Dietmar Birgel

Person

Schopfheim, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Component that can be soldered in SMD technology and method for pro...
- Patent number 11,901,149
- Issue date Feb 13, 2024
- ENDRESS+HAUSER SE+CO.KG
- Bernd Strütt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a high-temperature resistant lead free solder...
- Patent number 11,772,179
- Issue date Oct 3, 2023
- ENDRESS+HAUSER SE+CO.KG
- Elke Schmidt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for positioning circuit boards and circuit board arrangement
- Patent number 10,721,818
- Issue date Jul 21, 2020
- ENDRESS+HAUSER SE+CO.KG
- Romuald Girardey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting a component to a support via soldering and co...
- Patent number 10,099,318
- Issue date Oct 16, 2018
- ENDRESS+HAUSER SE+CO.KG
- Andreas Rossberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with at least one electronic component
- Patent number 7,304,247
- Issue date Dec 4, 2007
- Endress + Hauser GmbH + Co. KG
- Dietmar Birgel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromechanical converter comprising at least one piezoelectric e...
- Patent number 7,061,165
- Issue date Jun 13, 2006
- Endress & Hauser GmbH & Co. KG
- Sergej Lopatin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electromechanical transducer
- Patent number 6,946,779
- Issue date Sep 20, 2005
- Endress & Hauser GmbH + Co. KG
- Dietmar Birgel
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Printed circuit board comprising a contact sleeve that is mounted t...
- Patent number 6,881,906
- Issue date Apr 19, 2005
- Endress + Hauser GmbH + Co. KG
- Dietmar Birgel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with an electronic component and a method for produci...
- Patent number 6,437,989
- Issue date Aug 20, 2002
- Endress + Hauser GmbH + Co.
- Sergej Lopatin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for determining the filling level of a filling material in a...
- Patent number 6,266,022
- Issue date Jul 24, 2001
- Endress + Hauser GmbH + Co.
- Roland Müller
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
COMPONENT THAT CAN BE SOLDERED IN SMD TECHNOLOGY AND METHOD FOR PRO...
- Publication number 20220301802
- Publication date Sep 22, 2022
- Endress+Hauser SE+Co. KG
- Bernd Strütt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A HIGH-TEMPERATURE RESISTANT LEAD FREE SOLDER...
- Publication number 20210268593
- Publication date Sep 2, 2021
- Endress+Hauser SE+Co. KG
- Elke Schmidt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR POSITIONING CIRCUIT BOARDS AND CIRCUIT BOARD ARRANGEMENT
- Publication number 20190124770
- Publication date Apr 25, 2019
- Endress+Hauser SE+Co. KG
- Romuald Girardey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CONNECTING A COMPONENT TO A SUPPORT VIA SOLDERING AND CO...
- Publication number 20150183061
- Publication date Jul 2, 2015
- Endress + Hauser GmbH + Co.KG
- Andreas Rossberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board With Holding Mechanism For Holding Wired Electronic C...
- Publication number 20070212901
- Publication date Sep 13, 2007
- Endress + Hauser GmbH + Co.KG
- Dietmar Birgel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board With At Least One Connection Bore For A Connection Wi...
- Publication number 20070212934
- Publication date Sep 13, 2007
- Endress + Hauser GmbH + Co. KG
- Dietmar Birgel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board with SMD-components and at least one wired component,...
- Publication number 20060037778
- Publication date Feb 23, 2006
- Endress + Hauser GmbH + Co.KG
- Dietmar Birgel
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for fitting out and soldering a circuit board, reflow oven a...
- Publication number 20050161252
- Publication date Jul 28, 2005
- Dietmar Birgel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board with at least one electronic component
- Publication number 20050006140
- Publication date Jan 13, 2005
- Dietmar Birgel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electromechanical converter comprising at least one piezoelectric e...
- Publication number 20040145280
- Publication date Jul 29, 2004
- Sergej Lopatin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Printed circuit board comprising a contact sleeve that is mounted t...
- Publication number 20040140123
- Publication date Jul 22, 2004
- Dietmar Birgel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electromechanical transducer
- Publication number 20030168945
- Publication date Sep 11, 2003
- Dietmar Birgel
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Dietmar Birgel

Person

Patents Grantslast 30 patents

Component that can be soldered in SMD technology and method for pro...

Method for producing a high-temperature resistant lead free solder...

Method for positioning circuit boards and circuit board arrangement

Method for connecting a component to a support via soldering and co...

Circuit board with at least one electronic component

Electromechanical converter comprising at least one piezoelectric e...

Electromechanical transducer

Printed circuit board comprising a contact sleeve that is mounted t...

Circuit board with an electronic component and a method for produci...

Device for determining the filling level of a filling material in a...

Patents Applicationslast 30 patents

COMPONENT THAT CAN BE SOLDERED IN SMD TECHNOLOGY AND METHOD FOR PRO...

METHOD FOR PRODUCING A HIGH-TEMPERATURE RESISTANT LEAD FREE SOLDER...

METHOD FOR POSITIONING CIRCUIT BOARDS AND CIRCUIT BOARD ARRANGEMENT

METHOD FOR CONNECTING A COMPONENT TO A SUPPORT VIA SOLDERING AND CO...

Circuit Board With Holding Mechanism For Holding Wired Electronic C...

Circuit Board With At Least One Connection Bore For A Connection Wi...

Circuit board with SMD-components and at least one wired component,...

Method for fitting out and soldering a circuit board, reflow oven a...

Circuit board with at least one electronic component

Electromechanical converter comprising at least one piezoelectric e...

Printed circuit board comprising a contact sleeve that is mounted t...

Electromechanical transducer