Diong-Hing Ding

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Penang, MY

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming solder joints for a flip chip assembly
- Patent number 7,601,612
- Issue date Oct 13, 2009
- GLOBALFOUNDRIES Inc.
- Raj N. Master
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating reliable laminate flip-chip assembly
- Patent number 6,632,690
- Issue date Oct 14, 2003
- Advanced Micro Devices, Inc.
- Raj N. Master
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Minimizing flux residue by controlling amount of moisture during re...
- Patent number 6,409,070
- Issue date Jun 25, 2002
- Advanced Micro Devices, Inc.
- Raj N. Master
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method of fabricating reliable laminate flip-chip assembly
- Publication number 20030077852
- Publication date Apr 24, 2003
- Advanced Micro Devices, Inc.
- Raj N. Master
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR