David V. Pedersen

Person

Scotts Valley, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for implementing telemetry applications on a...
- Patent number 10,079,942
- Issue date Sep 18, 2018
- Aeris Communications, Inc.
- Dae Seong Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of repairing segmented contactor
- Patent number 8,011,089
- Issue date Sep 6, 2011
- FormFactor, Inc.
- Mohammad Eslamy
- G01 - MEASURING TESTING
Information Patent Grant
Lithographically defined microelectronic contact structures
- Patent number 7,714,235
- Issue date May 11, 2010
- FormFactor, Inc.
- David V. Pedersen
- G01 - MEASURING TESTING
Information Patent Grant
Wafer-level burn-in and test
- Patent number 7,688,090
- Issue date Mar 30, 2010
- FormFactor, Inc.
- Igor Y. Khandros
- G01 - MEASURING TESTING
Information Patent Grant
Microelectronic spring contact elements
- Patent number 7,579,269
- Issue date Aug 25, 2009
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating segmented contactor
- Patent number 7,578,057
- Issue date Aug 25, 2009
- FormFactor, Inc.
- Mohammad Eslamy
- G01 - MEASURING TESTING
Information Patent Grant
Test assembly including a test die for testing a semiconductor prod...
- Patent number 7,557,596
- Issue date Jul 7, 2009
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Grant
Socket for making with electronic component, particularly semicondu...
- Patent number 7,534,654
- Issue date May 19, 2009
- FormFactor, Inc.
- David V. Pedersen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-level burn-in and test
- Patent number 7,345,493
- Issue date Mar 18, 2008
- FormFactor, Inc.
- Igor Y. Khandros
- G01 - MEASURING TESTING
Information Patent Grant
Method for processing an integrated circuit
- Patent number 7,217,580
- Issue date May 15, 2007
- FormFactor. Inc.
- Douglas S. Ondricek
- G01 - MEASURING TESTING
Information Patent Grant
Segmented contactor
- Patent number 7,215,131
- Issue date May 8, 2007
- FormFactor, Inc.
- Mohammad Eslamy
- G01 - MEASURING TESTING
Information Patent Grant
Socket for mating with electronic component, particularly semicondu...
- Patent number 7,202,677
- Issue date Apr 10, 2007
- FormFactor, Inc.
- David V. Pedersen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-level burn-in and test
- Patent number 7,078,926
- Issue date Jul 18, 2006
- FormFactor, Inc.
- Igor Y. Khandros
- G01 - MEASURING TESTING
Information Patent Grant
Segmented contactor
- Patent number 7,065,870
- Issue date Jun 27, 2006
- FormFactor, Inc.
- Mohammad Eslamy
- G01 - MEASURING TESTING
Information Patent Grant
Sockets for “springed” semiconductor devices
- Patent number 7,059,047
- Issue date Jun 13, 2006
- FormFactor, Inc.
- Thomas H. Dozier, II
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Special contact points for accessing internal circuitry of an integ...
- Patent number 6,940,093
- Issue date Sep 6, 2005
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Grant
Test assembly including a test die for testing a semiconductor prod...
- Patent number 6,825,052
- Issue date Nov 30, 2004
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Grant
Wafer-level burn-in and test
- Patent number 6,788,094
- Issue date Sep 7, 2004
- FormFactor, Inc.
- Igor Y. Khandros
- G01 - MEASURING TESTING
Information Patent Grant
Microelectronic spring contact elements
- Patent number 6,727,580
- Issue date Apr 27, 2004
- FormFactor, Inc.
- Benjamin N. Eldridge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large contactor with multiple, aligned contactor units
- Patent number 6,690,185
- Issue date Feb 10, 2004
- FormFactor, Inc.
- Igor Y Khandros
- G01 - MEASURING TESTING
Information Patent Grant
Electronic component overlapping dice of unsingulated semiconductor...
- Patent number 6,664,628
- Issue date Dec 16, 2003
- FormFactor, Inc.
- Igor Y. Khandros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for the transport and tracking of an electroni...
- Patent number 6,644,982
- Issue date Nov 11, 2003
- FormFactor, Inc.
- Douglas S. Ondricek
- G01 - MEASURING TESTING
Information Patent Grant
Segmented contactor
- Patent number 6,640,415
- Issue date Nov 4, 2003
- FormFactor, Inc.
- Mohammad Eslamy
- G01 - MEASURING TESTING
Information Patent Grant
Method for mounting an electronic component
- Patent number 6,627,483
- Issue date Sep 30, 2003
- FormFactor, Inc.
- Douglas S. Ondricek
- G01 - MEASURING TESTING
Information Patent Grant
Special contact points for accessing internal circuitry of an integ...
- Patent number 6,621,260
- Issue date Sep 16, 2003
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Grant
Special contact points for accessing internal circuitry of an integ...
- Patent number 6,603,324
- Issue date Aug 5, 2003
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Grant
Special contact points for accessing internal circuitry of an integ...
- Patent number 6,597,187
- Issue date Jul 22, 2003
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Grant
Test assembly including a test die for testing a semiconductor prod...
- Patent number 6,551,844
- Issue date Apr 22, 2003
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Grant
Sockets for “springed” semiconductor devices
- Patent number 6,534,856
- Issue date Mar 18, 2003
- FormFactor, Inc.
- Thomas H. Dozier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-level burn-in and test
- Patent number 6,525,555
- Issue date Feb 25, 2003
