Dilan Seneviratne

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded die microelectronic device with molded component
- Patent number 12,087,700
- Issue date Sep 10, 2024
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with embedded interconnects
- Patent number 11,942,406
- Issue date Mar 26, 2024
- Intel Corporation
- Kyu Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface finishes with low RBTV for fine and mixed bump pitch archit...
- Patent number 11,935,857
- Issue date Mar 19, 2024
- Intel Corporation
- Kristof Darmawaikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass dielectric layer with patterning
- Patent number 11,780,210
- Issue date Oct 10, 2023
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 11,737,208
- Issue date Aug 22, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of embedded thin-film resistors for semiconduc...
- Patent number 11,728,265
- Issue date Aug 15, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin dielectric films using photo up-conversion for applicati...
- Patent number 11,670,504
- Issue date Jun 6, 2023
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-embedded thin-film capacitors, package-integral magnetic in...
- Patent number 11,637,171
- Issue date Apr 25, 2023
- Intel Corporation
- Shivasubramanian Balasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating an RF filter on a semiconductor package using selective...
- Patent number 11,605,867
- Issue date Mar 14, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric film with pressure sensitive microcapsules of adhesion p...
- Patent number 11,571,876
- Issue date Feb 7, 2023
- Intel Corporation
- Praneeth Akkinepally
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Surface finishes with low rBTV for fine and mixed bump pitch archit...
- Patent number 11,488,918
- Issue date Nov 1, 2022
- Intel Corporation
- Kristof Darmawaikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with embedded interconnects
- Patent number 11,393,745
- Issue date Jul 19, 2022
- Intel Corporation
- Kyu Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-integrated vertical capacitors and methods of assembling same
- Patent number 11,296,186
- Issue date Apr 5, 2022
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating an RF filter on a semiconductor package using selective...
- Patent number 11,081,768
- Issue date Aug 3, 2021
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die microelectronic device with molded component
- Patent number 11,081,448
- Issue date Aug 3, 2021
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package that includes lamination layer
- Patent number 10,985,080
- Issue date Apr 20, 2021
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible packaging for a wearable electronic device
- Patent number 10,820,437
- Issue date Oct 27, 2020
- Intel Corporation
- Aleksandar Aleksov
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for making a flexible wearable circuit
- Patent number 10,798,817
- Issue date Oct 6, 2020
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-embedded thin-film capacitors, package-integral magnetic in...
- Patent number 10,756,161
- Issue date Aug 25, 2020
- Intel Corporation
- Shivasubramanian Balasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded circuit patterning feature selective electroless
- Patent number 10,586,715
- Issue date Mar 10, 2020
- Intel Corporation
- Yonggang Yong Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Package-integrated vertical capacitors and methods of assembling same
- Patent number 10,546,916
- Issue date Jan 28, 2020
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable electronic assembly
- Patent number 10,327,330
- Issue date Jun 18, 2019
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metallization of an integrated circuit (IC) substrate
- Patent number 10,290,557
- Issue date May 14, 2019
- Intel Corporation
- Brandon C. Marin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bendable and stretchable electronic devices and methods
- Patent number 10,204,855
- Issue date Feb 12, 2019
- Intel Corporation
- Alejandro Levander
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Build-up high-aspect ratio opening
- Patent number 10,111,338
- Issue date Oct 23, 2018
- Intel Corporation
- Frank Truong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible microelectronic systems and methods of fabricating the same
- Patent number 10,103,037
- Issue date Oct 16, 2018
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of dielectric with smooth surface
- Patent number 10,070,537
- Issue date Sep 4, 2018
- Intel Corporation
- Deepak Arora
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Raster-planarized substrate interlayers and methods of planarizing...
- Patent number 10,068,776
- Issue date Sep 4, 2018
- Intel Corporation
- Frank Truong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with passivated interconnects
- Patent number 10,043,740
- Issue date Aug 7, 2018
- Intel Coporation
- Sri Ranga Sai Boyapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate having an interfacial layer
- Patent number 9,799,593
