Deok-Hoon Kim

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Phoenix, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Electronic package of photo-image sensors in cellular phone camera...
- Patent number 7,291,518
- Issue date Nov 6, 2007
- Optopac, Inc.
- Deok-Hoon Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wafer-level moat structures
- Patent number 7,126,164
- Issue date Oct 24, 2006
- FlipChip International LLC
- Michael E. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package of photo-sensing semiconductor devices, and the...
- Patent number 7,038,287
- Issue date May 2, 2006
- OptoPac, Inc.
- Deok Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package of photo-image sensors in cellular phone camera...
- Patent number 6,943,423
- Issue date Sep 13, 2005
- Optopac, Inc.
- Deok-Hoon Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic package of photo-sensing semiconductor devices, and the...
- Patent number 6,864,116
- Issue date Mar 8, 2005
- OptoPac, Inc.
- Deok Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer collar for solder bumps
- Patent number 6,578,755
- Issue date Jun 17, 2003
- Flip Chip Technologies, L.L.C.
- Peter Elenius
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Electronic package of photo-image sensors in cellular phone camera...
- Publication number 20050208702
- Publication date Sep 22, 2005
- Deok-Hoon Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Electronic package of photo-sensing semiconductor devices, and the...
- Publication number 20050098802
- Publication date May 12, 2005
- Deok Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic package of photo-image sensors in cellular phone camera...
- Publication number 20050073017
- Publication date Apr 7, 2005
- Deok-Hoon Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Wafer-level moat structures
- Publication number 20050070083
- Publication date Mar 31, 2005
- FLIP CHIP TECHNOLOGIES, L.L.C.
- Michael E. Johnson
- H01 - BASIC ELECTRIC ELEMENTS