David Shia

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Selectively applied protective layer on exposed materials of electr...
- Patent number 12,262,478
- Issue date Mar 25, 2025
- Intel Corporation
- Jin Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technologies for liquid cooling interfaces
- Patent number 12,248,344
- Issue date Mar 11, 2025
- Intel Corporation
- Kristin L. Weldon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cold plate architecture for liquid cooling of devices
- Patent number 12,133,357
- Issue date Oct 29, 2024
- Intel Corporation
- Jin Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic systems with inverted circuit board with heat sink to ch...
- Patent number 12,131,977
- Issue date Oct 29, 2024
- Intel Corporation
- Barrett M. Faneuf
- G11 - INFORMATION STORAGE
Information Patent Grant
Conformable cold plate for fluid cooling applications
- Patent number 12,063,759
- Issue date Aug 13, 2024
- Intel Corporation
- Berhanu Wondimu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vacuum modulated two phase cooling loop efficiency and parallelism...
- Patent number 12,057,370
- Issue date Aug 6, 2024
- Intel Corporation
- Paul Diglio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum modulated two phase cooling loop performance enhancement
- Patent number 11,976,671
- Issue date May 7, 2024
- Intel Corporation
- Paul Diglio
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic systems with inverted circuit board with heat sink to ch...
- Patent number 11,842,943
- Issue date Dec 12, 2023
- Intel Corporation
- Barrett M. Faneuf
- G11 - INFORMATION STORAGE
Information Patent Grant
Scalable, high load, low stiffness, and small footprint loading mec...
- Patent number 11,449,111
- Issue date Sep 20, 2022
- Intel Corporation
- Eric W. Buddrius
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fine pitch probe card methods and systems
- Patent number 11,262,384
- Issue date Mar 1, 2022
- Intel Corporation
- Pooya Tadayon
- G01 - MEASURING TESTING
Information Patent Grant
Converged test platforms and processes for class and system testing...
- Patent number 10,677,845
- Issue date Jun 9, 2020
- Intel Corporation
- Abram M. Detofsky
- G01 - MEASURING TESTING
Information Patent Grant
Movable heatsink utilizing flexible heat pipes
- Patent number 10,595,439
- Issue date Mar 17, 2020
- Intel Corporation
- David Shia
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Etching for probe wire tips for microelectronic device test
- Patent number 9,977,054
- Issue date May 22, 2018
- Intel Corporation
- Todd P. Albertson
- G01 - MEASURING TESTING
Information Patent Grant
Anti-rotation for wire probes in a probe head of a die tester
- Patent number 9,535,095
- Issue date Jan 3, 2017
- Intel Corporation
- David Shia
- G01 - MEASURING TESTING
Information Patent Grant
Adjustable heat pipe thermal unit
- Patent number 9,366,482
- Issue date Jun 14, 2016
- Intel Corporation
- Jin Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Composite wire probe test assembly
- Patent number 9,354,273
- Issue date May 31, 2016
- Intel Corporation
- Kip Stevenson
- G01 - MEASURING TESTING
Information Patent Grant
Test probe structures and methods including positioning test probe...
- Patent number 9,279,830
- Issue date Mar 8, 2016
- Intel Corporation
- Roy E. Swart
- G01 - MEASURING TESTING
Information Patent Grant
Micro positioning test socket and methods for active precision alig...
- Patent number 9,255,945
- Issue date Feb 9, 2016
- Intel Corporation
- Abram M Detofsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite wire probes for testing integrated circuits
- Patent number 9,207,258
- Issue date Dec 8, 2015
- Intel Corporation
- David Shia
- G01 - MEASURING TESTING
Information Patent Grant
Sort probe gripper
- Patent number 9,134,343
- Issue date Sep 15, 2015
- Intel Corporation
- David Shia
- G01 - MEASURING TESTING
Information Patent Grant
Wire probe assembly and forming process for die testing
- Patent number 9,069,014
- Issue date Jun 30, 2015
- Intel Corporation
- Todd P. Albertson
- G01 - MEASURING TESTING
Information Patent Grant
Positioning and socketing for semiconductor dice
- Patent number 8,797,053
- Issue date Aug 5, 2014
- Intel Corporation
- Michael L. Rutigliano
- G01 - MEASURING TESTING
Information Patent Grant
Micro positioning test socket and methods for active precision alig...
- Patent number 8,710,858
- Issue date Apr 29, 2014
- Intel Corporation
- Abram M Detofsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structural reinforcement for electronic substrate
- Patent number 7,161,238
- Issue date Jan 9, 2007
- Intel Corporation
- George Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink mounting and interface mechanism and method of assembling...
- Patent number 7,042,727
- Issue date May 9, 2006
- Intel Corporation
- Neal E. Ulen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Securing heat sinks
- Patent number 6,542,367
- Issue date Apr 1, 2003
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Securing heat sinks
- Patent number 6,522,545
- Issue date Feb 18, 2003
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink retention frame
- Patent number 6,519,153
- Issue date Feb 11, 2003
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ROBUST WAVEGUIDE ALIGNMENT MECHANISM
- Publication number 20250102745
- Publication date Mar 27, 2025
- Intel Corporation
- Mohanraj Prabhugoud
- G02 - OPTICS
Information Patent Application
COMPOSITE BACKPLATE ARCHITECTURES FOR BACKSIDE POWER DELIVERY AND A...
