David W. Zimmerman

Person

Fishers, IN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electromagnetic interference shielding and thermal management syste...
- Patent number 12,137,515
- Issue date Nov 5, 2024
- Aptiv Technologies AG
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formed waveguide antennas of a radar assembly
- Patent number 12,058,804
- Issue date Aug 6, 2024
- Aptiv Technologies AG
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered air waveguide antenna with layer-to-layer connections
- Patent number 11,973,268
- Issue date Apr 30, 2024
- Aptiv Technologies AG
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radar antenna system comprising an air waveguide antenna having a s...
- Patent number 11,962,087
- Issue date Apr 16, 2024
- Aptiv Technologies AG
- Scott D. Brandenburg
- G01 - MEASURING TESTING
Information Patent Grant
Heatsink shield with thermal-contact dimples for thermal-energy dis...
- Patent number 11,737,203
- Issue date Aug 22, 2023
- Aptiv Technologies Limited
- Scott Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plastic air-waveguide antenna with conductive particles
- Patent number 11,728,576
- Issue date Aug 15, 2023
- Aptiv Technologies Limited
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooled module with device heat spreader
- Patent number 11,626,345
- Issue date Apr 11, 2023
- Aptiv Technologies Limited
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, method and system comprising an air waveguide antenna ha...
- Patent number 11,616,306
- Issue date Mar 28, 2023
- Aptiv Technologies Limited
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide antenna with integrated temperature management
- Patent number 11,509,035
- Issue date Nov 22, 2022
- Aptiv Technologies Limited
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink shield with thermal-contact dimples for thermal-energy dis...
- Patent number 11,382,205
- Issue date Jul 5, 2022
- Aptiv Technologies Limited
- Scott Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plastic air-waveguide antenna with conductive particles
- Patent number 11,362,436
- Issue date Jun 14, 2022
- Aptiv Technologies Limited
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface layer for electronic device
- Patent number 11,315,852
- Issue date Apr 26, 2022
- Aptiv Technologies Limited
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna device with direct differential input useable on an automat...
- Patent number 11,183,751
- Issue date Nov 23, 2021
- Aptiv Technologies Limited
- George J. Purden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooled module with device heat spreader
- Patent number 11,121,058
- Issue date Sep 14, 2021
- Aptiv Technologies Limited
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide antenna with integrated temperature management
- Patent number 11,095,014
- Issue date Aug 17, 2021
- Aptiv Technologies Limited
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball-grid-array radio-frequency integrated-circuit printed-circuit-...
- Patent number 10,199,707
- Issue date Feb 5, 2019
- APTIV TECHNOLOGIES LIMITED
- George J. Purden
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical-device adhesive barrier
- Patent number 9,978,707
- Issue date May 22, 2018
- Delphi Technologies, Inc.
- David W. Zimmerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mountable microwave signal transition block for microstrip...
- Patent number 8,680,936
- Issue date Mar 25, 2014
- Delphi Technologies, Inc.
- George J. Purden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave communication package
- Patent number 7,855,685
- Issue date Dec 21, 2010
- Delphi Technologies, Inc.
- Matthew R. Walsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink electronic package having compliant pedestal
- Patent number 7,440,282
- Issue date Oct 21, 2008
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of surface-mount circuit devices
- Patent number 7,365,273
- Issue date Apr 29, 2008
- Delphi Technologies, Inc.
- Manuel R. Fairchild
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip heat sink package and method
- Patent number 7,352,585
- Issue date Apr 1, 2008
- Delphi Technologies, Inc.
- Larry M Mandel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip heat sink package and method
- Patent number 7,180,745
- Issue date Feb 20, 2007
- Delphi Technologies, Inc.
- Larry M Mandel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Solderable Waveguide Antenna
- Publication number 20240022001
- Publication date Jan 18, 2024
- Aptiv Technologies Limited
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus, Method and System Comprising an Air Waveguide Antenna Ha...
- Publication number 20230378656
- Publication date Nov 23, 2023
- Aptiv Technologies Limited
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Waveguide with Slot Antennas and Reflectors
- Publication number 20230352845
- Publication date Nov 2, 2023
- Aptiv Technologies Limited
- Biswadeep Das Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL HORN AIR WAVEGUIDE ANTENNA MADE WITH FORMED AND B...
- Publication number 20230318190
- Publication date Oct 5, 2023
- Aptiv Technologies Limited
- Scott Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Antenna Assembly with Integrated Features
