Dek Gin YANG

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer rigid flexible printed circuit board and method for manu...
- Patent number 10,674,610
- Issue date Jun 2, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer rigid flexible printed circuit board and method for manu...
- Patent number 10,602,616
- Issue date Mar 24, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer rigid flexible printed circuit board and method for manu...
- Patent number 10,368,445
- Issue date Jul 30, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing rigid-flexible printed circuit board
- Patent number 10,299,373
- Issue date May 21, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing rigid-flexible printed circuit board
- Patent number 10,091,871
- Issue date Oct 2, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flying tail type rigid-flexible printed circuit board
- Patent number 10,034,368
- Issue date Jul 24, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing rigid-flexible printed circuit board
- Patent number 9,955,580
- Issue date Apr 24, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer rigid flexible printed circuit board and method for manu...
- Patent number 9,743,529
- Issue date Aug 22, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing rigid-flexible printed circuit board
- Patent number 8,882,954
- Issue date Nov 11, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Substrate structure and method of manufacturing the same
- Patent number 8,759,986
- Issue date Jun 24, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Chul Min Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board including electromagnetic bandgap structure
- Patent number 8,711,055
- Issue date Apr 29, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Won Woo Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer rigid flexible printed circuit board and method for manu...
- Patent number 8,558,116
- Issue date Oct 15, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing an embedded printed circuit board
- Patent number 8,418,356
- Issue date Apr 16, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic bandgap structure and printed circuit board having...
- Patent number 8,399,777
- Issue date Mar 19, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Won Woo Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic bandgap structure and printed circuit board having...
- Patent number 8,330,048
- Issue date Dec 11, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Won Woo Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having built-in antenna
- Patent number 7,999,746
- Issue date Aug 16, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Won-Woo Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composition for surface modification of a heat sink and method for...
- Patent number 7,981,317
- Issue date Jul 19, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Young-Ho Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electro-magnetic bandgap structure
- Patent number 7,973,619
- Issue date Jul 5, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Won-Woo Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a circuit board
- Patent number 7,810,232
- Issue date Oct 12, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Keun-Ho Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 7,473,099
- Issue date Jan 6, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Keun-Ho Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid-flexible PCB having coverlay made of liquid crystalline polym...
- Patent number 7,453,045
- Issue date Nov 18, 2008
- Samsung Electro-Mechanics Co. Ltd
- Bum-Young Myoung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating multi-layered printed circuit board for optic...
- Patent number 7,350,295
- Issue date Apr 1, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Young-Woo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid flexible printed circuit board and method of fabricating same
- Patent number 7,347,950
- Issue date Mar 25, 2008
- Samsung Electro-Mechanics, Co., Ltd.
- Bum Young Myung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of fabricating rigid-flexible printed circuit board
- Patent number 7,281,328
- Issue date Oct 16, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board including waveguide and method of producing t...
- Patent number 7,280,716
- Issue date Oct 9, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Sang-Won Ha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board including waveguide and method of producing t...
- Patent number 7,203,388
- Issue date Apr 10, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Sang-Won Ha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical printed circuit board for long-distance signal transmission
- Patent number 7,197,202
- Issue date Mar 27, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Young-Woo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid-flexible PCB having coverlay made of liquid crystalline polym...
- Patent number 7,082,679
- Issue date Aug 1, 2006
- Samsung Electro-Mechanics Co., Ltd.
- Bum-Young Myoung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Brown oxide pretreatment composition for cleaning copper surface an...
- Patent number 7,084,098
- Issue date Aug 1, 2006
- Samsung Electro-Mechanics Co., Ltd.
- Bum-Young Myoung
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Method of fabricating multi-layered printed circuit board for optic...
- Patent number 7,046,870
- Issue date May 16, 2006
- Samsung Electro-Mechanics Co., Ltd.
- Young-Woo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANU...
- Publication number 20200187362
- Publication date Jun 11, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANU...
- Publication number 20190297730
- Publication date Sep 26, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20180376584
- Publication date Dec 27, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20180302979
- Publication date Oct 18, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20180146553
- Publication date May 24, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANU...
- Publication number 20170118833
- Publication date Apr 27, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20170027055
- Publication date Jan 26, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20160345431
- Publication date Nov 24, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOUCH SENSOR
- Publication number 20150253909
- Publication date Sep 10, 2015
- Samsung Electro-mechanics Co., Ltd.
- Gyu Seok KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TOUCH SENSOR
- Publication number 20150212617
- Publication date Jul 30, 2015
- Samsung Electro-mechanics Co., Ltd.
- Young Seuck YOO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TOUCH SENSOR
- Publication number 20150212619
- Publication date Jul 30, 2015
- Samsung Electro-mechanics Co., Ltd.
- Young Seuck YOO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20150027627
- Publication date Jan 29, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD INCLUDING ELECTROMAGNETIC BANDGAP STRUCTURE
- Publication number 20140191907
- Publication date Jul 10, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Won Woo CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A MULTILAYER RIGID FLEXIBLE PRINTED CIRCUI...
- Publication number 20140021164
- Publication date Jan 23, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANU...
- Publication number 20140008107
- Publication date Jan 9, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE FOR LED MODULE AND SUBSTRATE FOR...
- Publication number 20130256709
- Publication date Oct 3, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20130220535
- Publication date Aug 29, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIR...
- Publication number 20130213695
- Publication date Aug 22, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20130047418
- Publication date Feb 28, 2013
- SAMSUNG ELECTRO-MECHANICS
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate structure and method of manufacturing the same
- Publication number 20120171432
- Publication date Jul 5, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Chul Min Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus for manufacturing printed circuit board
- Publication number 20110132546
- Publication date Jun 9, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Yoong Oh
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD COMPRIS...
- Publication number 20110114380
- Publication date May 19, 2011
- Jee Soo MOK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light emitting device package and method for manufacturing the same
- Publication number 20110101406
- Publication date May 5, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Cheol Ho Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110100699
- Publication date May 5, 2011
- Masahi Hamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer rigid flexible printed circuit board and method for manu...
- Publication number 20110094776
- Publication date Apr 28, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD INCLUDING ELECTROMAGNETIC BANDGAP STRUCTURE
- Publication number 20100328178
- Publication date Dec 30, 2010
- Won Woo Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20100319980
- Publication date Dec 23, 2010
- Hyung Ho KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC WAVE SHIELDING SUBSTRATE
- Publication number 20100319982
- Publication date Dec 23, 2010
- Won Woo Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing printed circuit board
- Publication number 20100288726
- Publication date Nov 18, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Eung-Suek Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD HAVING...
- Publication number 20100252319
- Publication date Oct 7, 2010
- Won Woo CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Dek Gin YANG