- Publication number 20250089192
- Publication date Mar 13, 2025
- Intel Corporation
- Phil Geng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tall DIMM Structural Retention
- Publication number 20250071924
- Publication date Feb 27, 2025
- Intel Corporation
- Phil Geng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COLD PLATE ARCHITECTURE FOR LIQUID COOLING OF DEVICES
- Publication number 20250071938
- Publication date Feb 27, 2025
- Intel Corporation
- Jin YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND SYSTEMS TO RETAIN A PRINTED CIRCUIT BOARD BETWEEN MOU...
- Publication number 20250024593
- Publication date Jan 16, 2025
- Phil Geng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNOLOGIES FOR SUBSTRATE FEATURES FOR A PLUGGABLE OPTICAL CONNECTOR
- Publication number 20250004225
- Publication date Jan 2, 2025
- Intel Corporation
- Mohanraj Prabhugoud
- G02 - OPTICS
Information Patent Application
CONFORMABLE COLD PLATE FOR FLUID COOLING APPLICATIONS
- Publication number 20240357774
- Publication date Oct 24, 2024
- Intel Corporation
- Berhanu WONDIMU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DAMPING ASSEMBLIES FOR HEAT SINKS AND RELATED METHODS
- Publication number 20240349457
- Publication date Oct 17, 2024
- Phil Geng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING SYSTEMS, APPARATUS, AND RELATED METHODS
- Publication number 20240260228
- Publication date Aug 1, 2024
- Intel Corporation
- Jimmy Chuang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MITIGATION OF SEISMIC EVENT EFFECTS ON LIQUID IMMERSION COOLING SYS...
- Publication number 20240240688
- Publication date Jul 18, 2024
- Phil Geng
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...
- Publication number 20240222288
- Publication date Jul 4, 2024
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ENTRY SOCKET POWER DELIVERY STRUCTURE AND BACKPLATE
- Publication number 20240179832
- Publication date May 30, 2024
- Phil Geng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULAR LOW LEVEL CONTACT RESISTANCE TESTING APPARATUS FOR PROCESS...
- Publication number 20240133945
- Publication date Apr 25, 2024
- Mohanraj Prabhugoud
- G01 - MEASURING TESTING
Information Patent Application
TECHNOLOGIES FOR A PLUGGABLE OPTICAL CONNECTOR
- Publication number 20240094476
- Publication date Mar 21, 2024
- Intel Corporation
- Wesley B. Morgan
- G02 - OPTICS
Information Patent Application
COOLING SYSTEMS WITH MAIN AND REMOTE COOLING MASSES HAVING INTEGRAT...
- Publication number 20240096741
- Publication date Mar 21, 2024
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEMS WITH INVERTED CIRCUIT BOARD WITH HEAT SINK TO CH...
- Publication number 20240063082
- Publication date Feb 22, 2024
- Intel Corporation
- Barrett M. Faneuf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONICS INTEGRATED CIRCUIT DEVICE PACKAGING
- Publication number 20240027706
- Publication date Jan 25, 2024
- Intel Corporation
- Pooya Tadayon
- G02 - OPTICS
Information Patent Application
PLUGGABLE OPTICAL CONNECTOR WITH INTERFACIAL ALIGNMENT FEATURES
- Publication number 20240027697
- Publication date Jan 25, 2024
- Intel Corporation
- Wesley B. Morgan
- G02 - OPTICS
Information Patent Application
BACKSIDE INTEGRATED TORSION LOADING MECHANISM
- Publication number 20230395460
- Publication date Dec 7, 2023
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTLY IMPINGING PRESSURE MODULATED SPRAY COOLING AND METHODS OF...
- Publication number 20230260870
- Publication date Aug 17, 2023
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
CIRCUIT DEVICES INTEGRATED WITH BOILING ENHANCEMENT FOR TWO-PHASE I...
- Publication number 20230180434
- Publication date Jun 8, 2023
- Intel Corporation
- David Shia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED PACKAGING ARCHITECTURE WITH SOLDER AND NON-SOLDER INTERC...
- Publication number 20230170327
- Publication date Jun 1, 2023
- Intel Corporation
- Jin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOILING ENHANCEMENT FOR TWO-PHASE IMMERSION COOLING OF INTEGRATED C...
- Publication number 20230137684
- Publication date May 4, 2023
- Intel Corporation
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL...
- Publication number 20230038805
- Publication date Feb 9, 2023
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK PLATES TO SUPPORT INTEGRATED CIRCUIT PACKAGES IN SOCKETS ON PR...
- Publication number 20230022058
- Publication date Jan 26, 2023
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
READILY ASSEMBLED/DISASSEMBLED COOLING ASSEMBLY FOR IMMERSION COOLE...
- Publication number 20220223495
- Publication date Jul 14, 2022
- Intel Corporation
- David SHIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER BACK PLATE WITH MOLDED CERAMIC LAYER
- Publication number 20220210950
- Publication date Jun 30, 2022
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID COOLING SYSTEM LEAK DETECTION IMPROVEMENTS
- Publication number 20220196507
- Publication date Jun 23, 2022
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING ASSEMBLY WITH STRAP ELEMENT TO DIMINISH LATERAL MOVEMENT OF...
- Publication number 20220174843
- Publication date Jun 2, 2022
- Intel Corporation
- Phil GENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL GRID ARRAY CHIP (BGA) PACKAGE COOLING ASSEMBLY WITH BOLSTER PLATE
- Publication number 20220117080
- Publication date Apr 14, 2022
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Selectively applied protective layer on exposed materials of electr...