- Issue date Oct 24, 2017
- Intel Corporation
- Whitney Michael Bryks
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIQUID-BASED METHOD FOR EMBEDDING COMPONENTS IN THICK SUBSTRATES
- Publication number 20250218881
- Publication date Jul 3, 2025
- Intel Corporation
- Mahdi MOHAMMADIGHALENI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED GLASS PATCH WITH INTE...
- Publication number 20250218955
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR A STACK OF COMPONENTS EMBEDDED IN A SUBSTRATE CORE
- Publication number 20250218962
- Publication date Jul 3, 2025
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DEEP TRENCH CAPACITORS IN INTEGRATED CIRCUIT DEVICE PACKAG...
- Publication number 20250218929
- Publication date Jul 3, 2025
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR MEMORY AND POWER COMPONENTS EMBEDDED IN A SUBSTRAT...
- Publication number 20250219041
- Publication date Jul 3, 2025
- Intel Corporation
- Whitney M. Bryks
- G11 - INFORMATION STORAGE
Information Patent Application
PASSIVATION BOUNDARY DEFECTS FOR REDUCED LEAKAGE CURRENT CAPACITOR...
- Publication number 20250210506
- Publication date Jun 26, 2025
- Intel Corporation
- Kihyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES
- Publication number 20250210426
- Publication date Jun 26, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES
- Publication number 20250192059
- Publication date Jun 12, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...
- Publication number 20250183182
- Publication date Jun 5, 2025
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS LINERS FOR THROUGH-GLASS VIAS AND ASSOCIATED METHODS
- Publication number 20250132239
- Publication date Apr 24, 2025
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Publication number 20250112136
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS MITIGATION ARCHITECTURES FOR GLASS CORE SUBSTRATES
- Publication number 20250112140
- Publication date Apr 3, 2025
- Intel Corporation
- Rahul BHURE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED PORO...
- Publication number 20250006623
- Publication date Jan 2, 2025
- Intel Corporation
- Shuqi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN P...
- Publication number 20240222295
- Publication date Jul 4, 2024
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES
- Publication number 20240217216
- Publication date Jul 4, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- B32 - LAYERED PRODUCTS
Information Patent Application
IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS
- Publication number 20240222211
- Publication date Jul 4, 2024
- Intel Corporation
- Peumie Abeyratne Kuragama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR LAMINATING A FILM ON A SUBSTRATE
- Publication number 20240173953
- Publication date May 30, 2024
- Intel Corporation
- Joshua STACEY
- B32 - LAYERED PRODUCTS
Information Patent Application
PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES
- Publication number 20240113049
- Publication date Apr 4, 2024
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS POLYMER DIELECTRIC LAYER ON CORE
- Publication number 20240113009
- Publication date Apr 4, 2024
- Intel Corporation
- Whitney Bryks
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE I...
- Publication number 20240112999
- Publication date Apr 4, 2024
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR COATING METHOD
- Publication number 20240105476
- Publication date Mar 28, 2024
- Intel Corporation
- Whitney BRYKS
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
THIN FILM CAPACITORS
- Publication number 20240096561
- Publication date Mar 21, 2024
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUILD UP MATERIAL ARCHITECTURE FOR MICROELECTRONIC PACKAGE DEVICE
- Publication number 20240006296
- Publication date Jan 4, 2024
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUB...
- Publication number 20230420348
- Publication date Dec 28, 2023
- Intel Corporation
- Jieying KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS DIELECTRIC LAYER WITH PATTERNING
- Publication number 20230405976
- Publication date Dec 21, 2023
- Intel Corporation
- Jieying KONG
- B32 - LAYERED PRODUCTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFE...
- Publication number 20230345621
- Publication date Oct 26, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS ARREST LIP ON COPPER PAD FOR LOW ROUGHNESS COPPER
- Publication number 20230207503
- Publication date Jun 29, 2023
- Intel Corporation
- Jieying KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL WAVEGUIDE FORMED WITHIN IN A GLASS LAYER
- Publication number 20230091834
- Publication date Mar 23, 2023
- Intel Corporation
- Bainye Francoise ANGOUA
- G02 - OPTICS
Information Patent Application
OPTICAL WAVEGUIDE EDGE COUPLING WITHIN A SUBSTRATE
- Publication number 20230090863
- Publication date Mar 23, 2023
- Intel Corporation
- Dilan SENEVIRATNE
- G02 - OPTICS
Information Patent Application
DOUBLE-SIDED GLASS SUBSTRATE WITH A HYBRID BONDED PHOTONIC INTEGRAT...
- Publication number 20230086881
- Publication date Mar 23, 2023
- Intel Corporation
- Whitney BRYKS
- G02 - OPTICS

