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Dirk D. Brown
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Sunnyvale, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Self-aligned semiconductor interconnect barrier and manufacturing m...
Patent number
6,734,559
Issue date
May 11, 2004
Advanced Micro Devices, Inc.
Kai Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High capacity memory module with built-in performance enhancing fea...
Patent number
6,661,690
Issue date
Dec 9, 2003
High Connection Density, Inc.
Sharon L. Moriarty
G11 - INFORMATION STORAGE
Information
Patent Grant
Manufacturing method for semiconductor metalization barrier
Patent number
6,344,410
Issue date
Feb 5, 2002
Advanced Micro Devices, Inc.
Sergey D. Lopatin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for simultaneously improving the electromigrat...
Patent number
6,306,732
Issue date
Oct 23, 2001
Advanced Micro Devices, Inc.
Dirk D. Brown
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Damascene metal interconnects using highly directional deposition o...
Patent number
6,281,121
Issue date
Aug 28, 2001
Advanced Micro Devices, Inc.
Dirk Dewar Brown
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming semiconductor seed layers by high bias deposition
Patent number
6,261,946
Issue date
Jul 17, 2001
Advanced Micro Devices, Inc.
John A. Iacoponi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dielectric adhesion enhancement in damascene process for semiconduc...
Patent number
6,251,772
Issue date
Jun 26, 2001
Advanced Micro Devicees, Inc.
Dirk Brown
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual barrier and conductor deposition in a dual damascene process f...
Patent number
6,239,021
Issue date
May 29, 2001
Advanced Micro Devices, Inc.
Shekhar Pramanick
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming semiconductor seed layers by inert gas sputter e...
Patent number
6,228,754
Issue date
May 8, 2001
Advanced Micro Devices, Inc.
John A. Iacoponi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-stage method for forming optimized semiconductor seed layers
Patent number
6,187,670
Issue date
Feb 13, 2001
Advanced Micro Devices, Inc.
Dirk Brown
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High capacity memory module with built-in-high-speed bus terminations
Patent number
6,172,895
Issue date
Jan 9, 2001
High Connector Density, Inc.
Dirk D. Brown
G11 - INFORMATION STORAGE
Information
Patent Grant
Dual barrier and conductor deposition in a dual damascene process f...
Patent number
6,147,404
Issue date
Nov 14, 2000
Advanced Micro Devices, Inc.
Shekhar Pramanick
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming in-situ implanted semiconductor barrier layers
Patent number
6,146,993
Issue date
Nov 14, 2000
Advanced Micro Devices, Inc.
Dirk Brown
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor metalization barrier
Patent number
6,144,099
Issue date
Nov 7, 2000
Advanced Micro Devices, Inc.
Sergey D. Lopatin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor interconnect interface processing by pulse laser anneal
Patent number
6,143,650
Issue date
Nov 7, 2000
Advanced Micro Devices, Inc.
Shekhar Pramanick
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming conformal barrier layers
Patent number
6,124,203
Issue date
Sep 26, 2000
Advanced Micro Devices, Inc.
Young-Chang Joo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a void free copper interconnects
Patent number
6,121,141
Issue date
Sep 19, 2000
Advanced Micro Devices, Inc.
Christy Mei-Chu Woo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for implanting semiconductor conductive layers
Patent number
6,117,770
Issue date
Sep 12, 2000
Advanced Micro Devices, Inc.
Shekhar Pramanick
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of improving Cu damascene interconnect reliability by laser...
Patent number
6,103,624
Issue date
Aug 15, 2000
Advanced Micro Devices, Inc.
Takeshi Nogami
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor interconnect interface processing by high pressure de...
Patent number
6,080,669
Issue date
Jun 27, 2000
Advanced Micro Devices, Inc.
John A. Iacoponi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating protected copper metallization
Patent number
6,066,557
Issue date
May 23, 2000
Advanced Micro Devices, Inc.
Todd P. Lukanc
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating dual layer protective barrier copper metalli...
Patent number
6,059,940
Issue date
May 9, 2000
Advanced Micro Devices, Inc.
Takeshi Nogami
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Copper interconnect methodology for enhanced electromigration resis...
Patent number
6,022,808
Issue date
Feb 8, 2000
Advanced Micro Devices, Inc.
Takeshi Nogami
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
HIGH CAPACITY MEMORY MODULE WITH BUILT-IN PERFORMANCE ENHANCING FEA...
Publication number
20030156443
Publication date
Aug 21, 2003
Sharon L. Moriarty
G11 - INFORMATION STORAGE