Di Li

Person

Shenzhen, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-band radio frequency front-end device, multi-band receiver, a...
- Patent number 12,113,559
- Issue date Oct 8, 2024
- Huawei Technologies Co., Ltd.
- Keji Cui
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multi-band radio frequency front-end device, multi-band receiver, a...
- Patent number 11,683,054
- Issue date Jun 20, 2023
- Huawei Technologies Co., Ltd.
- Keji Cui
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
Multi-Band Low Noise Amplifier, Phased Array, and Electronic Device
- Publication number 20240396504
- Publication date Nov 28, 2024
- Huawei Technologies Co., Ltd
- Keji Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Phased Array and Electronic Device
- Publication number 20230344125
- Publication date Oct 26, 2023
- Huawei Technologies Co., Ltd
- Keji Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Band Radio Frequency Front-End Device, Multi-Band Receiver, a...
- Publication number 20230283307
- Publication date Sep 7, 2023
- Huawei Technologies Co., Ltd
- Keji Cui
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
GUIDE WHEEL MOUNTING BASE, GUIDE DEVICE HAVING SAME, AND RAIL VEHICLE
- Publication number 20230127428
- Publication date Apr 27, 2023
- BYD COMPANY LIMITED
- Liujiang ZHENG
- B61 - RAILWAYS
Information Patent Application
Transceiver Apparatus, Wireless Communication Apparatus, and Chipset
- Publication number 20220416835
- Publication date Dec 29, 2022
- Huawei Technologies Co., Ltd
- Di Li
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Multi-Band Radio Frequency Front-End Device, Multi-Band Receiver, a...
- Publication number 20210328606
- Publication date Oct 21, 2021
- Huawei Technologies Co., Ltd
- Keji Cui
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Printed circuit board having improved solder pad layout
- Publication number 20060102700
- Publication date May 18, 2006
- HON HAI Precision Industry CO., LTD.
- Ya-ling Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Multi-band radio frequency front-end device, multi-band receiver, a...

Multi-band radio frequency front-end device, multi-band receiver, a...

Patents Applicationslast 30 patents

Multi-Band Low Noise Amplifier, Phased Array, and Electronic Device

Phased Array and Electronic Device

Multi-Band Radio Frequency Front-End Device, Multi-Band Receiver, a...

GUIDE WHEEL MOUNTING BASE, GUIDE DEVICE HAVING SAME, AND RAIL VEHICLE

Transceiver Apparatus, Wireless Communication Apparatus, and Chipset

Multi-Band Radio Frequency Front-End Device, Multi-Band Receiver, a...

Printed circuit board having improved solder pad layout