Deepak Swamy

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Computer platform for development and deployment of sensor data bas...
- Patent number 10,216,485
- Issue date Feb 26, 2019
- Tata Consultancy Services Limited
- Prateep Misra
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Computer platform for development and deployment of sensor-driven v...
- Patent number 9,990,182
- Issue date Jun 5, 2018
- Tata Consultancy Services Limited
- Prateep Misra
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Adaptor board interconnection for a processor board and motherboard
- Patent number 5,987,553
- Issue date Nov 16, 1999
- Dell Computer Corporation
- Deepak N. Swamy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board-mounted IC package cooling and method
- Patent number 5,946,544
- Issue date Aug 31, 1999
- Dell U.S.A., L.P.
- Scott Estes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic integrated circuit package with optional IC removably mount...
- Patent number 5,835,357
- Issue date Nov 10, 1998
- Dell U.S.A., L.P.
- Deepak Swamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board-mounted IC package cooling apparatus
- Patent number 5,714,789
- Issue date Feb 3, 1998
- Dell USA, L.P.
- Scott Estes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid multichip module and methods of fabricating same
- Patent number 5,675,183
- Issue date Oct 7, 1997
- Deepak Swamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board-mounted IC package cooling apparatus
- Patent number 5,625,227
- Issue date Apr 29, 1997
- Dell USA, L.P.
- Scott Estes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded thermistor for on-board thermal monitoring of electrical c...
- Patent number 5,623,594
- Issue date Apr 22, 1997
- Dell USA, L.P.
- Deepak Swamy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Leadless high density connector
- Patent number 5,593,322
- Issue date Jan 14, 1997
- Dell USA, L.P.
- Deepak Swamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic interconnect methodology for cost effective manufacture...
- Patent number 5,576,519
- Issue date Nov 19, 1996
- Dell USA, L.P.
- Deepak N. Swamy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for making staggered blade edge connectors
- Patent number 5,567,295
- Issue date Oct 22, 1996
- Dell USA L.P.
- Deepak N. Swamy
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Circuit board having an improved fine pitch ball grid array and met...
- Patent number 5,463,191
- Issue date Oct 31, 1995
- Dell USA, L.P.
- James S. Bell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socketed printed circuit board BGA connection apparatus and associa...
- Patent number 5,459,287
- Issue date Oct 17, 1995
- Dell USA, L.P.
- Deepak Swamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic interconnect methodology for cost effective manufacture...
- Patent number 5,456,004
- Issue date Oct 10, 1995
- Dell USA, L.P.
- Deepak N. Swamy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board thermal relief pattern having improved electrical and...
- Patent number 5,451,720
- Issue date Sep 19, 1995
- Dell USA, L.P.
- H. Scott Estes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optimal PCB routing methodology for high I/O density interconnect d...
- Patent number 5,424,492
- Issue date Jun 13, 1995
- Dell USA, L.P.
- Robert B. Petty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical printed circuit board and ball grid array interconnect a...
- Patent number 5,400,220
- Issue date Mar 21, 1995
- Dell USA, L.P.
- Deepak Swamy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for reworking ball grid array packages to allo...
- Patent number 5,392,980
- Issue date Feb 28, 1995
- Dell USA, L.P.
- Deepak N. Swamy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Computer Platform for Development and Deployment of Sensor-Driven V...
- Publication number 20140380264
- Publication date Dec 25, 2014
- Tata Consultancy Services, Limited
- Prateep Misra
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Computer Platform for Development and Deployment of Sensor Data Bas...
- Publication number 20140359552
- Publication date Dec 4, 2014
- Prateep Misra
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKED MODULE CONNECTOR
- Publication number 20010012726
- Publication date Aug 9, 2001
- SEAN P. O'NEAL
- H01 - BASIC ELECTRIC ELEMENTS

Deepak Swamy

Person

Patents Grantslast 30 patents

Computer platform for development and deployment of sensor data bas...

Computer platform for development and deployment of sensor-driven v...

Adaptor board interconnection for a processor board and motherboard

Circuit board-mounted IC package cooling and method

Ceramic integrated circuit package with optional IC removably mount...

Circuit board-mounted IC package cooling apparatus

Hybrid multichip module and methods of fabricating same

Circuit board-mounted IC package cooling apparatus

Embedded thermistor for on-board thermal monitoring of electrical c...

Leadless high density connector

Anisotropic interconnect methodology for cost effective manufacture...

Method and apparatus for making staggered blade edge connectors

Circuit board having an improved fine pitch ball grid array and met...

Socketed printed circuit board BGA connection apparatus and associa...

Anisotropic interconnect methodology for cost effective manufacture...

Circuit board thermal relief pattern having improved electrical and...

Optimal PCB routing methodology for high I/O density interconnect d...

Mechanical printed circuit board and ball grid array interconnect a...

Method and apparatus for reworking ball grid array packages to allo...

Patents Applicationslast 30 patents

Computer Platform for Development and Deployment of Sensor-Driven V...

Computer Platform for Development and Deployment of Sensor Data Bas...

STACKED MODULE CONNECTOR