David W. Abraham

Person

Croton, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Downstop and bump bonds formation on substrates
- Patent number 12,150,390
- Issue date Nov 19, 2024
- International Business Machines Corporation
- David Abraham
Information Patent Grant
Create a protected layer for interconnects and devices in a package...
- Patent number 12,033,981
- Issue date Jul 9, 2024
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer chips and enclosures for quantum circuits
- Patent number 11,908,756
- Issue date Feb 20, 2024
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined backing plate and housing for use in bump bonded chip asse...
- Patent number 11,804,442
- Issue date Oct 31, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined backing plate and housing for use in bump bonded chip asse...
- Patent number 11,676,903
- Issue date Jun 13, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset embedded ground plane cutout
- Patent number 11,411,158
- Issue date Aug 9, 2022
- International Business Machines Corporation
- Timothy Phung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mechanically tunable superconducting qubit
- Patent number 10,937,941
- Issue date Mar 2, 2021
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including superconducting metal through-silico...
- Patent number 10,833,016
- Issue date Nov 10, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial transmission line slot filter with absorptive matrix
- Patent number 10,756,410
- Issue date Aug 25, 2020
- International Business Machines Corporation
- David W. Abraham
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,734,567
- Issue date Aug 4, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,727,391
- Issue date Jul 28, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple sized bump bonds
- Patent number 10,727,192
- Issue date Jul 28, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-destructive testing of integrated circuit chips
- Patent number 10,651,099
- Issue date May 12, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-component bump metallization
- Patent number 10,629,797
- Issue date Apr 21, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-component bump metallization
- Patent number 10,608,158
- Issue date Mar 31, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including superconducting metal through-silico...
- Patent number 10,504,842
- Issue date Dec 10, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Josephson junctions for improved qubits
- Patent number 10,380,494
- Issue date Aug 13, 2019
- International Business Machines Corporation
- David W. Abraham
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Through-substrate-vias with self-aligned solder bumps
- Patent number 10,347,600
- Issue date Jul 9, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate-vias with self-aligned solder bumps
- Patent number 10,325,870
- Issue date Jun 18, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Josephson junctions for improved qubits
- Patent number 10,268,968
- Issue date Apr 23, 2019
- International Business Machines Corporation
- David W. Abraham
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Qubits by selective laser-modulated deposition
- Patent number 10,170,680
- Issue date Jan 1, 2019
- International Business Machines Corporation
- David W. Abraham
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device including superconducting metal through-silico...
- Patent number 10,157,842
- Issue date Dec 18, 2018
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically tunable superconducting qubit
- Patent number 10,056,540
- Issue date Aug 21, 2018
- International Business Machines Corporation
- David W. Abraham
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of assembling microwave connector with filtering properties...
- Patent number 9,948,050
- Issue date Apr 17, 2018
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically tunable superconducting qubit
- Patent number 9,935,252
- Issue date Apr 3, 2018
- International Business Machines Corporation
- David W. Abraham
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of forming a coaxial transmission line slot filter with abso...
- Patent number 9,847,568
- Issue date Dec 19, 2017
- International Business Machines Corporation
- David W. Abraham
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Planar qubits having increased coherence times
- Patent number 9,818,796
- Issue date Nov 14, 2017
- GLOBALFOUNDRIES Inc.
- David W. Abraham
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Removal of spurious microwave modes via flip-chip crossover
- Patent number 9,531,055
- Issue date Dec 27, 2016
- International Business Machines Corporation
- David W. Abraham
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Chip mode isolation and cross-talk reduction through buried metal l...
- Patent number 9,520,547
- Issue date Dec 13, 2016
- International Business Machines Corporation
- David W. Abraham
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Mechanically tunable superconducting qubit
- Patent number 9,503,063
- Issue date Nov 22, 2016
- International Business Machines Corporation
- David W. Abraham
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
SILICON THERMALIZER FOR CRYOGENIC MICROWAVE APPLICATION USING A COP...
- Publication number 20240230202
- Publication date Jul 11, 2024