- FormFactor, Inc.
- Igor Y. Khandros
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEGMENTED CONTACTOR
- Publication number 20110171838
- Publication date Jul 14, 2011
- FormFactor, Inc.
- Mohammad Eslamy
- G01 - MEASURING TESTING
Information Patent Application
SEGMENTED CONTACTOR
- Publication number 20100043226
- Publication date Feb 25, 2010
- FormFactor, Inc.
- Mohammad Eslamy
- G01 - MEASURING TESTING
Information Patent Application
WAFER-LEVEL BURN-IN AND TEST
- Publication number 20080157808
- Publication date Jul 3, 2008
- FormFactor, Inc.
- Igor Y. Khandros
- G01 - MEASURING TESTING
Information Patent Application
Socket For Making With Electronic Component, Particularly Semicondu...
- Publication number 20070285114
- Publication date Dec 13, 2007
- FormFactor, Inc.
- David V. Pedersen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PROCESSING AN INTEGRATED CIRCUIT
- Publication number 20070269909
- Publication date Nov 22, 2007
- FormFactor, Inc.
- Douglas S. Ondricek
- G01 - MEASURING TESTING
Information Patent Application
WAFER-LEVEL BURN-IN AND TEST
- Publication number 20070013401
- Publication date Jan 18, 2007
- FormFactor, Inc.
- Igor Y. Khandros
- G01 - MEASURING TESTING
Information Patent Application
Segmented Contactor
- Publication number 20060244469
- Publication date Nov 2, 2006
- FormFactor, Inc.
- Mohammad Eslamy
- G01 - MEASURING TESTING
Information Patent Application
SOCKETS FOR "SPRINGED" SEMICONDUCTOR DEVICES
- Publication number 20060223345
- Publication date Oct 5, 2006
- FormFactor, Inc.
- Thomas H. Dozier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods and apparatus for implementing telemetry applications on a...
- Publication number 20060094467
- Publication date May 4, 2006
- Dae Seong Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Special contact points for accessing internal circuitry of an inter...
- Publication number 20060006384
- Publication date Jan 12, 2006
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Application
Test assembly including a test die for testing a semiconductor prod...
- Publication number 20050156165
- Publication date Jul 21, 2005
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Application
Wafer-level burn-in and test
- Publication number 20050017750
- Publication date Jan 27, 2005
- FormFactor, Inc.
- Igor Y. Khandros
- G01 - MEASURING TESTING
Information Patent Application
Microelectronic spring contact elements
- Publication number 20040198081
- Publication date Oct 7, 2004
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Socket for mating with electronic component, particularly semicondu...
- Publication number 20040152348
- Publication date Aug 5, 2004
- FormFactor, Inc.
- David V. Pedersen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sockets for "springed" semiconductor device
- Publication number 20040064941
- Publication date Apr 8, 2004
- FormFactor, Inc.
- Thomas H. Dozier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Segmented contactor
- Publication number 20040058487
- Publication date Mar 25, 2004
- FormFactor, Inc.
- Mohammad Eslamy
- G01 - MEASURING TESTING
Information Patent Application
Test assembly including a test die for testing a semiconductor prod...
- Publication number 20040004216
- Publication date Jan 8, 2004
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Application
Wafer-level burn-in and test
- Publication number 20030107394
- Publication date Jun 12, 2003
- FormFactor, Inc.
- Igor Y. Khandros
- G01 - MEASURING TESTING
Information Patent Application
Sockets for "springed" semiconductor devices
- Publication number 20030067080
- Publication date Apr 10, 2003
- FormFactor, Inc.
- Thomas H. Dozier
- G01 - MEASURING TESTING
Information Patent Application
Segmented contactor
- Publication number 20030057975
- Publication date Mar 27, 2003
- FormFactor, Inc.
- Mohammad Eslamy
- G01 - MEASURING TESTING
Information Patent Application
Electronic component overlapping dice of unsingulated semiconductor...
- Publication number 20020074653
- Publication date Jun 20, 2002
- FormFactor, Inc.
- Igor Y. Khandros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING AN ELECTRONIC COMPONENT
- Publication number 20020025603
- Publication date Feb 28, 2002
- DOUGLAS S. ONDRICEK
- G01 - MEASURING TESTING
Information Patent Application
ATTARATUS FOR SOCKETABLY RECEIVING INTERCONNECTION ELEMENTS OF AN E...
- Publication number 20020004320
- Publication date Jan 10, 2002
- DAVID V. PEDERSEN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Special contact points for accessing internal circuitry of an integ...
- Publication number 20010052786
- Publication date Dec 20, 2001
- FormFactor, Inc. a Delaware coporation
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Application
Special contact points for accessing internal circuitry of an integ...
- Publication number 20010020747
- Publication date Sep 13, 2001
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Application
Special contact points for accessing internal circuitry of an integ...
- Publication number 20010020743
- Publication date Sep 13, 2001
- FormFactor. Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Application
Special contact points for accessing internal circuitry of an integ...
- Publication number 20010015773
- Publication date Aug 23, 2001
- FormFactor, Inc., a Delaware corporation
- Benjamin N. Eldridge
- G01 - MEASURING TESTING