Dilan Seneviratne

Person

Patents Grantslast 30 patents

Embedded die microelectronic device with molded component

Semiconductor packages with embedded interconnects

Surface finishes with low RBTV for fine and mixed bump pitch archit...

Glass dielectric layer with patterning

Microelectronic assemblies having conductive structures with differ...

Selective deposition of embedded thin-film resistors for semiconduc...

Ultra-thin dielectric films using photo up-conversion for applicati...

Package-embedded thin-film capacitors, package-integral magnetic in...

Fabricating an RF filter on a semiconductor package using selective...

Dielectric film with pressure sensitive microcapsules of adhesion p...

Surface finishes with low rBTV for fine and mixed bump pitch archit...

Semiconductor packages with embedded interconnects

Package-integrated vertical capacitors and methods of assembling same

Fabricating an RF filter on a semiconductor package using selective...

Embedded die microelectronic device with molded component

Electronic package that includes lamination layer

Flexible packaging for a wearable electronic device

Method for making a flexible wearable circuit

Package-embedded thin-film capacitors, package-integral magnetic in...

Embedded circuit patterning feature selective electroless

Package-integrated vertical capacitors and methods of assembling same

Stretchable electronic assembly

Selective metallization of an integrated circuit (IC) substrate

Bendable and stretchable electronic devices and methods

Build-up high-aspect ratio opening

Flexible microelectronic systems and methods of fabricating the same

Formation of dielectric with smooth surface

Raster-planarized substrate interlayers and methods of planarizing...

Package with passivated interconnects

Semiconductor package substrate having an interfacial layer

Patents Applicationslast 30 patents

LIQUID-BASED METHOD FOR EMBEDDING COMPONENTS IN THICK SUBSTRATES

MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED GLASS PATCH WITH INTE...

TECHNOLOGIES FOR A STACK OF COMPONENTS EMBEDDED IN A SUBSTRATE CORE

EMBEDDED DEEP TRENCH CAPACITORS IN INTEGRATED CIRCUIT DEVICE PACKAG...

TECHNOLOGIES FOR MEMORY AND POWER COMPONENTS EMBEDDED IN A SUBSTRAT...

PASSIVATION BOUNDARY DEFECTS FOR REDUCED LEAKAGE CURRENT CAPACITOR...

MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES

EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES

MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...

POROUS LINERS FOR THROUGH-GLASS VIAS AND ASSOCIATED METHODS

GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS

STRESS MITIGATION ARCHITECTURES FOR GLASS CORE SUBSTRATES

FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED PORO...

STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN P...

ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES

IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS

METHOD AND APPARATUS FOR LAMINATING A FILM ON A SUBSTRATE

PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES

POROUS POLYMER DIELECTRIC LAYER ON CORE

LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE I...

SYSTEM FOR COATING METHOD

THIN FILM CAPACITORS

BUILD UP MATERIAL ARCHITECTURE FOR MICROELECTRONIC PACKAGE DEVICE

SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUB...

GLASS DIELECTRIC LAYER WITH PATTERNING

MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFE...

STRESS ARREST LIP ON COPPER PAD FOR LOW ROUGHNESS COPPER

OPTICAL WAVEGUIDE FORMED WITHIN IN A GLASS LAYER

OPTICAL WAVEGUIDE EDGE COUPLING WITHIN A SUBSTRATE

DOUBLE-SIDED GLASS SUBSTRATE WITH A HYBRID BONDED PHOTONIC INTEGRAT...