- Publication number 20230208016
- Publication date Jun 29, 2023
- Aptiv Technologies Limited
- Scott D. Brandenburg
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Multi-Layered Air Waveguide Antenna with Layer-to-Layer Connections
- Publication number 20220352640
- Publication date Nov 3, 2022
- Aptiv Technologies Limited
- Scott D. Brandenburg
- G01 - MEASURING TESTING
Information Patent Application
Single-Layer Air Waveguide Antenna Integrated on Circuit Board
- Publication number 20220302570
- Publication date Sep 22, 2022
- Aptiv Technologies Limited
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heatsink Shield with Thermal-Contact Dimples for Thermal-Energy Dis...
- Publication number 20220304139
- Publication date Sep 22, 2022
- Aptiv Technologies Limited
- Scott Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plastic Air-Waveguide Antenna with Conductive Particles
- Publication number 20220271437
- Publication date Aug 25, 2022
- Aptiv Technologies Limited
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formed Waveguide Antennas of a Radar Assembly
- Publication number 20220256685
- Publication date Aug 11, 2022
- Aptiv Technologies Limited
- Scott D. Brandenburg
- G01 - MEASURING TESTING
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELDING AND THERMAL MANAGEMENT SYSTE...
- Publication number 20220248525
- Publication date Aug 4, 2022
- Aptiv Technologies Limited
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic Air-Waveguide Antenna with Conductive Particles
- Publication number 20220109247
- Publication date Apr 7, 2022
- Aptiv Technologies Limited
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heatsink Shield with Thermal-Contact Dimples for Thermal-Energy Dis...
- Publication number 20220087006
- Publication date Mar 17, 2022
- Aptiv Technologies Limited
- Scott Brandenburg
- G01 - MEASURING TESTING
Information Patent Application
Liquid Cooled Module with Device Heat Spreader
- Publication number 20210375718
- Publication date Dec 2, 2021
- Aptiv Technologies Limited
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE ANTENNA WITH INTEGRATED TEMPERATURE MANAGEMENT
- Publication number 20210344100
- Publication date Nov 4, 2021
- Aptiv Technologies Limited
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAVEGUIDE ANTENNA WITH INTEGRATED TEMPERATURE MANAGEMENT
- Publication number 20210210832
- Publication date Jul 8, 2021
- Aptiv Technologies Limited
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE LAYER FOR ELECTRONIC DEVICE
- Publication number 20210111096
- Publication date Apr 15, 2021
- Aptiv Technologies Limited
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID COOLED MODULE WITH DEVICE HEAT SPREADER
- Publication number 20210028088
- Publication date Jan 28, 2021
- Aptiv Technologies Limited
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE WITH DIRECT DIFFERENTIAL INPUT USEABLE ON AN AUTOMAT...
- Publication number 20190089042
- Publication date Mar 21, 2019
- Aptiv Technologies Limited
- George J. Purden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL-GRID-ARRAY RADIO-FREQUENCY INTEGRATED-CIRCUIT PRINTED-CIRCUIT-...
- Publication number 20180108968
- Publication date Apr 19, 2018
- Delphi Technologies, Inc.
- George J. Purden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD ASSEMBLY WITH HIGH AND LOW FREQUENCY SUBSTRATES
- Publication number 20160197400
- Publication date Jul 7, 2016
- Delphi Technologies, Inc.
- DAVID W. ZIMMERMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNTABLE MICROWAVE SIGNAL TRANSITION BLOCK FOR MICROSTRIP...
- Publication number 20130127562
- Publication date May 23, 2013
- Delphi Technologies, Inc.
- GEORGE J. PURDEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VISION SYSTEM AND METHOD FOR DISPLAYING A FIELD OF VIEW DEPENDENT U...
- Publication number 20120013742
- Publication date Jan 19, 2012
- Delphi Technologies, Inc.
- Manuel R. Fairchild
- B60 - VEHICLES IN GENERAL
Information Patent Application
Inductor that contains magnetic field propagation
- Publication number 20090179726
- Publication date Jul 16, 2009
- Carl W. Berlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microwave communication package
- Publication number 20090085808
- Publication date Apr 2, 2009
- Matthew R. Walsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromagnetic bandgap motion sensor device and method for making...
- Publication number 20080142911
- Publication date Jun 19, 2008
- Carl W. Berlin
- G01 - MEASURING TESTING
Information Patent Application
Heat sink electronic package having compliant pedestal
- Publication number 20070268671
- Publication date Nov 22, 2007
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip heat sink package and method
- Publication number 20070064399
- Publication date Mar 22, 2007
- DELPHI TECHNOLOGIES, INC.
- Larry M. Mandel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT OF SURFACE-MOUNT CIRCUIT DEVICES
- Publication number 20060120058
- Publication date Jun 8, 2006
- DELPHI TECHNOLOGIES, INC
- Manuel R. Fairchild
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip heat sink package and method
- Publication number 20050078456
- Publication date Apr 14, 2005
- Larry M. Mandel
- H01 - BASIC ELECTRIC ELEMENTS