Person

Patents Grantslast 30 patents

Multilayer rigid flexible printed circuit board and method for manu...

Multilayer rigid flexible printed circuit board and method for manu...

Multilayer rigid flexible printed circuit board and method for manu...

Method of manufacturing rigid-flexible printed circuit board

Method of manufacturing rigid-flexible printed circuit board

Flying tail type rigid-flexible printed circuit board

Method of manufacturing rigid-flexible printed circuit board

Multilayer rigid flexible printed circuit board and method for manu...

Method of manufacturing rigid-flexible printed circuit board

Substrate structure and method of manufacturing the same

Printed circuit board including electromagnetic bandgap structure

Multilayer rigid flexible printed circuit board and method for manu...

Method of manufacturing an embedded printed circuit board

Electromagnetic bandgap structure and printed circuit board having...

Electromagnetic bandgap structure and printed circuit board having...

Printed circuit board having built-in antenna

Composition for surface modification of a heat sink and method for...

Electro-magnetic bandgap structure

Method of manufacturing a circuit board

Printed circuit board and manufacturing method thereof

Rigid-flexible PCB having coverlay made of liquid crystalline polym...

Method of fabricating multi-layered printed circuit board for optic...

Rigid flexible printed circuit board and method of fabricating same

Method of fabricating rigid-flexible printed circuit board

Printed circuit board including waveguide and method of producing t...

Printed circuit board including waveguide and method of producing t...

Optical printed circuit board for long-distance signal transmission

Rigid-flexible PCB having coverlay made of liquid crystalline polym...

Brown oxide pretreatment composition for cleaning copper surface an...

Method of fabricating multi-layered printed circuit board for optic...

Patents Applicationslast 30 patents

MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANU...

MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANU...

METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD

FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIRCUIT BOARD

METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD

MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANU...

FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIRCUIT BOARD

METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD

TOUCH SENSOR

TOUCH SENSOR

TOUCH SENSOR

METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD INCLUDING ELECTROMAGNETIC BANDGAP STRUCTURE

METHOD FOR MANUFACTURING A MULTILAYER RIGID FLEXIBLE PRINTED CIRCUI...

MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANU...

METHOD OF MANUFACTURING SUBSTRATE FOR LED MODULE AND SUBSTRATE FOR...

METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD

METHOD OF MANUFACTURING FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIR...

METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD

Substrate structure and method of manufacturing the same

Apparatus for manufacturing printed circuit board

ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD COMPRIS...

Light emitting device package and method for manufacturing the same

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Multilayer rigid flexible printed circuit board and method for manu...

PRINTED CIRCUIT BOARD INCLUDING ELECTROMAGNETIC BANDGAP STRUCTURE

PRINTED CIRCUIT BOARD

ELECTROMAGNETIC WAVE SHIELDING SUBSTRATE

Method for manufacturing printed circuit board

ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD HAVING...