Devdatta P. Kulkarni

Person

Olympia, WA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cooling mass and spring element for low insertion force hot swappab...
- Patent number 12,133,368
- Issue date Oct 29, 2024
- Intel Corporation
- Hardeep Singh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat transfer apparatus for a computer environment
- Patent number 12,093,092
- Issue date Sep 17, 2024
- Intel Corporation
- Devdatta P. Kulkarni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible and modular top and bottom side processor unit module cooling
- Patent number 12,055,986
- Issue date Aug 6, 2024
- Intel Corporation
- Andres Ramirez Macias
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Technologies for dynamic cooling in a multi-chip package with progr...
- Patent number 12,035,507
- Issue date Jul 9, 2024
- Intel Corporation
- Scott Rider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat transfer apparatus for a computer environment
- Patent number 11,249,522
- Issue date Feb 15, 2022
- Intel Corporation
- Devdatta P. Kulkarni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Computing apparatus with closed cooling loop
- Patent number 11,026,351
- Issue date Jun 1, 2021
- Intel Corporation
- Devdatta P. Kulkarni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanism with folded wrapping to seal components immersed in coolant
- Patent number 10,945,353
- Issue date Mar 9, 2021
- Intel Corporation
- Barrett M. Faneuf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid routing devices and methods for cooling integrated circuit pa...
- Patent number 10,770,372
- Issue date Sep 8, 2020
- Altera Corporation
- Ravi Gutala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Two-phase liquid-vapor computer cooling device
- Patent number 10,765,039
- Issue date Sep 1, 2020
- Intel Corporation
- Devdatta P. Kulkarni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management component
- Patent number 10,727,160
- Issue date Jul 28, 2020
- Intel Corporation
- Devdatta P. Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat management system
- Patent number 10,468,331
- Issue date Nov 5, 2019
- Intel Corporation
- Je-young Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hydraulic bladder for CPU interconnection and cooling
- Patent number 10,455,731
- Issue date Oct 22, 2019
- Intel Corporation
- Ralph W. Jensen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of direct cooling of packaged devices and structures formed...
- Patent number 10,228,735
- Issue date Mar 12, 2019
- Intel Corporation
- Devdatta P. Kulkarni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling using adjustable thermal coupling
- Patent number 10,168,749
- Issue date Jan 1, 2019
- Intel Corporation
- Russell S. Aoki
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
System with provision of a thermal interface to a printed circuit b...
- Patent number 10,074,591
- Issue date Sep 11, 2018
- Intel Corporation
- Devdatta P. Kulkarni
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Tunable two phase liquid cooling thermal management method and appa...
- Patent number 9,983,641
- Issue date May 29, 2018
- Intel Corporation
- Devdatta P. Kulkarni
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE AND MODULAR TOP AND BOTTOM SIDE PROCESSOR UNIT MODULE COOLING
- Publication number 20240345639
- Publication date Oct 17, 2024
- Intel Corporation
- Andres Ramirez Macias
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIMM COOLING ASSEMBLIES
- Publication number 20240260233
- Publication date Aug 1, 2024
- Intel Corporation
- Ming Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COLD PLATES FOR SECONDARY SIDE COMPONENTS OF PRINTED CIRCUIT BOARDS
- Publication number 20230422389
- Publication date Dec 28, 2023
- Intel Corporation
- Prabhakar Subrahmanyam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20230253288
- Publication date Aug 10, 2023
- Intel Corporation
- Abdulafeez Adebiyi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20230125822
- Publication date Apr 27, 2023
- Intel Corporation
- Abdulafeez Adebiyi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD PLATES AND LIQUID COOLING SYSTEMS FOR ELECTRONIC DEVICES
- Publication number 20230025921
- Publication date Jan 26, 2023
- Intel Corporation
- Devdatta Kulkarni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNOLOGIES FOR DYNAMIC COOLING IN A MULTI-CHIP PACKAGE WITH PROGR...
- Publication number 20220240417
- Publication date Jul 28, 2022
- Intel Corporation
- Scott Rider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FORM FACTOR ASSEMBLIES FOR COOLING DIMMS
