiring structure for integration with through substrate vias
- Patent number 8,234,606
- Issue date Jul 31, 2012
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric junction field effect transistor
- Patent number 8,169,007
- Issue date May 1, 2012
- International Business Machines Corporation
- Frederick G. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal fill structures for reducing parasitic capacitance
- Patent number 8,138,607
- Issue date Mar 20, 2012
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure, design structure and method of manufacturing a structure...
- Patent number 8,125,013
- Issue date Feb 28, 2012
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure, design structure and method of manufacturing a structure...
- Patent number 8,101,494
- Issue date Jan 24, 2012
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structures for improving substrate loss and linearity in...
- Patent number 8,089,126
- Issue date Jan 3, 2012
- International Business Machines Corporation
- Alan Bernard Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of latchup robustness with placement of throug...
- Patent number 8,017,471
- Issue date Sep 13, 2011
- International Business Machines Corporation
- Phillip F. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench varactors
- Patent number 8,008,748
- Issue date Aug 30, 2011
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal wiring structure for integration with through substrate vias
- Patent number 7,968,975
- Issue date Jun 28, 2011
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric junction field effect transistor
- Patent number 7,943,445
- Issue date May 17, 2011
- International Business Machines Corporation
- Frederick G. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized device isolation
- Patent number 7,868,423
- Issue date Jan 11, 2011
- International Business Machines Corporation
- John J. Benoit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for a latchup robust array I/O using through wafer via
- Patent number 7,855,420
- Issue date Dec 21, 2010
- International Business Machines Corporation
- Phillip Francis Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral passive device having dual annular electrodes
- Patent number 7,821,097
- Issue date Oct 26, 2010
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Latchup robust array I/O using through wafer via
- Patent number 7,741,681
- Issue date Jun 22, 2010
- International Business Machines Corporation
- Phillip Francis Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Design structure incorporating semiconductor device structures that...
- Patent number 7,739,636
- Issue date Jun 15, 2010
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for a latchup robust gate array using through wafer via
- Patent number 7,696,541
- Issue date Apr 13, 2010
- International Business Machines Corporation
- Phillip Francis Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Design methodology of guard ring design resistance optimization for...
- Patent number 7,549,135
- Issue date Jun 16, 2009
- International Business Machines Corporation
- Phillip F. Chapman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Latchup robust gate array using through wafer via
- Patent number 7,498,622
- Issue date Mar 3, 2009
- International Business Machines Corporation
- Phillip Francis Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for enhanced triple well latchup robustness
- Patent number 7,442,996
- Issue date Oct 28, 2008
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for symmetric capacitor formation
- Patent number 7,402,890
- Issue date Jul 22, 2008
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...
- Publication number 20190081046
- Publication date Mar 14, 2019
- International Business Machines Corporation
- Phillip F. CHAPMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...
- Publication number 20180040619
- Publication date Feb 8, 2018
- International Business Machines Corporation
- Phillip F. CHAPMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...
- Publication number 20160268258
- Publication date Sep 15, 2016
- International Business Machines Corporation
- Phillip F. CHAPMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...
- Publication number 20160126147
- Publication date May 5, 2016
- International Business Machines Corporation
- Phillip F. CHAPMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...
- Publication number 20140367792
- Publication date Dec 18, 2014
- Phillip F. CHAPMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...
- Publication number 20130154024
- Publication date Jun 20, 2013
- International Business Machines Corporation
- Phillip F. CHAPMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE, DESIGN STRUCTURE AND METHOD OF MANUFACTURING A STRUCTURE...
- Publication number 20120061801
- Publication date Mar 15, 2012
- International Business Machines Corporation
- David S. COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...
- Publication number 20110198703
- Publication date Aug 18, 2011
- International Business Machines Corporation
- Phillip F. CHAPMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL WIRING STRUCTURE FOR INTEGRATION WITH THROUGH SUBSTRATE VIAS
- Publication number 20110185330
- Publication date Jul 28, 2011
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC JUNCTION FIELD EFFECT TRANSISTOR
- Publication number 20110147808
- Publication date Jun 23, 2011
- International Business Machines Corporation
- Frederick G. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURES FOR IMPROVING SUBSTRATE LOSS AND LINEARITY IN...
- Publication number 20110018060
- Publication date Jan 27, 2011
- International Business Machines Corporation
- Alan Bernard Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERAL PASSIVE DEVICE HAVING DUAL ANNULAR ELECTRODES
- Publication number 20100279483
- Publication date Nov 4, 2010
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Fill Structures for Reducing Parasitic Capacitance
- Publication number 20100264545
- Publication date Oct 21, 2010
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI (SILICON ON INSULATOR) SUBSTRATE IMPROVEMENTS
- Publication number 20100230752
- Publication date Sep 16, 2010
- International Business Machines Corporation
- Alan Bernard Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC JUNCTION FIELD EFFECT TRANSISTOR
- Publication number 20100207173
- Publication date Aug 19, 2010
- International Business Machines Corporation
- Frederick G. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH VARACTORS
- Publication number 20100155897
- Publication date Jun 24, 2010
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optimized Device Isolation
- Publication number 20100117122
- Publication date May 13, 2010
- John J. Benoit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure, Design Structure and Method of Manufacturing a Structure...
- Publication number 20100041203
- Publication date Feb 18, 2010
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure, Design Structure and Method of Manufacturing a Structure...
- Publication number 20100038750
- Publication date Feb 18, 2010
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL WIRING STRUCTURE FOR INTEGRATION WITH THROUGH SUBSTRATE VIAS
- Publication number 20100032809
- Publication date Feb 11, 2010
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...
- Publication number 20100032767
- Publication date Feb 11, 2010
- Phillip F. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN METHODOLOGY FOR GUARD RING DESIGN RESISTANCE OPTIMIZATION FO...
- Publication number 20090166798
- Publication date Jul 2, 2009
- International Business Machines Corporation
- Phillip F. Chapman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LATCHUP ROBUST ARRAY I/O USING THROUGH WAFER VIA
- Publication number 20090152632
- Publication date Jun 18, 2009
- Phillip Francis Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR A LATCHUP ROBUST GATE ARRAY USING THROUGH WAFER VIA
- Publication number 20090152593
- Publication date Jun 18, 2009
- Phillip Francis Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR A LATCHUP ROBUST ARRAY I/O USING THROUGH WAFER VIA
- Publication number 20090152592
- Publication date Jun 18, 2009
- Phillip Francis Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN STRUCTURE INCORPORATING SEMICONDUCTOR DEVICE STRUCTURES THAT...
- Publication number 20090106713
- Publication date Apr 23, 2009
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURES AND METHODS FOR SHIELDING A BOND PA...
- Publication number 20090020856
- Publication date Jan 22, 2009
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR ENHANCED TRIPLE WELL LATCHUP ROBUSTNESS
- Publication number 20080265333
- Publication date Oct 30, 2008
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-OXIDE-SEMICONDUCTOR (MOS) VARACTORS AND METHODS OF FORMING MO...
- Publication number 20080149983
- Publication date Jun 26, 2008
- International Business Machines Corporation
- Robert Mark Rassel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYMMETRIC CAPACITOR STRUCTURE
- Publication number 20080142861
- Publication date Jun 19, 2008
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS

