Dian-Hau Chen

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Structure and method for MRAM devices having spacer element
- Patent number 12,201,031
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Ku Shen
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor arrangement and method of making
- Patent number 12,191,248
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wan-Yu Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for integrating MRAM and logic devices
- Patent number 12,193,336
- Issue date Jan 7, 2025
- TAIWAN SEMICONDUCTOE MANUFACTURING COMPANY, LTD.
- Hsiang-Ku Shen
Information Patent Grant
Semiconductor device having a metal pad and a protective layer for...
- Patent number 12,183,697
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic random access memory and manufacturing method thereof
- Patent number 12,133,469
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Chieh Hsiao
- G11 - INFORMATION STORAGE
Information Patent Grant
Metal plate corner structure on metal insulator metal
- Patent number 12,107,041
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of cracks in passivation layer
- Patent number 12,087,714
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-An Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device structure with a redistribution layer and a buffer layer
- Patent number 12,080,753
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic tunnel junction device and method of forming the same
- Patent number 12,082,510
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
Information Patent Grant
Structure and method for MRAM devices
- Patent number 12,063,790
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Fan Huang
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 12,057,445
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip structure with conductive structure
- Patent number 12,057,419
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistor structure
- Patent number 12,027,574
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure with memory device
- Patent number 12,010,924
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Pin Chiu
Information Patent Grant
Structure and method for MRAM devices
- Patent number 12,004,431
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Chieh Hsiao
Information Patent Grant
Low-stress passivation layer
- Patent number 11,996,356
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end-of-line passive device structure
- Patent number 11,990,401
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layers and methods of fabricating the same in semico...
- Patent number 11,967,573
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal structure
- Patent number 11,961,880
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and method of manufacturing the same
- Patent number 11,950,432
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Ku Shen
- G11 - INFORMATION STORAGE
Information Patent Grant
MRAM structure for balanced loading
- Patent number 11,937,515
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
Information Patent Grant
Metal-insulator-metal structure and methods of fabrication thereof
- Patent number 11,923,405
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding structures
- Patent number 11,855,022
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor electrode
- Patent number 11,855,132
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-Insulator-Metal structure
- Patent number 11,842,959
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistor structure
- Patent number 11,791,371
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic memory cell with low-resistive electrode via and method of...
- Patent number 11,778,918
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiang-Ku Shen
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor devices and method of forming the same
- Patent number 11,744,084
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal (MIM) capacitor structure
- Patent number 11,728,375
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal plate corner structure on metal insulator metal
- Patent number 11,728,262
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VIA ARRAY IN A REDISTRIBUTION LAYER STRUCTURE FOR STRESS RELIEF
- Publication number 20250015007
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedding Metal-Insulator-Metal Structure In Silicon Oxide In A Cop...
- Publication number 20240429156
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yueh Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF
- Publication number 20240421065
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yueh CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM Capacitor in IC Heterogenous Integration
- Publication number 20240421063
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH ELECTRODE LAYER AND METHOD FOR...
- Publication number 20240413193
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Tzu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA AND METHOD FOR FORMING THE SAME
- Publication number 20240405069
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...
- Publication number 20240404853
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dian-Hau CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING THROUGH VIA AND METHOD OF FABRICATING T...
- Publication number 20240395619
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Yu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREOF
- Publication number 20240397830
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsin YANG
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING MAGNETIC RANDOM ACCESS MEMORY
- Publication number 20240397829
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF FORMING OPENING IN PASSIVATION LAYER AND STRUCTURES THEREOF
- Publication number 20240395741
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hao SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240389466
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Fan Huang
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING
- Publication number 20240387354
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wan-Yu Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387617
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for MRAM Devices with a Slot Via
- Publication number 20240386932
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Fan Huang
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICES
- Publication number 20240389358
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PLATE CORNER STRUCTURE ON METAL INSULATOR METAL
- Publication number 20240379529
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF CRACKS IN PASSIVATION LAYER
- Publication number 20240379593
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-An Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240379734
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE WI...
- Publication number 20240379361
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chuan SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE REGION PATTERNING
- Publication number 20240379675
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END-OF-LINE PASSIVE DEVICE STRUCTURE
- Publication number 20240379531
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240371920
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC TUNNEL JUNCTION DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240373758
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Fan Huang
Information Patent Application
STRUCTURE AND METHOD FOR MRAM DEVICES
- Publication number 20240365564
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Fan Huang
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20240355813
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Tzu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER AND METHODS OF FABRICATION THEREOF
- Publication number 20240355672
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zhen De MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING METAL ION BARRIER LAYERS AND RESULTING STRUCTURES
- Publication number 20240355766
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH CONDUCTIVE LAYER
- Publication number 20240347488
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Fan HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TEST PAD
- Publication number 20240329113
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Pin Chiu
- G01 - MEASURING TESTING