David V. Pedersen

Person

Patents Grantslast 30 patents

Methods and apparatus for implementing telemetry applications on a...

Method of repairing segmented contactor

Lithographically defined microelectronic contact structures

Wafer-level burn-in and test

Microelectronic spring contact elements

Method of fabricating segmented contactor

Test assembly including a test die for testing a semiconductor prod...

Socket for making with electronic component, particularly semicondu...

Wafer-level burn-in and test

Method for processing an integrated circuit

Segmented contactor

Socket for mating with electronic component, particularly semicondu...

Wafer-level burn-in and test

Segmented contactor

Sockets for “springed” semiconductor devices

Special contact points for accessing internal circuitry of an integ...

Test assembly including a test die for testing a semiconductor prod...

Wafer-level burn-in and test

Microelectronic spring contact elements

Large contactor with multiple, aligned contactor units

Electronic component overlapping dice of unsingulated semiconductor...

Method and apparatus for the transport and tracking of an electroni...

Segmented contactor

Method for mounting an electronic component

Special contact points for accessing internal circuitry of an integ...

Special contact points for accessing internal circuitry of an integ...

Special contact points for accessing internal circuitry of an integ...

Test assembly including a test die for testing a semiconductor prod...

Sockets for &#x0201C;springed&#x0201D; semiconductor devices

Wafer-level burn-in and test

Patents Applicationslast 30 patents

SEGMENTED CONTACTOR

SEGMENTED CONTACTOR

WAFER-LEVEL BURN-IN AND TEST

Socket For Making With Electronic Component, Particularly Semicondu...

METHOD FOR PROCESSING AN INTEGRATED CIRCUIT

WAFER-LEVEL BURN-IN AND TEST

Segmented Contactor

SOCKETS FOR "SPRINGED" SEMICONDUCTOR DEVICES

Methods and apparatus for implementing telemetry applications on a...

Special contact points for accessing internal circuitry of an inter...

Test assembly including a test die for testing a semiconductor prod...

Wafer-level burn-in and test

Microelectronic spring contact elements

Socket for mating with electronic component, particularly semicondu...

Sockets for "springed" semiconductor device

Segmented contactor

Test assembly including a test die for testing a semiconductor prod...

Wafer-level burn-in and test

Sockets for "springed" semiconductor devices

Segmented contactor

Electronic component overlapping dice of unsingulated semiconductor...

METHOD FOR MOUNTING AN ELECTRONIC COMPONENT

ATTARATUS FOR SOCKETABLY RECEIVING INTERCONNECTION ELEMENTS OF AN E...

Special contact points for accessing internal circuitry of an integ...

Special contact points for accessing internal circuitry of an integ...

Special contact points for accessing internal circuitry of an integ...

Special contact points for accessing internal circuitry of an integ...

Sockets for “springed” semiconductor devices