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON THERMALIZER FOR CRYOGENIC MICROWAVE APPLICATION USING A COP...
- Publication number 20240133609
- Publication date Apr 25, 2024
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE CAPACITIVE COUPLING FOR QUANTUM CHIPS
- Publication number 20240104414
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Muir Kumph
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES
- Publication number 20240038723
- Publication date Feb 1, 2024
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOWNSTOP AND BUMP BONDS FORMATION ON SUBSTRATES
- Publication number 20230363295
- Publication date Nov 9, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR QUANTUM CHIP DESIGN WITH OVERLAPPING CONNECTION
- Publication number 20230359917
- Publication date Nov 9, 2023
- International Business Machines Corporation
- David Abraham
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRICAL CONNECTIONS BETWEEN DISSIMILAR MATERIALS AT CRYOGENIC TE...
- Publication number 20230363294
- Publication date Nov 9, 2023
- International Business Machines Corporation
- David Abraham
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MODULAR QUANTUM SYSTEM WITH DISCRETE LEVELS OF CONNECTIVITY
- Publication number 20230363296
- Publication date Nov 9, 2023
- International Business Machines Corporation
- Oliver Dial
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMBINED BACKING PLATE AND HOUSING FOR USE IN BUMP BONDED CHIP ASSE...
- Publication number 20230230927
- Publication date Jul 20, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER CHIPS AND ENCLOSURES FOR QUANTUM CIRCUITS
- Publication number 20230197539
- Publication date Jun 22, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONDUCTION LAYER
- Publication number 20230058897
- Publication date Feb 23, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER CREEP LIMITING RIGID SPACER FOR STACKED DIE C4 PACKAGING
- Publication number 20230058638
- Publication date Feb 23, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET EMBEDDED GROUND PLANE CUTOUT
- Publication number 20220199886
- Publication date Jun 23, 2022
- International Business Machines Corporation
- Timothy Phung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-LAYERED PACKAGING FOR SUPERCONDUCTING QUANTUM CIRCUITS
- Publication number 20220199507
- Publication date Jun 23, 2022
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CREATE A PROTECTED LAYER FOR INTERCONNECTS AND DEVICES IN A PACKAGE...
- Publication number 20220189922
- Publication date Jun 16, 2022
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE DAMASCENE PROCESS
- Publication number 20220102201
- Publication date Mar 31, 2022
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINED BACKING PLATE AND HOUSING FOR USE IN BUMP BONDED CHIP ASSE...
- Publication number 20220059465
- Publication date Feb 24, 2022
- International Business Machines Corporation
- David Abraham
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SUPERCONDUCTING METAL THROUGH-SILICO...
- Publication number 20200251419
- Publication date Aug 6, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE SIZED BUMP BONDS
- Publication number 20200035585
- Publication date Jan 30, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOSEPHSON JUNCTIONS FOR IMPROVED QUBITS
- Publication number 20190228332
- Publication date Jul 25, 2019
- International Business Machines Corporation
- David W. Abraham
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTIPLE SIZED BUMP BONDS
- Publication number 20190198474
- Publication date Jun 27, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-COMPONENT BUMP METALLIZATION
- Publication number 20190131510
- Publication date May 2, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BONDED CRYOGENIC CHIP CARRIER
- Publication number 20190131509
- Publication date May 2, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUBITS BY SELECTIVE LASER-MODULATED DEPOSITION
- Publication number 20190109273
- Publication date Apr 11, 2019
- International Business Machines Corporation
- David W. Abraham
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BUMP BONDED CRYOGENIC CHIP CARRIER
- Publication number 20190103541
- Publication date Apr 4, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-COMPONENT BUMP METALLIZATION
- Publication number 20190103542
- Publication date Apr 4, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOSEPHSON JUNCTIONS FOR IMPROVED QUBITS
- Publication number 20190042962
- Publication date Feb 7, 2019
- International Business Machines Corporation
- David W. Abraham
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
JOSEPHSON JUNCTIONS FOR IMPROVED QUBITS
- Publication number 20190042963
- Publication date Feb 7, 2019
- International Business Machines Corporation
- David W. Abraham
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
NON-DESTRUCTIVE TESTING OF INTEGRATED CIRCUIT CHIPS
- Publication number 20190013252
- Publication date Jan 10, 2019
- International Business Machines Corporation
- David W. Abraham
- G01 - MEASURING TESTING
Information Patent Application
NON-DESTRUCTIVE TESTING OF INTEGRATED CIRCUIT CHIPS
- Publication number 20190013251
- Publication date Jan 10, 2019
- International Business Machines Corporation
- David W. Abraham
- G01 - MEASURING TESTING

David W. Abraham

Person

Patents Grantslast 30 patents

Downstop and bump bonds formation on substrates

Create a protected layer for interconnects and devices in a package...