- Publication number 20220225542
- Publication date Jul 14, 2022
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- G11 - INFORMATION STORAGE
Information Patent Application
COOLING MASS AND SPRING ELEMENT FOR LOW INSERTION FORCE HOT SWAPPAB...
- Publication number 20220210952
- Publication date Jun 30, 2022
- Intel Corporation
- Hardeep SINGH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT TRANSFER APPARATUS FOR A COMPUTER ENVIRONMENT
- Publication number 20220137685
- Publication date May 5, 2022
- Intel Corporation
- Devdatta P. Kulkarni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TECHNOLOGIES FOR DYNAMIC COOLING IN A MULTI-CHIP PACKAGE WITH PROGR...
- Publication number 20220015262
- Publication date Jan 13, 2022
- Intel Corporation
- Scott Rider
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TECHNOLOGIES FOR SEALED LIQUID COOLING SYSTEM
- Publication number 20210321526
- Publication date Oct 14, 2021
- Devdatta Prakash Kulkarni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLED MODULE FOR NARROW PITCH SLOTS
- Publication number 20210321543
- Publication date Oct 14, 2021
- Intel Corporation
- Guixiang TAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE AND MODULAR TOP AND BOTTOM SIDE PROCESSOR UNIT MODULE COOLING
- Publication number 20210208647
- Publication date Jul 8, 2021
- Intel Corporation
- Andres Ramirez Macias
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HYBRID LIQUID COOLING
- Publication number 20210185850
- Publication date Jun 17, 2021
- Intel Corporation
- Devdatta Prakash Kulkarni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARIABLE CONDUCTANCE HEAT PIPES FOR IMPROVED RELIABILITY
- Publication number 20210108860
- Publication date Apr 15, 2021
- Devdatta Prakash Kulkarni
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COMPUTING APPARATUS WITH CLOSED COOLING LOOP
- Publication number 20200245511
- Publication date Jul 30, 2020
- Intel Corporation
- Devdatta P. KULKARNI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT MANAGEMENT SYSTEM
- Publication number 20190221499
- Publication date Jul 18, 2019
- Je-young Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT COMPONENT
- Publication number 20190206764
- Publication date Jul 4, 2019
- Intel Corporation
- Devdatta P. Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DIRECT COOLING OF PACKAGED DEVICES AND STRUCTURES FORMED...
- Publication number 20190094925
- Publication date Mar 28, 2019
- Intel Corporation
- Devdatta P. Kulkarni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MECHANISM WITH FOLDED WRAPPING TO SEAL COMPONENTS IMMERSED IN COOLANT
- Publication number 20190090344
- Publication date Mar 21, 2019
- Barrett M. Faneuf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF DIRECT COOLING OF PACKAGED DEVICES AND STRUCTURES FORMED...
- Publication number 20190004573
- Publication date Jan 3, 2019
- Intel Corporation
- Devdatta P. Kulkarni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TWO-PHASE LIQUID-VAPOR COMPUTER COOLING DEVICE
- Publication number 20180343773
- Publication date Nov 29, 2018
- Intel Corporation
- Devdatta P. Kulkarni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING USING A WICK WITH VARIED THICKNESS
- Publication number 20180270993
- Publication date Sep 20, 2018
- Intel Corporation
- Devdatta P. Kulkarni
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HYDRAULIC BLADDER FOR CPU INTERCONNECTION AND COOLING
- Publication number 20180263137
- Publication date Sep 13, 2018
- Intel Corporation
- RALPH W. JENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM WITH PROVISION OF A THERMAL INTERFACE TO A PRINTED CIRCUIT B...
- Publication number 20180254237
- Publication date Sep 6, 2018
- Intel Corporation
- Devdatta P. Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING USING ADJUSTABLE THERMAL COUPLING
- Publication number 20180157296
- Publication date Jun 7, 2018
- RUSSELL S. AOKI
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Fluid Routing Devices And Methods For Cooling Integrated Circuit Pa...
- Publication number 20180090417
- Publication date Mar 29, 2018
- Altera Corporation
- Ravi Gutala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COOLING USING COOLANT-DRIVEN FANS
- Publication number 20180066663
- Publication date Mar 8, 2018
- Intel Corporation
- Devdatta P. Kulkarni
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
HEAT TRANSFER APPARATUS FOR A COMPUTER ENVIRONMENT
- Publication number 20180004259
- Publication date Jan 4, 2018
- Intel Corporation
- Devdatta P. Kulkarni
- G06 - COMPUTING CALCULATING COUNTING