David S. COLLINS

Person

Patents Grantslast 30 patents

Structure and method of latchup robustness with placement of throug...

Structure and method of latchup robustness with placement of throug...

Structure and method of latchup robustness with placement of throug...

Structure and method of latchup robustness with placement of throug...

Structure and method of latchup robustness with placement of throug...

Structure and method of latchup robustness with placement of throug...

Semiconductor structure having vias and high density capacitors

Structure and method of latchup robustness with placement of throug...

SOI (silicon on insulator) substrate improvements

Lateral passive device having dual annular electrodes

Metal wiring structure for integration with through substrate vias

Asymmetric junction field effect transistor

Metal fill structures for reducing parasitic capacitance

Structure, design structure and method of manufacturing a structure...

Structure, design structure and method of manufacturing a structure...

Method and structures for improving substrate loss and linearity in...

Structure and method of latchup robustness with placement of throug...

Deep trench varactors

Metal wiring structure for integration with through substrate vias

Asymmetric junction field effect transistor

Optimized device isolation

Structure for a latchup robust array I/O using through wafer via

Lateral passive device having dual annular electrodes

Latchup robust array I/O using through wafer via

Design structure incorporating semiconductor device structures that...

Structure for a latchup robust gate array using through wafer via

Design methodology of guard ring design resistance optimization for...

Latchup robust gate array using through wafer via

Structure and method for enhanced triple well latchup robustness

Method for symmetric capacitor formation

Patents Applicationslast 30 patents

STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...

STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...

STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...

STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...

STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...

STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...

STRUCTURE, DESIGN STRUCTURE AND METHOD OF MANUFACTURING A STRUCTURE...

STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...

METAL WIRING STRUCTURE FOR INTEGRATION WITH THROUGH SUBSTRATE VIAS

ASYMMETRIC JUNCTION FIELD EFFECT TRANSISTOR

METHOD AND STRUCTURES FOR IMPROVING SUBSTRATE LOSS AND LINEARITY IN...

LATERAL PASSIVE DEVICE HAVING DUAL ANNULAR ELECTRODES

Metal Fill Structures for Reducing Parasitic Capacitance

SOI (SILICON ON INSULATOR) SUBSTRATE IMPROVEMENTS

ASYMMETRIC JUNCTION FIELD EFFECT TRANSISTOR

DEEP TRENCH VARACTORS

Optimized Device Isolation

Structure, Design Structure and Method of Manufacturing a Structure...

Structure, Design Structure and Method of Manufacturing a Structure...

METAL WIRING STRUCTURE FOR INTEGRATION WITH THROUGH SUBSTRATE VIAS

STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...

DESIGN METHODOLOGY FOR GUARD RING DESIGN RESISTANCE OPTIMIZATION FO...

LATCHUP ROBUST ARRAY I/O USING THROUGH WAFER VIA

STRUCTURE FOR A LATCHUP ROBUST GATE ARRAY USING THROUGH WAFER VIA

STRUCTURE FOR A LATCHUP ROBUST ARRAY I/O USING THROUGH WAFER VIA

DESIGN STRUCTURE INCORPORATING SEMICONDUCTOR DEVICE STRUCTURES THAT...

SEMICONDUCTOR DEVICE STRUCTURES AND METHODS FOR SHIELDING A BOND PA...

STRUCTURE AND METHOD FOR ENHANCED TRIPLE WELL LATCHUP ROBUSTNESS

METAL-OXIDE-SEMICONDUCTOR (MOS) VARACTORS AND METHODS OF FORMING MO...

SYMMETRIC CAPACITOR STRUCTURE