Debaleena Nandi

Person

Hillsboro, OR, US

People

Patents Applicationslast 30 patents

Information Patent Application
BACKSIDE CONDUCTIVE STRUCTURES EXTENDING THROUGH INTEGRATED CIRCUIT...
- Publication number 20240355915
- Publication date Oct 24, 2024
- Intel Corporation
- Leonard P. Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE CONDUCTIVE SOURCE OR DR...
- Publication number 20240332302
- Publication date Oct 3, 2024
- Intel Corporation
- Joseph D’SILVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGE:GAB SOURCE OR DRAIN STRUCTURES WITH LOW RESISTIVITY
- Publication number 20230420456
- Publication date Dec 28, 2023
- Intel Corporation
- Debaleena NANDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE, HIGH GERMANIUM, HIGH BORON SIGE:B PEPI WITH TITANI...
- Publication number 20230197817
- Publication date Jun 22, 2023
- Debaleena NANDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TITANIUM CONTACT FORMATION
- Publication number 20230193473
- Publication date Jun 22, 2023
- Intel Corporation
- Debaleena Nandi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SILICON RICH CAPPING LAYER PRE-AMORPHIZED WITH GERMANIUM AND BORON...
- Publication number 20230101725
- Publication date Mar 30, 2023
- Intel Corporation
- Debaleena NANDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE, HIGH GERMANIUM, HIGH BORON SIGE:B PEPI WITH A SILI...
- Publication number 20230087399
- Publication date Mar 23, 2023
- Intel Corporation
- Debaleena NANDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW GERMANIUM, HIGH BORON SILICON RICH CAPPING LAYER FOR PMOS CONTA...
- Publication number 20220416050
- Publication date Dec 29, 2022
- Intel Corporation
- Debaleena NANDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-DEPOSITION OF TITANIUM AND SILICON FOR IMPROVED SILICON GERMANIU...
- Publication number 20220416032
- Publication date Dec 29, 2022
- Intel Corporation
- Debaleena Nandi
- H01 - BASIC ELECTRIC ELEMENTS

Debaleena Nandi

Person

Patents Applicationslast 30 patents

BACKSIDE CONDUCTIVE STRUCTURES EXTENDING THROUGH INTEGRATED CIRCUIT...

INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE CONDUCTIVE SOURCE OR DR...

SIGE:GAB SOURCE OR DRAIN STRUCTURES WITH LOW RESISTIVITY

LOW TEMPERATURE, HIGH GERMANIUM, HIGH BORON SIGE:B PEPI WITH TITANI...

TITANIUM CONTACT FORMATION

SILICON RICH CAPPING LAYER PRE-AMORPHIZED WITH GERMANIUM AND BORON...

LOW TEMPERATURE, HIGH GERMANIUM, HIGH BORON SIGE:B PEPI WITH A SILI...

LOW GERMANIUM, HIGH BORON SILICON RICH CAPPING LAYER FOR PMOS CONTA...

CO-DEPOSITION OF TITANIUM AND SILICON FOR IMPROVED SILICON GERMANIU...