David Wei

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer electrical discharge control using argon free dechucking gas
- Patent number 7,892,445
- Issue date Feb 22, 2011
- Lam Research Corporation
- David Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making semiconductor structures implementing sacrificial...
- Patent number 7,875,548
- Issue date Jan 25, 2011
- Lam Research Corporation
- Yehiel Gotkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lag control
- Patent number 7,789,991
- Issue date Sep 7, 2010
- Lam Research Corporation
- Binet A. Worsham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure implementing sacrificial material and metho...
- Patent number 7,425,501
- Issue date Sep 16, 2008
- Lam Research Corporation
- Yehiel Gotkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lag control
- Patent number 7,307,025
- Issue date Dec 11, 2007
- Lam Research Corporation
- Binet A. Worsham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air platen for leading edge and trailing edge control
- Patent number 7,018,276
- Issue date Mar 28, 2006
- Lam Research Corporation
- Anthony de la Llera
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor structure implementing low-K dielectric materials and...
- Patent number 6,984,892
- Issue date Jan 10, 2006
- Lam Research Corporation
- Yehiel Gotkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for reducing compressed dry air usage during chemical mec...
- Patent number 6,976,906
- Issue date Dec 20, 2005
- Lam Research Corporation
- John M. Boyd
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for heating polishing pad
- Patent number 6,896,586
- Issue date May 24, 2005
- Lam Research Corporation
- Xuyen Pham
- B24 - GRINDING POLISHING
Information Patent Grant
CMP belt stretch compensation apparatus and methods for using the same
- Patent number 6,878,048
- Issue date Apr 12, 2005
- Lam Research Corporation
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for removal/remaining thickness profile manipulation
- Patent number 6,808,442
- Issue date Oct 26, 2004
- Lam Research Corporation
- David Wei
- B24 - GRINDING POLISHING
Information Patent Grant
Air platen for leading edge and trailing edge control
- Patent number 6,761,626
- Issue date Jul 13, 2004
- Lam Research Corporation
- Anthony de la Llera
- B24 - GRINDING POLISHING
Information Patent Grant
CMP belt stretch compensation apparatus and methods for using the same
- Patent number 6,749,491
- Issue date Jun 15, 2004
- Lam Research Corporation
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Grant
Active retaining ring support
- Patent number 6,719,874
- Issue date Apr 13, 2004
- Lam Research Corporation
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for reducing compressed dry air usage during c...
- Patent number 6,656,024
- Issue date Dec 2, 2003
- Lam Research Corporation
- John M. Boyd
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Method for Making Semiconductor Structures Implementing Sacrificial...
- Publication number 20090004845
- Publication date Jan 1, 2009
- LAM RESEARCH CORPORATION
- Yehiel Gotkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure implementing sacrificial material and metho...
- Publication number 20060043596
- Publication date Mar 2, 2006
- LAM RESEARCH CORPORATION
- Yehiel Gotkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE IMPLEMENTING LOW-K DIELECTRIC MATERIALS AND...
- Publication number 20050194688
- Publication date Sep 8, 2005
- Yehiel Gotkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air platen for leading edge and trailing edge control
- Publication number 20040242136
- Publication date Dec 2, 2004
- Lam Research Corporation
- Anthony de la Llera
- B24 - GRINDING POLISHING
Information Patent Application
CMP belt stretch compensation apparatus and methods for using the same
- Publication number 20040224610
- Publication date Nov 11, 2004
- Lam Research Corp.
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for reducing compressed dry air usage during c...
- Publication number 20040067720
- Publication date Apr 8, 2004
- LAM RESEARCH CORPORATION
- John M. Boyd
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for heating polishing pad
- Publication number 20030186623
- Publication date Oct 2, 2003
- Lam Research Corp.
- Xuyen Pham
- B24 - GRINDING POLISHING
Information Patent Application
Air platen for leading edge and trailing edge control
- Publication number 20030119433
- Publication date Jun 26, 2003
- Anthony de la Llera
- B24 - GRINDING POLISHING
Information Patent Application
Method for planarizing a surface of a semiconductor wafer with a fi...
- Publication number 20020142601
- Publication date Oct 3, 2002
- John M. Boyd
- B24 - GRINDING POLISHING

Person

Patents Grantslast 30 patents

Wafer electrical discharge control using argon free dechucking gas

Method for making semiconductor structures implementing sacrificial...

Lag control

Semiconductor structure implementing sacrificial material and metho...

Lag control

Air platen for leading edge and trailing edge control

Semiconductor structure implementing low-K dielectric materials and...

Apparatus for reducing compressed dry air usage during chemical mec...

Method and apparatus for heating polishing pad

CMP belt stretch compensation apparatus and methods for using the same

Apparatus for removal/remaining thickness profile manipulation

Air platen for leading edge and trailing edge control

CMP belt stretch compensation apparatus and methods for using the same

Active retaining ring support

Method and apparatus for reducing compressed dry air usage during c...

Patents Applicationslast 30 patents

Method for Making Semiconductor Structures Implementing Sacrificial...

Semiconductor structure implementing sacrificial material and metho...

SEMICONDUCTOR STRUCTURE IMPLEMENTING LOW-K DIELECTRIC MATERIALS AND...

Air platen for leading edge and trailing edge control

CMP belt stretch compensation apparatus and methods for using the same

Method and apparatus for reducing compressed dry air usage during c...

Method and apparatus for heating polishing pad

Air platen for leading edge and trailing edge control

Method for planarizing a surface of a semiconductor wafer with a fi...