Dian-Hau Chen

Person

Patents Grantslast 30 patents

Structure and method for MRAM devices having spacer element

Semiconductor arrangement and method of making

Structure and method for integrating MRAM and logic devices

Semiconductor device having a metal pad and a protective layer for...

Magnetic random access memory and manufacturing method thereof

Metal plate corner structure on metal insulator metal

Reduction of cracks in passivation layer

Device structure with a redistribution layer and a buffer layer

Magnetic tunnel junction device and method of forming the same

Structure and method for MRAM devices

Method of manufacturing a semiconductor device and a semiconductor...

Method for forming chip structure with conductive structure

Resistor structure

Method for manufacturing semiconductor structure with memory device

Structure and method for MRAM devices

Low-stress passivation layer

Back-end-of-line passive device structure

Redistribution layers and methods of fabricating the same in semico...

Metal-insulator-metal structure

Semiconductor packages and method of manufacturing the same

MRAM structure for balanced loading

Metal-insulator-metal structure and methods of fabrication thereof

Shielding structures

Multilayer capacitor electrode

Metal-Insulator-Metal structure

Resistor structure

Magnetic memory cell with low-resistive electrode via and method of...

Semiconductor devices and method of forming the same

Metal-insulator-metal (MIM) capacitor structure

Metal plate corner structure on metal insulator metal

Patents Applicationslast 30 patents

VIA ARRAY IN A REDISTRIBUTION LAYER STRUCTURE FOR STRESS RELIEF

Embedding Metal-Insulator-Metal Structure In Silicon Oxide In A Cop...

METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF

MIM Capacitor in IC Heterogenous Integration

SEMICONDUCTOR DEVICE STRUCTURE WITH ELECTRODE LAYER AND METHOD FOR...

THROUGH-SUBSTRATE VIA AND METHOD FOR FORMING THE SAME

REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...

SEMICONDUCTOR DEVICE HAVING THROUGH VIA AND METHOD OF FABRICATING T...

MAGNETIC RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES INCLUDING MAGNETIC RANDOM ACCESS MEMORY

METHOD OF FORMING OPENING IN PASSIVATION LAYER AND STRUCTURES THEREOF

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING

SEMICONDUCTOR DEVICE

Structure and Method for MRAM Devices with a Slot Via

METHOD OF FORMING SEMICONDUCTOR DEVICES

METAL PLATE CORNER STRUCTURE ON METAL INSULATOR METAL

REDUCTION OF CRACKS IN PASSIVATION LAYER

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE WI...

ACTIVE REGION PATTERNING

BACK-END-OF-LINE PASSIVE DEVICE STRUCTURE

DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

MAGNETIC TUNNEL JUNCTION DEVICE AND METHOD OF FORMING THE SAME

STRUCTURE AND METHOD FOR MRAM DEVICES

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

REDISTRIBUTION LAYER AND METHODS OF FABRICATION THEREOF

METHODS OF FORMING METAL ION BARRIER LAYERS AND RESULTING STRUCTURES

CHIP STRUCTURE WITH CONDUCTIVE LAYER

WAFER TEST PAD