Technologies for liquid cooling interfaces

Cold plate architecture for liquid cooling of devices

Electronic systems with inverted circuit board with heat sink to ch...

Conformable cold plate for fluid cooling applications

Vacuum modulated two phase cooling loop efficiency and parallelism...

Vacuum modulated two phase cooling loop performance enhancement

Electronic systems with inverted circuit board with heat sink to ch...

Scalable, high load, low stiffness, and small footprint loading mec...

Fine pitch probe card methods and systems

Converged test platforms and processes for class and system testing...

Movable heatsink utilizing flexible heat pipes

Etching for probe wire tips for microelectronic device test

Anti-rotation for wire probes in a probe head of a die tester

Adjustable heat pipe thermal unit

Composite wire probe test assembly

Test probe structures and methods including positioning test probe...

Micro positioning test socket and methods for active precision alig...

Composite wire probes for testing integrated circuits

Sort probe gripper

Wire probe assembly and forming process for die testing

Positioning and socketing for semiconductor dice

Micro positioning test socket and methods for active precision alig...

Structural reinforcement for electronic substrate

Heat sink mounting and interface mechanism and method of assembling...

Securing heat sinks

Securing heat sinks

Heat sink retention frame

Patents Applicationslast 30 patents

ROBUST WAVEGUIDE ALIGNMENT MECHANISM

COMPOSITE BACKPLATE ARCHITECTURES FOR BACKSIDE POWER DELIVERY AND A...

Tall DIMM Structural Retention

COLD PLATE ARCHITECTURE FOR LIQUID COOLING OF DEVICES

APPARATUS AND SYSTEMS TO RETAIN A PRINTED CIRCUIT BOARD BETWEEN MOU...

TECHNOLOGIES FOR SUBSTRATE FEATURES FOR A PLUGGABLE OPTICAL CONNECTOR

CONFORMABLE COLD PLATE FOR FLUID COOLING APPLICATIONS

DAMPING ASSEMBLIES FOR HEAT SINKS AND RELATED METHODS

IMMERSION COOLING SYSTEMS, APPARATUS, AND RELATED METHODS

MITIGATION OF SEISMIC EVENT EFFECTS ON LIQUID IMMERSION COOLING SYS...

SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...

MULTI-ENTRY SOCKET POWER DELIVERY STRUCTURE AND BACKPLATE

MODULAR LOW LEVEL CONTACT RESISTANCE TESTING APPARATUS FOR PROCESS...

TECHNOLOGIES FOR A PLUGGABLE OPTICAL CONNECTOR

COOLING SYSTEMS WITH MAIN AND REMOTE COOLING MASSES HAVING INTEGRAT...

ELECTRONIC SYSTEMS WITH INVERTED CIRCUIT BOARD WITH HEAT SINK TO CH...

PHOTONICS INTEGRATED CIRCUIT DEVICE PACKAGING

PLUGGABLE OPTICAL CONNECTOR WITH INTERFACIAL ALIGNMENT FEATURES

BACKSIDE INTEGRATED TORSION LOADING MECHANISM

DIRECTLY IMPINGING PRESSURE MODULATED SPRAY COOLING AND METHODS OF...

CIRCUIT DEVICES INTEGRATED WITH BOILING ENHANCEMENT FOR TWO-PHASE I...

INTEGRATED PACKAGING ARCHITECTURE WITH SOLDER AND NON-SOLDER INTERC...

BOILING ENHANCEMENT FOR TWO-PHASE IMMERSION COOLING OF INTEGRATED C...

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL...

BACK PLATES TO SUPPORT INTEGRATED CIRCUIT PACKAGES IN SOCKETS ON PR...

READILY ASSEMBLED/DISASSEMBLED COOLING ASSEMBLY FOR IMMERSION COOLE...

MULTILAYER BACK PLATE WITH MOLDED CERAMIC LAYER

LIQUID COOLING SYSTEM LEAK DETECTION IMPROVEMENTS

COOLING ASSEMBLY WITH STRAP ELEMENT TO DIMINISH LATERAL MOVEMENT OF...

BALL GRID ARRAY CHIP (BGA) PACKAGE COOLING ASSEMBLY WITH BOLSTER PLATE