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David T. Roman
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Tempe, AZ, US
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last 30 patents
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Patent Grant
Semiconductor package with exposed die pad and body-locking leadframe
Patent number
6,965,157
Issue date
Nov 15, 2005
Amkor Technology, Inc.
Erasmo Perez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Compact flash memory card with clamshell leadframe
Patent number
6,919,620
Issue date
Jul 19, 2005
Amkor Technology, Inc.
Jeffrey Alan Miks
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with exposed die pad and body-locking leadframe
Patent number
6,847,103
Issue date
Jan 25, 2005
Amkor Technology, Inc.
Erasmo Perez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plastic integrated circuit device package and method for making the...
Patent number
6,521,987
Issue date
Feb 18, 2003
Amkor Technology, Inc.
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for moding a leadframe in plastic integrated circuit devices
Patent number
6,455,356
Issue date
Sep 24, 2002
Amkor Technology
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plastic integrated circuit device package and leadframe having part...
Patent number
6,281,568
Issue date
Aug 28, 2001
Amkor Technology, Inc.
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS