Deviprasad Malladi

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optimized lid attach process for thermal management and multi-surfa...
- Patent number 8,283,204
- Issue date Oct 9, 2012
- Oracle America, Inc.
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized lid attach process for thermal management and multi-surfa...
- Patent number 7,939,364
- Issue date May 10, 2011
- Oracle America, Inc.
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package lid or heat spreader for microprocessor packages
- Patent number 7,301,227
- Issue date Nov 27, 2007
- Sun Microsystems, Inc.
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding apparatus
- Patent number 6,944,025
- Issue date Sep 13, 2005
- Sun Microsystems, Inc.
- David M. Hockanson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for enhancing thermal performance of integrat...
- Patent number 6,727,193
- Issue date Apr 27, 2004
- Sun Microsystems, Inc.
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-material heat spreader
- Patent number 6,637,506
- Issue date Oct 28, 2003
- Sun Microsystems, Inc.
- Vadim Gektin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Component level, CPU-testable, multi-chip package using grid arrays
- Patent number 6,636,825
- Issue date Oct 21, 2003
- Sun Microsystems, Inc.
- Deviprasad Malladi
- G11 - INFORMATION STORAGE
Information Patent Grant
Efficient device debug system
- Patent number 6,472,900
- Issue date Oct 29, 2002
- Sun Microsystems, Inc.
- Deviprasad Malladi
- G01 - MEASURING TESTING
Information Patent Grant
Method for reducing soft error rates in semiconductor devices
- Patent number 6,436,737
- Issue date Aug 20, 2002
- Sun Microsystems, Inc.
- Deviprasad Malladi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for packaging an electronic device
- Patent number 6,351,389
- Issue date Feb 26, 2002
- Sun Microsystems, Inc.
- Deviprasad Malladi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient debug package design
- Patent number 6,246,252
- Issue date Jun 12, 2001
- Sun Microsystems, Inc.
- Deviprasad Malladi
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit package and method
- Patent number 5,972,736
- Issue date Oct 26, 1999
- Sun Microsystems, Inc.
- Deviprasad Malladi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated junction temperature sensor/package design and method of...
- Patent number 5,831,333
- Issue date Nov 3, 1998
- Sun Microsystems, Inc.
- Deviprasad Malladi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for direct attachment of an on-chip bypass capacitor in an i...
- Patent number 5,780,930
- Issue date Jul 14, 1998
- Sun Microsystems, Inc.
- Deviprasad Malladi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink and fan for cooling CPU chip
- Patent number 5,734,554
- Issue date Mar 31, 1998
- Sun Microsystems, Inc.
- Nagaraj P. Mitty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for testing flip chip or wire bond integrated circuits
- Patent number 5,701,085
- Issue date Dec 23, 1997
- Sun Microsystems, Inc.
- Deviprasad Malladi
- G01 - MEASURING TESTING
Information Patent Grant
Method for direct attachment of an on-chip bypass capacitor in an i...
- Patent number 5,629,240
- Issue date May 13, 1997
- Sun Microsystems, Inc.
- Deviprasad Malladi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with external storage capacitor for impr...
- Patent number 5,598,035
- Issue date Jan 28, 1997
- Sun Microsystems, Inc.
- Stefan Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film chip capacitor for electrical noise reduction in integrat...
- Patent number 5,528,083
- Issue date Jun 18, 1996
- Sun Microsystems, Inc.
- Deviprasad Malladi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost, thermally efficient, and surface mountable semiconductor...
- Patent number 5,367,193
- Issue date Nov 22, 1994
- Sun Microsystems, Inc.
- Deviprasad Malladi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTIMIZED LID ATTACH PROCESS FOR THERMAL MANAGEMENT AND MULTI-SURFA...
- Publication number 20110177656
- Publication date Jul 21, 2011
- Oracle International Corporation
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED LID ATTACH PROCESS FOR THERMAL MANAGEMENT AND MULTI-SURFA...
- Publication number 20090286359
- Publication date Nov 19, 2009
- SUN MICROSYSTEMS, INC.
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for dispensing interface materials
- Publication number 20040065410
- Publication date Apr 8, 2004
- Sun Microsystems, Inc.
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat spreader with surface cavity
- Publication number 20040042178
- Publication date Mar 4, 2004
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI shielding apparatus
- Publication number 20040037042
- Publication date Feb 26, 2004
- David M. Hockanson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and methods for enhancing thermal performance of integrat...
- Publication number 20030171006
- Publication date Sep 11, 2003
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-MATERIAL HEAT SPREADER
- Publication number 20030168203
- Publication date Sep 11, 2003
- Vadim Gektin
- F28 - HEAT EXCHANGE IN GENERAL

Deviprasad Malladi

Person

Patents Grantslast 30 patents

Optimized lid attach process for thermal management and multi-surfa...

Optimized lid attach process for thermal management and multi-surfa...

Package lid or heat spreader for microprocessor packages

EMI shielding apparatus

Apparatus and methods for enhancing thermal performance of integrat...

Multi-material heat spreader

Component level, CPU-testable, multi-chip package using grid arrays

Efficient device debug system

Method for reducing soft error rates in semiconductor devices

Device and method for packaging an electronic device

Efficient debug package design

Integrated circuit package and method

Integrated junction temperature sensor/package design and method of...

Method for direct attachment of an on-chip bypass capacitor in an i...

Heat sink and fan for cooling CPU chip

Apparatus for testing flip chip or wire bond integrated circuits

Method for direct attachment of an on-chip bypass capacitor in an i...

Integrated circuit package with external storage capacitor for impr...

Thin film chip capacitor for electrical noise reduction in integrat...

Low cost, thermally efficient, and surface mountable semiconductor...

Patents Applicationslast 30 patents

OPTIMIZED LID ATTACH PROCESS FOR THERMAL MANAGEMENT AND MULTI-SURFA...

OPTIMIZED LID ATTACH PROCESS FOR THERMAL MANAGEMENT AND MULTI-SURFA...

Method and apparatus for dispensing interface materials

Heat spreader with surface cavity

EMI shielding apparatus

Apparatus and methods for enhancing thermal performance of integrat...

MULTI-MATERIAL HEAT SPREADER