David W. Zimmerman

Person

Patents Grantslast 30 patents

Electromagnetic interference shielding and thermal management syste...

Formed waveguide antennas of a radar assembly

Multi-layered air waveguide antenna with layer-to-layer connections

Radar antenna system comprising an air waveguide antenna having a s...

Heatsink shield with thermal-contact dimples for thermal-energy dis...

Plastic air-waveguide antenna with conductive particles

Liquid cooled module with device heat spreader

Apparatus, method and system comprising an air waveguide antenna ha...

Waveguide antenna with integrated temperature management

Heatsink shield with thermal-contact dimples for thermal-energy dis...

Plastic air-waveguide antenna with conductive particles

Thermal interface layer for electronic device

Antenna device with direct differential input useable on an automat...

Liquid cooled module with device heat spreader

Waveguide antenna with integrated temperature management

Ball-grid-array radio-frequency integrated-circuit printed-circuit-...

Electrical-device adhesive barrier

Surface mountable microwave signal transition block for microstrip...

Microwave communication package

Heat sink electronic package having compliant pedestal

Thermal management of surface-mount circuit devices

Flip chip heat sink package and method

Flip chip heat sink package and method

Patents Applicationslast 30 patents

Solderable Waveguide Antenna

Apparatus, Method and System Comprising an Air Waveguide Antenna Ha...

Waveguide with Slot Antennas and Reflectors

THREE-DIMENSIONAL HORN AIR WAVEGUIDE ANTENNA MADE WITH FORMED AND B...

Metal Antenna Assembly with Integrated Features

Multi-Layered Air Waveguide Antenna with Layer-to-Layer Connections

Single-Layer Air Waveguide Antenna Integrated on Circuit Board

Heatsink Shield with Thermal-Contact Dimples for Thermal-Energy Dis...

Plastic Air-Waveguide Antenna with Conductive Particles

Formed Waveguide Antennas of a Radar Assembly

ELECTROMAGNETIC INTERFERENCE SHIELDING AND THERMAL MANAGEMENT SYSTE...

Plastic Air-Waveguide Antenna with Conductive Particles

Heatsink Shield with Thermal-Contact Dimples for Thermal-Energy Dis...

Liquid Cooled Module with Device Heat Spreader

WAVEGUIDE ANTENNA WITH INTEGRATED TEMPERATURE MANAGEMENT

WAVEGUIDE ANTENNA WITH INTEGRATED TEMPERATURE MANAGEMENT

THERMAL INTERFACE LAYER FOR ELECTRONIC DEVICE

LIQUID COOLED MODULE WITH DEVICE HEAT SPREADER

ANTENNA DEVICE WITH DIRECT DIFFERENTIAL INPUT USEABLE ON AN AUTOMAT...

BALL-GRID-ARRAY RADIO-FREQUENCY INTEGRATED-CIRCUIT PRINTED-CIRCUIT-...

CIRCUIT BOARD ASSEMBLY WITH HIGH AND LOW FREQUENCY SUBSTRATES

SURFACE MOUNTABLE MICROWAVE SIGNAL TRANSITION BLOCK FOR MICROSTRIP...

VISION SYSTEM AND METHOD FOR DISPLAYING A FIELD OF VIEW DEPENDENT U...

Inductor that contains magnetic field propagation

Microwave communication package

Electromagnetic bandgap motion sensor device and method for making...

Heat sink electronic package having compliant pedestal

Flip chip heat sink package and method

THERMAL MANAGEMENT OF SURFACE-MOUNT CIRCUIT DEVICES

Flip chip heat sink package and method