Deborah A. Hagen

Follow

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method therefor
- Patent number 7,927,927
- Issue date Apr 19, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Son Ky Quan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebonded assemblage method and apparatus
- Patent number 7,088,009
- Issue date Aug 8, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Deborah A. Hagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for manufacturing an interconnect structure
- Patent number 6,429,531
- Issue date Aug 6, 2002
- Motorola, Inc.
- Addi B. Mistry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method thereof
- Patent number 5,776,798
- Issue date Jul 7, 1998
- Motorola, Inc.
- Son Ky Quan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wirebonded assemblage method and apparatus
- Publication number 20050040501
- Publication date Feb 24, 2005
- Deborah A. Hagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method therefor
- Publication number 20020053452
- Publication date May 9, 2002
- Son Ky Quan
- H01 - BASIC ELECTRIC ELEMENTS