Interposer chips and enclosures for quantum circuits

Combined backing plate and housing for use in bump bonded chip asse...

Combined backing plate and housing for use in bump bonded chip asse...

Offset embedded ground plane cutout

Mechanically tunable superconducting qubit

Semiconductor device including superconducting metal through-silico...

Coaxial transmission line slot filter with absorptive matrix

Bump bonded cryogenic chip carrier

Bump bonded cryogenic chip carrier

Multiple sized bump bonds

Non-destructive testing of integrated circuit chips

Two-component bump metallization

Two-component bump metallization

Semiconductor device including superconducting metal through-silico...

Josephson junctions for improved qubits

Through-substrate-vias with self-aligned solder bumps

Through-substrate-vias with self-aligned solder bumps

Josephson junctions for improved qubits

Qubits by selective laser-modulated deposition

Semiconductor device including superconducting metal through-silico...

Mechanically tunable superconducting qubit

Method of assembling microwave connector with filtering properties...

Mechanically tunable superconducting qubit

Method of forming a coaxial transmission line slot filter with abso...

Planar qubits having increased coherence times

Removal of spurious microwave modes via flip-chip crossover

Chip mode isolation and cross-talk reduction through buried metal l...

Mechanically tunable superconducting qubit

Patents Applicationslast 30 patents

SILICON THERMALIZER FOR CRYOGENIC MICROWAVE APPLICATION USING A COP...

SILICON THERMALIZER FOR CRYOGENIC MICROWAVE APPLICATION USING A COP...

EDGE CAPACITIVE COUPLING FOR QUANTUM CHIPS

CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES

DOWNSTOP AND BUMP BONDS FORMATION ON SUBSTRATES

MODULAR QUANTUM CHIP DESIGN WITH OVERLAPPING CONNECTION

ELECTRICAL CONNECTIONS BETWEEN DISSIMILAR MATERIALS AT CRYOGENIC TE...

MODULAR QUANTUM SYSTEM WITH DISCRETE LEVELS OF CONNECTIVITY

COMBINED BACKING PLATE AND HOUSING FOR USE IN BUMP BONDED CHIP ASSE...

INTERPOSER CHIPS AND ENCLOSURES FOR QUANTUM CIRCUITS

THERMAL CONDUCTION LAYER

SOLDER CREEP LIMITING RIGID SPACER FOR STACKED DIE C4 PACKAGING

OFFSET EMBEDDED GROUND PLANE CUTOUT

MULTI-LAYERED PACKAGING FOR SUPERCONDUCTING QUANTUM CIRCUITS

CREATE A PROTECTED LAYER FOR INTERCONNECTS AND DEVICES IN A PACKAGE...

ADDITIVE DAMASCENE PROCESS

COMBINED BACKING PLATE AND HOUSING FOR USE IN BUMP BONDED CHIP ASSE...

SEMICONDUCTOR DEVICE INCLUDING SUPERCONDUCTING METAL THROUGH-SILICO...

MULTIPLE SIZED BUMP BONDS

JOSEPHSON JUNCTIONS FOR IMPROVED QUBITS

MULTIPLE SIZED BUMP BONDS

TWO-COMPONENT BUMP METALLIZATION

BUMP BONDED CRYOGENIC CHIP CARRIER

QUBITS BY SELECTIVE LASER-MODULATED DEPOSITION

BUMP BONDED CRYOGENIC CHIP CARRIER

TWO-COMPONENT BUMP METALLIZATION

JOSEPHSON JUNCTIONS FOR IMPROVED QUBITS

JOSEPHSON JUNCTIONS FOR IMPROVED QUBITS

NON-DESTRUCTIVE TESTING OF INTEGRATED CIRCUIT CHIPS

NON-DESTRUCTIVE TESTING OF INTEGRATED CIRCUIT CHIPS