Devdatta P. Kulkarni

Person

Patents Grantslast 30 patents

Cooling mass and spring element for low insertion force hot swappab...

Heat transfer apparatus for a computer environment

Flexible and modular top and bottom side processor unit module cooling

Technologies for dynamic cooling in a multi-chip package with progr...

Heat transfer apparatus for a computer environment

Computing apparatus with closed cooling loop

Mechanism with folded wrapping to seal components immersed in coolant

Fluid routing devices and methods for cooling integrated circuit pa...

Two-phase liquid-vapor computer cooling device

Thermal management component

Heat management system

Hydraulic bladder for CPU interconnection and cooling

Methods of direct cooling of packaged devices and structures formed...

Cooling using adjustable thermal coupling

System with provision of a thermal interface to a printed circuit b...

Tunable two phase liquid cooling thermal management method and appa...

Patents Applicationslast 30 patents

FLEXIBLE AND MODULAR TOP AND BOTTOM SIDE PROCESSOR UNIT MODULE COOLING

DIMM COOLING ASSEMBLIES

COLD PLATES FOR SECONDARY SIDE COMPONENTS OF PRINTED CIRCUIT BOARDS

IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES

IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES

COLD PLATES AND LIQUID COOLING SYSTEMS FOR ELECTRONIC DEVICES

TECHNOLOGIES FOR DYNAMIC COOLING IN A MULTI-CHIP PACKAGE WITH PROGR...

THIN FORM FACTOR ASSEMBLIES FOR COOLING DIMMS

COOLING MASS AND SPRING ELEMENT FOR LOW INSERTION FORCE HOT SWAPPAB...

HEAT TRANSFER APPARATUS FOR A COMPUTER ENVIRONMENT

TECHNOLOGIES FOR DYNAMIC COOLING IN A MULTI-CHIP PACKAGE WITH PROGR...

TECHNOLOGIES FOR SEALED LIQUID COOLING SYSTEM

LIQUID COOLED MODULE FOR NARROW PITCH SLOTS

FLEXIBLE AND MODULAR TOP AND BOTTOM SIDE PROCESSOR UNIT MODULE COOLING

HYBRID LIQUID COOLING

VARIABLE CONDUCTANCE HEAT PIPES FOR IMPROVED RELIABILITY

COMPUTING APPARATUS WITH CLOSED COOLING LOOP

HEAT MANAGEMENT SYSTEM

THERMAL MANAGEMENT COMPONENT

METHODS OF DIRECT COOLING OF PACKAGED DEVICES AND STRUCTURES FORMED...

MECHANISM WITH FOLDED WRAPPING TO SEAL COMPONENTS IMMERSED IN COOLANT

METHODS OF DIRECT COOLING OF PACKAGED DEVICES AND STRUCTURES FORMED...

TWO-PHASE LIQUID-VAPOR COMPUTER COOLING DEVICE

COOLING USING A WICK WITH VARIED THICKNESS

HYDRAULIC BLADDER FOR CPU INTERCONNECTION AND COOLING

SYSTEM WITH PROVISION OF A THERMAL INTERFACE TO A PRINTED CIRCUIT B...

COOLING USING ADJUSTABLE THERMAL COUPLING

Fluid Routing Devices And Methods For Cooling Integrated Circuit Pa...

COOLING USING COOLANT-DRIVEN FANS

HEAT TRANSFER APPARATUS FOR A COMPUTER ENVIRONMENT