DeAnn Eileen Melcher

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Electrical connector between die pad and z-interconnect for stacked...
- Patent number 9,153,517
- Issue date Oct 6, 2015
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die array structure
- Patent number 8,884,403
- Issue date Nov 11, 2014
- Iinvensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die mount by conformal die coating
- Patent number 8,704,379
- Issue date Apr 22, 2014
- Invensas Corporation
- Scott Jay Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level surface passivation of stackable integrated circuit chips
- Patent number 8,324,081
- Issue date Dec 4, 2012
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level surface passivation of stackable integrated circuit chips
- Patent number 7,923,349
- Issue date Apr 12, 2011
- Vertical Circuits, Inc.
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die separation method
- Patent number 7,863,159
- Issue date Jan 4, 2011
- Vertical Circuits, Inc.
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electrical Connector Between Die Pad and Z-Interconnect for Stacked...
- Publication number 20120119385
- Publication date May 17, 2012
- Vertical Circuits, Inc.
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL SURFACE PASSIVATION OF STACKABLE INTEGRATED CIRCUIT CHIPS
- Publication number 20110147943
- Publication date Jun 23, 2011
- Vertical Circuits, Inc.
- Simon J.S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Separation Method
- Publication number 20110101505
- Publication date May 5, 2011
- Vertical Circuits, Inc.
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Separation Method
- Publication number 20090315174
- Publication date Dec 24, 2009
- Vertical Circuits, Inc.
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL SURFACE PASSIVATION OF STACKABLE INTEGRATED CIRCUIT CHIPS
- Publication number 20080315434
- Publication date Dec 25, 2008
- Vertical Circuits, Inc.
- Simon J.S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS